KR101067996B1 - 선폭 측정 장치의 검사 방법 - Google Patents
선폭 측정 장치의 검사 방법 Download PDFInfo
- Publication number
- KR101067996B1 KR101067996B1 KR1020107003227A KR20107003227A KR101067996B1 KR 101067996 B1 KR101067996 B1 KR 101067996B1 KR 1020107003227 A KR1020107003227 A KR 1020107003227A KR 20107003227 A KR20107003227 A KR 20107003227A KR 101067996 B1 KR101067996 B1 KR 101067996B1
- Authority
- KR
- South Korea
- Prior art keywords
- measurement
- stage
- interpolation
- focusing
- substrate
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
- G01B21/045—Correction of measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007242361A JP5096852B2 (ja) | 2007-09-19 | 2007-09-19 | 線幅測定装置および線幅測定装置の検査方法 |
JPJP-P-2007-242361 | 2007-09-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100034038A KR20100034038A (ko) | 2010-03-31 |
KR101067996B1 true KR101067996B1 (ko) | 2011-09-26 |
Family
ID=40467701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020107003227A KR101067996B1 (ko) | 2007-09-19 | 2008-03-07 | 선폭 측정 장치의 검사 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5096852B2 (ja) |
KR (1) | KR101067996B1 (ja) |
WO (1) | WO2009037875A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012111603A1 (ja) * | 2011-02-17 | 2012-08-23 | シャープ株式会社 | 線幅測定装置 |
US9080865B2 (en) | 2012-12-27 | 2015-07-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Orthogonality compensation method for length measurement device and length measurement device using same |
CN103075970B (zh) * | 2012-12-27 | 2015-07-01 | 深圳市华星光电技术有限公司 | 测长装置直交度补偿方法及使用该方法的测长装置 |
US9110039B2 (en) * | 2013-07-25 | 2015-08-18 | Kla-Tencor Corporation | Auto-focus system and methods for die-to-die inspection |
CN103837085B (zh) * | 2014-03-07 | 2016-07-06 | 哈尔滨工业大学 | 基于激光跟踪仪逐点标定的目标位移矢量测量装置及方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002228411A (ja) | 2001-02-05 | 2002-08-14 | Hitachi Kokusai Electric Inc | 二次元測定装置 |
JP2006179532A (ja) | 2004-12-20 | 2006-07-06 | Disco Abrasive Syst Ltd | 焦点調整方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004294358A (ja) * | 2003-03-28 | 2004-10-21 | Hitachi High-Technologies Corp | 欠陥検査方法および装置 |
JP4119788B2 (ja) * | 2003-05-23 | 2008-07-16 | 三菱重工業株式会社 | 形状計測システム及び方法 |
JP2007121981A (ja) * | 2005-09-30 | 2007-05-17 | Matsushita Electric Ind Co Ltd | 基板検査方法 |
-
2007
- 2007-09-19 JP JP2007242361A patent/JP5096852B2/ja active Active
-
2008
- 2008-03-07 WO PCT/JP2008/054163 patent/WO2009037875A1/ja active Application Filing
- 2008-03-07 KR KR1020107003227A patent/KR101067996B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002228411A (ja) | 2001-02-05 | 2002-08-14 | Hitachi Kokusai Electric Inc | 二次元測定装置 |
JP2006179532A (ja) | 2004-12-20 | 2006-07-06 | Disco Abrasive Syst Ltd | 焦点調整方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5096852B2 (ja) | 2012-12-12 |
KR20100034038A (ko) | 2010-03-31 |
JP2009074849A (ja) | 2009-04-09 |
WO2009037875A1 (ja) | 2009-03-26 |
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