KR101048920B1 - 반도체웨이퍼의 불필요물 제거방법 및 이것을 이용한 장치 - Google Patents
반도체웨이퍼의 불필요물 제거방법 및 이것을 이용한 장치 Download PDFInfo
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- KR101048920B1 KR101048920B1 KR1020040116617A KR20040116617A KR101048920B1 KR 101048920 B1 KR101048920 B1 KR 101048920B1 KR 1020040116617 A KR1020040116617 A KR 1020040116617A KR 20040116617 A KR20040116617 A KR 20040116617A KR 101048920 B1 KR101048920 B1 KR 101048920B1
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- Prior art keywords
- peeling
- tape
- semiconductor wafer
- wafer
- unnecessary
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 41
- 230000001681 protective effect Effects 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 48
- 235000012431 wafers Nutrition 0.000 claims description 176
- 238000011084 recovery Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 206010040844 Skin exfoliation Diseases 0.000 description 168
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
- B29C63/0013—Removing old coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
- 반도체웨이퍼 위에 박리테이프를 접착하고, 상기 박리테이프를 박리함으로써 반도체웨이퍼 위의 불필요물을 박리테이프와 일체로 박리하는 반도체웨이퍼의 불필요물 제거방법으로서,반도체웨이퍼 위에 박리테이프를 접착하여 박리하는 박리시작단 부분에서, 엣지부재의 선단부를 박리테이프의 표면에 밀어붙여 반도체웨이퍼 위에 접착하는 과정과;상기 반도체웨이퍼에 박리테이프를 접착하는 과정에서 박리테이프를 접착한 후, 엣지부재를 상승시켜 엣지부재의 밀어붙임을 해제하면서 박리테이프를 박리종료단 부분까지 박리하는 과정과;상기 박리종료단 부분에서 엣지부재를 하강시켜 상기 반도체웨이퍼 측으로 밀어붙여, 그 뒤의 박리종료 부분을 박리하는 과정; 을 포함하는 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거방법.
- 제 1항에 있어서,상기 엣지부재의 선단부의 접촉을 해제하는 과정에서는, 엣지부재의 선단부가 소정의 각도를 유지한 상태에서 박리테이프와의 접촉을 해제하는 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거방법.
- 제 1항에 있어서,상기 박리시작단 부분에서는, 엣지부재의 이동속도를 느리게 하는 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거방법.
- 제 1항에 있어서,상기 박리테이프의 송출속도는, 상기 엣지부재의 이동속도와 같게 되어 있는 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거방법.
- 제 1항에 있어서,상기 박리테이프는, 소정의 장력이 주어지면서 송출되는 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거방법.
- 제 1항에 있어서,상기 박리종료단 부분에서의 박리테이프의 접착길이는, 상기 반도체웨이퍼의 직경의 10% 이하인 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거방법.
- 제 1항에 있어서,상기 불필요물은, 상기 반도체웨이퍼의 표면에 접착된 표면보호테이프인 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거방법.
- 제 1항에 있어서,상기 불필요물은, 상기 반도체웨이퍼의 표면에 형성된 레지스트막인 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거방법.
- 반도체웨이퍼 위에 박리테이프를 접착하고, 상기 박리테이프를 박리함으로써 반도체웨이퍼 위의 불필요물을 박리테이프와 일체로 박리하는 반도체웨이퍼의 불필요물 제거장치로서, 상기 장치는,상기 반도체웨이퍼를 소정의 공정으로 반송하는 반송기구;상기 박리테이프를 반도체웨이퍼 위에 접착하도록 반도체웨이퍼의 위치맞춤을 행하는 얼라인먼트 스테이지:위치맞춤된 상기 반도체웨이퍼를 유지하는 척 테이블;유지된 상기 반도체웨이퍼를 향해 박리테이프를 공급하는 테이프 공급부;공급된 상기 박리테이프의 표면을 엣지부재의 선단부에서 밀어붙여 상기 반도체웨이퍼 위의 불필요물에 접착함과 아울러, 상기 박리테이프를 박리함으로써 상기 불필요물과 박리테이프를 일체로 하여 박리하는 테이프 박리수단;박리된 불필요한 상기 박리테이프를 회수하는 테이프 회수부;상기 박리테이프가 접착되어 박리하는 박리시작단 부분과 박리종료단 부분에서 상기 박리수단의 엣지부재의 선단부를 박리테이프에 밀어붙여 불필요물에 접착하고, 다른 부분에 대해서는, 박리테이프로의 엣지부재의 접촉을 해제하도록 상기 박리수단을 제어하는 제어수단; 을 포함하는 것을 특징으로 하는 반도체웨이퍼의 불필요물 제거장치.
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004001745A JP4592289B2 (ja) | 2004-01-07 | 2004-01-07 | 半導体ウエハの不要物除去方法 |
JPJP-P-2004-00001745 | 2004-01-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050072665A KR20050072665A (ko) | 2005-07-12 |
KR101048920B1 true KR101048920B1 (ko) | 2011-07-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040116617A KR101048920B1 (ko) | 2004-01-07 | 2004-12-30 | 반도체웨이퍼의 불필요물 제거방법 및 이것을 이용한 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7264998B2 (ko) |
JP (1) | JP4592289B2 (ko) |
KR (1) | KR101048920B1 (ko) |
CN (1) | CN100433266C (ko) |
SG (1) | SG113039A1 (ko) |
TW (1) | TWI368268B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4953764B2 (ja) * | 2005-11-29 | 2012-06-13 | 株式会社東京精密 | 剥離テープ貼付方法および剥離テープ貼付装置 |
JP4688728B2 (ja) | 2006-05-19 | 2011-05-25 | 株式会社東京精密 | 表面保護フィルム剥離方法および表面保護フィルム剥離装置 |
KR100741168B1 (ko) * | 2006-07-05 | 2007-07-20 | 주식회사 다이나테크 | 필링바를 이용한 디테이핑 장치 |
KR101053268B1 (ko) * | 2008-12-29 | 2011-08-01 | 윤점채 | 웨이퍼 디테이핑 메카니즘과 그 이용방법 |
JP5249826B2 (ja) * | 2009-03-17 | 2013-07-31 | リンテック株式会社 | シート剥離装置及び剥離方法 |
US8574398B2 (en) | 2010-05-27 | 2013-11-05 | Suss Microtec Lithography, Gmbh | Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers |
JP5554430B2 (ja) * | 2013-03-06 | 2014-07-23 | リンテック株式会社 | シート剥離装置及び剥離方法並びにシート剥離用プレート部材 |
CN104217864A (zh) * | 2014-07-24 | 2014-12-17 | 天津三星电机有限公司 | Mlcc载板的异物清理装置及清理方法 |
JP6628689B2 (ja) * | 2016-05-30 | 2020-01-15 | リンテック株式会社 | シート貼付装置および貼付方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002124494A (ja) * | 2000-08-07 | 2002-04-26 | Nitto Denko Corp | 半導体ウエハの不要物除去方法およびその装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3447518B2 (ja) * | 1996-08-09 | 2003-09-16 | リンテック株式会社 | 接着シート貼付装置および方法 |
SG102690A1 (en) * | 1998-03-13 | 2004-03-26 | Towa Corp | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
US5961766A (en) * | 1998-04-17 | 1999-10-05 | Avery Dennison Corporation | Method for selecting a substrate intended for use in a cutting operation |
CN1260779C (zh) * | 2001-06-11 | 2006-06-21 | 日东电工株式会社 | 从半导体晶片上清除无用物质的方法和装置 |
JP3892703B2 (ja) * | 2001-10-19 | 2007-03-14 | 富士通株式会社 | 半導体基板用治具及びこれを用いた半導体装置の製造方法 |
JP4318471B2 (ja) * | 2003-03-05 | 2009-08-26 | 日東電工株式会社 | 保護テープの貼付・剥離方法 |
SG110108A1 (en) * | 2003-09-24 | 2005-04-28 | Nitto Denko Corp | Method and apparatus for joining adhesive tape |
-
2004
- 2004-01-07 JP JP2004001745A patent/JP4592289B2/ja not_active Expired - Fee Related
- 2004-12-27 SG SG200407943A patent/SG113039A1/en unknown
- 2004-12-30 KR KR1020040116617A patent/KR101048920B1/ko active IP Right Grant
-
2005
- 2005-01-05 TW TW094100216A patent/TWI368268B/zh not_active IP Right Cessation
- 2005-01-06 US US11/029,351 patent/US7264998B2/en not_active Expired - Fee Related
- 2005-01-07 CN CNB2005100040870A patent/CN100433266C/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002124494A (ja) * | 2000-08-07 | 2002-04-26 | Nitto Denko Corp | 半導体ウエハの不要物除去方法およびその装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2005197429A (ja) | 2005-07-21 |
SG113039A1 (en) | 2005-07-28 |
US20050148156A1 (en) | 2005-07-07 |
CN1638054A (zh) | 2005-07-13 |
US7264998B2 (en) | 2007-09-04 |
TW200527528A (en) | 2005-08-16 |
TWI368268B (en) | 2012-07-11 |
CN100433266C (zh) | 2008-11-12 |
KR20050072665A (ko) | 2005-07-12 |
JP4592289B2 (ja) | 2010-12-01 |
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