KR101037121B1 - 증착장치 및 증착방법 - Google Patents
증착장치 및 증착방법 Download PDFInfo
- Publication number
- KR101037121B1 KR101037121B1 KR1020080086172A KR20080086172A KR101037121B1 KR 101037121 B1 KR101037121 B1 KR 101037121B1 KR 1020080086172 A KR1020080086172 A KR 1020080086172A KR 20080086172 A KR20080086172 A KR 20080086172A KR 101037121 B1 KR101037121 B1 KR 101037121B1
- Authority
- KR
- South Korea
- Prior art keywords
- deposition
- vapor deposition
- pipes
- deposition material
- flow rate
- Prior art date
Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 124
- 238000000151 deposition Methods 0.000 claims abstract description 84
- 230000008021 deposition Effects 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 238000001704 evaporation Methods 0.000 claims description 18
- 230000000903 blocking effect Effects 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 2
- 238000000859 sublimation Methods 0.000 claims description 2
- 230000008022 sublimation Effects 0.000 claims description 2
- 150000002894 organic compounds Chemical class 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 52
- 230000008020 evaporation Effects 0.000 description 16
- 238000005401 electroluminescence Methods 0.000 description 15
- 238000001771 vacuum deposition Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (7)
- 증발 또는 승화된 증착 재료를 기판에 부착시켜 성막하는 증착장치에 있어서,성막을 실시하는 성막 공간을 가지는 진공 챔버;증착 재료를 충전하는 재료 수용부;상기 재료 수용부를 가열해서 증착 재료를 증발 또는 승화시키는 수단;상기 재료 수용부로부터 상기 진공 챔버의 상기 성막 공간에 증착 재료를 공급하기 위한 복수개의 배관; 및상기 복수개의 배관 중 적어도 1개의 배관에 있어서의 증착 재료의 유량을 제어하거나 또는 상기 증착 재료의 흐름을 개방 또는 차단하는 수단을 포함하고,상기 복수개의 배관은 컨덕턴스가 다른 배관을 포함하는 것을 특징으로 하는 증착장치.
- 제1항에 있어서, 상기 복수개의 배관을 연결하는 연결부; 및상기 연결부로부터 증착 재료를 상기 진공 챔버의 상기 성막 공간에 방출하는 방출부를 더 포함하는 것을 특징으로 하는 증착장치.
- 제1항에 있어서, 상기 복수개의 배관을 각각 가열하는 수단을 더 포함하는 것을 특징으로 하는 증착장치.
- 삭제
- 제1항에 있어서, 상기 복수개의 배관 중 컨덕턴스가 작은 적어도 하나의 배관은 상기 증착 재료의 유량을 제어하거나 또는 해당 증착 재료의 흐름을 개방 또는 차단하는 수단을 구비한 것을 특징으로 하는 증착장치.
- 제1항에 있어서, 상기 재료 수용부는 상기 진공 챔버의 외부에 설치되어 있는 것을 특징으로 하는 증착장치.
- 증발 또는 승화한 증착 재료를 기판에 부착시켜 성막하는 증착방법에 있어서,증착 재료를 충전한 재료 수용부를 가열함으로써, 증착 재료를 증발 또는 승화시키는 공정;상기 재료 수용부에 연결되고 컨덕턴스가 다른 배관을 포함하는 복수개의 배관을 통해, 진공 챔버의 성막 공간에 상기 증착 재료를 공급하는 공정; 및상기 복수개의 배관 중 작은 컨덕턴스를 갖는 적어도 1개의 배관에 있어서의 증착 재료의 유량을 제어하거나 또는 해당 증착 재료의 흐름을 개방 또는 차단하여, 상기 진공 챔버의 상기 성막 공간에 공급되는 증착 재료의 유량을 조정하는 공정을 포함하는 것을 특징으로 하는 증착방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2007-00227408 | 2007-09-03 | ||
JP2007227408A JP5127372B2 (ja) | 2007-09-03 | 2007-09-03 | 蒸着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090024081A KR20090024081A (ko) | 2009-03-06 |
KR101037121B1 true KR101037121B1 (ko) | 2011-05-26 |
Family
ID=40407929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080086172A KR101037121B1 (ko) | 2007-09-03 | 2008-09-02 | 증착장치 및 증착방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090061084A1 (ko) |
JP (1) | JP5127372B2 (ko) |
KR (1) | KR101037121B1 (ko) |
CN (1) | CN101381859B (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103430625B (zh) * | 2011-03-15 | 2015-09-23 | 夏普株式会社 | 蒸镀装置、蒸镀方法和有机el显示装置的制造方法 |
DE102014014970B4 (de) | 2014-10-14 | 2020-01-02 | NICE Solar Energy GmbH | Vorrichtung und Verfahren zur Schichtdickenmessung für Dampfabscheideverfahren |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005281808A (ja) | 2004-03-30 | 2005-10-13 | Tohoku Pioneer Corp | 成膜源、成膜装置、成膜方法、有機elパネルの製造方法、有機elパネル |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290662U (ko) * | 1988-12-27 | 1990-07-18 | ||
US6749906B2 (en) * | 2002-04-25 | 2004-06-15 | Eastman Kodak Company | Thermal physical vapor deposition apparatus with detachable vapor source(s) and method |
JP4476019B2 (ja) * | 2004-05-20 | 2010-06-09 | 東北パイオニア株式会社 | 成膜源、真空成膜装置、有機el素子の製造方法 |
JP2006057173A (ja) * | 2004-08-24 | 2006-03-02 | Tohoku Pioneer Corp | 成膜源、真空成膜装置、有機elパネルの製造方法 |
JP4560394B2 (ja) * | 2004-12-13 | 2010-10-13 | 長州産業株式会社 | 薄膜形成用分子供給装置 |
JP4545028B2 (ja) * | 2005-03-30 | 2010-09-15 | 日立造船株式会社 | 蒸着装置 |
JP5064810B2 (ja) * | 2006-01-27 | 2012-10-31 | キヤノン株式会社 | 蒸着装置および蒸着方法 |
JP4966028B2 (ja) * | 2007-01-15 | 2012-07-04 | パナソニック株式会社 | 真空蒸着装置 |
-
2007
- 2007-09-03 JP JP2007227408A patent/JP5127372B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-18 US US12/193,612 patent/US20090061084A1/en not_active Abandoned
- 2008-09-02 KR KR1020080086172A patent/KR101037121B1/ko active IP Right Grant
- 2008-09-03 CN CN2008102148949A patent/CN101381859B/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005281808A (ja) | 2004-03-30 | 2005-10-13 | Tohoku Pioneer Corp | 成膜源、成膜装置、成膜方法、有機elパネルの製造方法、有機elパネル |
Also Published As
Publication number | Publication date |
---|---|
JP5127372B2 (ja) | 2013-01-23 |
CN101381859A (zh) | 2009-03-11 |
JP2009057614A (ja) | 2009-03-19 |
CN101381859B (zh) | 2011-03-02 |
US20090061084A1 (en) | 2009-03-05 |
KR20090024081A (ko) | 2009-03-06 |
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