KR101011946B1 - A slot die coater for fabrication of thin films - Google Patents

A slot die coater for fabrication of thin films Download PDF

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Publication number
KR101011946B1
KR101011946B1 KR1020100039760A KR20100039760A KR101011946B1 KR 101011946 B1 KR101011946 B1 KR 101011946B1 KR 1020100039760 A KR1020100039760 A KR 1020100039760A KR 20100039760 A KR20100039760 A KR 20100039760A KR 101011946 B1 KR101011946 B1 KR 101011946B1
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South Korea
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coating
die coater
slot die
lower body
guide film
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KR1020100039760A
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Korean (ko)
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정국채
정태정
최규채
이정구
김영국
최철진
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한국기계연구원
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0204—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to the edges of essentially flat articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE: A slot die coater for manufacturing thin films is provided to enable the formation of uniform coating layer and the formation of a wide coating layer, and to form various thin films with nm thickness through chemical coating. CONSTITUTION: A slot die coater(100) for manufacturing thin films includes: an upper body(120) and a lower body(140) in which a buffer dam is depressed and formed thereinside; a coating layer which is deposited on the upper side of the lower body and guides the flow of a coating solution; and a guide film(160) which is formed by physical or chemical coating and is communicated with the outside. The guide film and coating layer forms a coating channel(146) by spacing the upper body and the lower body.

Description

박막 제조용 슬롯 다이 코터 {A slot die coater for fabrication of thin films}Slot die coater for fabrication {A slot die coater for fabrication of thin films}

본 발명은 박막 제조용 슬롯 다이 코터에 관한 것으로, 슬롯 다이 코터 내부에 코팅 용액의 이송 방향을 안내하는 안내필름이 물리적 또는 화학적 증착에 의해 형성되도록 한 박막 제조용 슬롯 다이 코터에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slot die coater for thin film production, and to a slot die coater for thin film production in which a guide film for guiding a conveying direction of a coating solution in a slot die coater is formed by physical or chemical vapor deposition.

다양한 기능성 소재 물질(예: LED, 태양전지, 이차전지, 초전도, 등)을 박막 또는 후막 형태로 형성하는 방법 중 하나로 화학적 용액코팅 공정이 널리 사용되고 있다. Chemical solution coating is widely used as one of methods for forming various functional material materials (eg, LEDs, solar cells, secondary batteries, superconductors, etc.) into thin films or thick films.

특히 슬롯-다이 코터는 코팅될 물질이 코팅이 이루어지기 전에는 외부와 직접적인 접촉이 완전히 차단이 되므로 용액의 점도 유지 및 대기 중 오염이 사전에 방지되는 장점을 가지고 있으므로 널리 사용되어 지고 있다.In particular, the slot-die coater is widely used because the direct contact with the outside is completely blocked before the material to be coated is coated, thus maintaining the viscosity of the solution and preventing pollution in the air in advance.

이하 첨부된 도 1을 참조하여 종래 기술에 의한 슬롯-다이 포터의 구조를 살펴본다.Hereinafter, a structure of a slot-die porter according to the related art will be described with reference to FIG. 1.

첨부된 도 1은 종래 기술에 의한 슬롯 다이 포터의 구조이다.1 is a structure of a slot die porter according to the prior art.

도면과 같이, 슬롯 다이 포터(1)는 상부몸체(2)와 하부몸체(3)에 의해 외관이 형성되며, 상기 하부몸체의 내부에는 완충댐(4)이 함몰 형성된다.As shown in the drawing, the slot die porter 1 has an external appearance formed by the upper body 2 and the lower body 3, and a buffer dam 4 is formed in the interior of the lower body.

상기 완충댐(4)의 우측으로는 하방향으로 함몰된 코팅유로(5)가 구비되어 완충댐(4)과 연통된다. The right side of the buffer dam 4 is provided with a coating flow passage 5 recessed downward to communicate with the buffer dam 4.

그리고, 상기 완충댐(4)의 좌측으로는 공급유로(6)가 구비된다. 상기 공급유로(6)는 슬롯 다이 포터(1)의 좌측 외부로 관통되어 외부에서 공급되는 코팅용액이 완충댐(4) 내부로 유입될 수 있도록 안내하게 된다.The supply passage 6 is provided on the left side of the buffer dam 4. The supply passage 6 penetrates to the outside of the left side of the slot die porter 1 to guide the coating solution supplied from the outside into the buffer dam 4.

따라서, 상기 공급유로(6)를 통해 슬롯 다이 포터(1)로 공급되는 코팅용액은 완충댐(4)에 저장되어 있다가 상기 코팅유로(5)를 통해 코팅대상물에 코팅될 수 있다.Therefore, the coating solution supplied to the slot die porter 1 through the supply passage 6 may be stored in the buffer dam 4 and then coated on the coating object through the coating passage 5.

그러나, 상기 코팅유로(5)는 기계적 가공을 통해 함몰 형성된 것으로, 폭 방향으로 균일한 함몰 깊이를 확보하는데 어려움이 있다.However, the coating flow path 5 is formed by recessing through mechanical processing, and it is difficult to secure a uniform depth of depression in the width direction.

한편, 첨부된 도 2에는 다른 슬롯 다이 코터의 종래 기술 구조가 도시되어 있다.On the other hand, the attached prior art Figure 2 shows a prior art structure of another slot die coater.

도면과 같이, 상부몸체(2)와 하부몸체(3) 사이에는 마스크(7)가 구비된다. 상기 마스크(7)는 대략 'ㄷ' 형상을 가지며, 중앙부는 상기 상부몸체(2)와 하부몸체(3)가 이격되도록 틈을 형성하여 상기 완충댐(4)에서 완충된 코팅용액이 우측 방향으로 유동하도록 안내하게 된다.As shown in the figure, a mask 7 is provided between the upper body 2 and the lower body 3. The mask 7 has an approximately 'c' shape, and a central portion thereof forms a gap so that the upper body 2 and the lower body 3 are spaced apart so that the coating solution buffered at the buffer dam 4 is in the right direction. To guide the flow.

그러나, 이러한 종래 기술의 마스크(7)는 얇은 두께로 제작할 경우 작업자가 다루는데 어려움이 있으며, 균일도 확보 등에 문제가 발생된다.However, when the mask 7 of the prior art is manufactured to have a thin thickness, it is difficult for the operator to handle, and problems such as securing uniformity occur.

따라서, 종래 기술에 따른 슬롯 다이 코터 구조로는 1㎛ 이상의 후막 코팅에 제한적으로 적용되고 있다.Therefore, the slot die coater structure according to the prior art is limitedly applied to the thick film coating of 1㎛ or more.

또한, 상기와 같은 종래 기술에 따르면, 1m급의 광폭 기판에 적용하는데 어려움이 있다.In addition, according to the prior art as described above, it is difficult to apply to a wide substrate of 1m class.

즉, 하부몸체(3)에 기계적 가공으로 코팅유로(5)를 형성시에 그 폭이 1m 이상 되도록 하는데에는 평탄도 유지가 어려우며, 넓은 폭의 마스크(7)는 그 취급이 난해하여 작업 편의성이 저하되므로 박막 두께의 코팅에 적용하기에는 많은 한계를 보여주고 있다.That is, when forming the coating flow path 5 by mechanical processing on the lower body 3, it is difficult to maintain the flatness so that the width is 1 m or more, and the wide mask 7 is difficult to handle so that the work convenience is easy. Because of the degradation, there are many limitations to apply to thin-film coatings.

본 발명의 목적은, 상기와 같은 종래 기술의 문제점을 해결하기 위한 것으로, 상부몸체 또는 하부몸체 일측에 안내필름을 물리적 또는 화학적으로 증착하여 표면 평활도가 향상되도록 하며, ㎚급 두께의 코팅층 형성이 가능하도록 한 박막 제조용 슬롯 다이 코터를 제공하는 것에 있다.An object of the present invention is to solve the problems of the prior art as described above, by physically or chemically depositing a guide film on one side of the upper body or the lower body to improve the surface smoothness, it is possible to form a coating layer of ㎚-class thickness The present invention provides a slot die coater for manufacturing a thin film.

본 발명의 다른 목적은, 물리적 또는 화학적 증착에 의해 안내필름이 형성함으로써 제조가 용이할 뿐만 아니라, 제조 원가가 현저히 절감되도록 한 박막 제조용 슬롯 다이 코터를 제공하는 것에 있다.Another object of the present invention is to provide a slot die coater for thin film production, which is not only easy to manufacture by forming the guide film by physical or chemical vapor deposition but also significantly reduces the manufacturing cost.

본 발명은 박막 제조용 슬롯 다이 코터에 있어서, 상기 박막 제조용 슬롯 다이 코터의 내부 일측에는, 물리적 또는 화학적 코팅에 의해 형성되어 내부로 유입된 코팅용액의 유출을 가능하게 하는 안내필름이 구비되며, 상기 안내필름은 일방향으로 개구된 것을 특징으로 한다.The present invention is a slot die coater for manufacturing a thin film, the inner side of the slot die coater for manufacturing a thin film is formed by a physical or chemical coating is provided with a guide film to enable the outflow of the coating solution introduced into the guide, The film is characterized in that the opening in one direction.

본 발명에 의한 박막 제조용 슬롯 다이 코터는, 서로 결합하여 내부에 완충댐이 함몰 형성된 상부몸체 및 하부몸체와, 상기 상부몸체와 하부몸체 사이에 물리적 또는 화학적 코팅에 의해 형성되어 완충댐이 외부와 연통되도록 하는 안내필름을 포함하여 구성되며, 상기 안내필름은 일방향으로 개구된 것을 특징으로 한다.The slot die coater for manufacturing a thin film according to the present invention is formed by a physical or chemical coating between the upper body and the lower body and the upper body and the lower body in which a buffer dam is formed recessed therein, and the buffer dam communicates with the outside. It is configured to include a guide film, the guide film is characterized in that the opening in one direction.

상기 안내필름은, 스퍼터링법, 열증발법, 전자빔증발법, 펄스 레이저증착법, 화학기상증착법 중 어느 하나의 방법으로 형성됨을 특징으로 한다.The guide film is formed by any one of a sputtering method, thermal evaporation method, electron beam evaporation method, pulsed laser deposition method, chemical vapor deposition method.

상기 안내필름은, 금속, 세라믹, 반도체, 고분자 수지 중 어느 하나 이상으로 형성됨을 특징으로 한다.The guide film is formed of any one or more of metal, ceramic, semiconductor, polymer resin.

상기 안내필름은, 코팅용액과 반응하지 않는 재질로 형성됨을 특징으로 한다.The guide film is formed of a material that does not react with the coating solution.

상기 상부몸체와 하부몸체의 마주하는 면은 10㎛ 이하의 표면조도를 갖는 것을 특징으로 한다.The opposing surface of the upper body and the lower body is characterized in that it has a surface roughness of 10㎛ or less.

상기 안내필름은 10㎛이하의 두께를 갖는 것을 특징으로 한다.The guide film is characterized in that it has a thickness of less than 10㎛.

본 발명에서는, 물리적 또는 화학적 증착에 의해 ㎚ 두께의 안내필름을 형성하여 코팅용액의 코팅 작업이 가능하도록 구성하였다.In the present invention, by forming a guide film of the nm thickness by physical or chemical vapor deposition was configured to enable the coating operation of the coating solution.

따라서, 넓은 폭의 코팅층의 형성이 연속적으로 가능하며, 균일한 코팅층의 형성 또한 가능한 이점이 있다.Therefore, the formation of a wide coating layer is possible continuously, there is an advantage that the formation of a uniform coating layer is also possible.

또한, 기존 고가의 진공장치 대신 화학적 코팅에 의해 ㎚ 두께의 다양한 박막을 형성하게 되므로 제조 원가가 현저히 절감되며, LED, 태양전지, 이차전지, 초전도 등 다양한 분야의 박막 제조에 적용 가능한 이점이 있다.In addition, since various thin films having a thickness of ㎚ are formed by chemical coating instead of the existing expensive vacuum apparatus, manufacturing cost is significantly reduced, and there is an advantage that can be applied to manufacturing thin films in various fields such as LED, solar cell, secondary battery, and superconductivity.

도 1 은 종래 기술에 의한 슬롯-다이 구조를 나타낸 사시도.
도 2 는 종래 기술에 의한 또 다른 슬롯-다이 구조를 나타낸 분해 사시도.
도 3 은 본 발명에 의한 슬롯-다이 코터의 일실시예의 구성을 보인 분해 사시도.
도 4 는 본 발명에 의한 슬롯-다이 코터의 다른 실시예의 구성을 보인 분해 사시도.
도 5 는 본 발명에 의한 슬롯-다이 코터의 다른 실시예의 내부 구성을 보인 종단면도.
도 6 은 본 발명에 의한 슬롯 다이 코터의 또 다른 실시예의 내부 구성을 보인 종단면도.
도 7 은 본 발명에 의한 슬롯 다이 코터의 다른 실시예의 사용 상태도.
도 8 은 본 발명에 의한 슬롯 다이 코터의 또 다른 실시예의 사용 상태도.1 is a perspective view showing a slot-die structure according to the prior art.
2 is an exploded perspective view showing another slot-die structure according to the prior art;
Figure 3 is an exploded perspective view showing the configuration of one embodiment of a slot-die coater according to the present invention.
Figure 4 is an exploded perspective view showing the configuration of another embodiment of a slot-die coater according to the present invention.
Figure 5 is a longitudinal sectional view showing the internal configuration of another embodiment of a slot-die coater according to the present invention.
Figure 6 is a longitudinal sectional view showing the internal configuration of another embodiment of a slot die coater according to the present invention.
7 is a use state diagram of another embodiment of a slot die coater according to the present invention.
8 is a use state diagram of another embodiment of a slot die coater according to the present invention;

이하 첨부된 도 3을 참조하여 본 발명에 의한 박막 제조용 슬롯 다이 코터의 구성을 설명한다.Hereinafter, a configuration of a slot die coater for manufacturing a thin film according to the present invention will be described with reference to FIG. 3.

도 3에는 본 발명에 의한 슬롯-다이 코터의 일실시예의 구성을 보인 분해 사시도가 도시되어 있다.3 is an exploded perspective view showing the configuration of one embodiment of a slot-die coater according to the present invention.

첨부된 도면과 같이, 슬롯 다이 코터(100)는 상부몸체(120)와 하부몸체(140)에 의해 외형이 형성되며, 상기 상부몸체(120)와 하부몸체(140)는 좌측 방향으로부터 코팅 용액(W)을 공급받아 우측 방향으로 배출하도록 구성된다.As shown in the accompanying drawings, the slot die coater 100 is formed by the upper body 120 and the lower body 140, the upper body 120 and the lower body 140 is a coating solution (from the left side) W) is supplied and configured to discharge in the right direction.

이를 위해 상기 하부몸체(140)의 내부 중앙에는 하방향으로 함몰된 완충댐(142)이 구비된다.To this end, a buffer dam 142 recessed downward is provided at the inner center of the lower body 140.

상기 완충댐(142)은 외부에서 슬롯 다이 코터(100) 내부로 공급된 코팅 용액(W)이 외부로 다시 배출될 때 압력을 조절하기 위한 구성으로, 소정의 공간을 갖도록 형성됨이 바람직하다.The buffer dam 142 is configured to adjust the pressure when the coating solution W supplied from the outside into the slot die coater 100 is discharged back to the outside, and is preferably formed to have a predetermined space.

상기 완충댐(142)의 좌측으로는 공급유로(144)가 구비된다. 상기 공급유로(144)는 완충댐(142) 내부로 코팅 용액(W)이 유입되도록 안내하는 역할을 하는 것으로, 상기 공급유로(144)는 슬롯 다이 코터(100)의 외부와 완충댐(142)이 서로 연통하도록 구성된다.A supply passage 144 is provided on the left side of the buffer dam 142. The supply passage 144 serves to guide the coating solution (W) to flow into the buffer dam 142, and the supply passage 144 is external to the slot die coater 100 and the buffer dam 142. It is configured to communicate with each other.

상기 완충댐(142)의 우측에는 코팅유로(146)가 구비된다. 상기 코팅유로(146)는 완충댐(142)에서 저장 및 완충된 코팅용액(W)이 코팅대상물에 공급되도록 하는 구성으로, 10㎛이하의 높이를 갖도록 형성된다.The coating passage 146 is provided on the right side of the buffer dam 142. The coating channel 146 is configured to supply the coating solution W stored and buffered in the buffer dam 142 to the coating object, and is formed to have a height of 10 μm or less.

보다 구체적으로 살펴보면, 상기 코팅유로(146)는 본 발명의 요부 구성인 안내필름(160)에 의해 상부몸체(120)와 하부몸체(140) 사이의 이격된 간격을 나타내는 것으로, 상기 상부몸체(120)와 하부몸체(140) 사이에 구비된 안내필름(160)의 두께가 10㎛이하로 형성됨으로써 상기 코팅유로(146) 역시 10㎛이하의 높이를 갖게 된다.Looking in more detail, the coating flow path 146 indicates the spaced apart distance between the upper body 120 and the lower body 140 by the guide film 160, which is a main component of the present invention, the upper body 120 ) And the thickness of the guide film 160 provided between the lower body 140 is 10㎛ or less, so that the coating flow path 146 also has a height of 10㎛ or less.

상기 안내필름(160)은 상방향에서 볼 때 대략 'ㄷ' 형상을 갖도록 구비되어 우측 방향이 개구되며, 개구된 우측은 코팅유로(146)를 형성하게 된다.The guide film 160 is provided to have an approximately 'c' shape when viewed from above, and the right direction is opened, and the opened right side forms the coating flow path 146.

따라서, 상부몸체(120)와 하부몸체(140) 사이에 안내필름(160)이 접촉한 상태로 개재되면 안내필름(160)의 차폐된 좌측으로는 코팅용액(W)의 유동이 제한될 수 있다.Therefore, when the guide film 160 is interposed between the upper body 120 and the lower body 140 in contact with each other, the flow of the coating solution W may be restricted to the shielded left side of the guide film 160. .

그리고, 상기 안내필름(160)은 물리적 또는 화학적 코팅에 의해 형성된다. 즉, 상기 안내필름(160)은 하부몸체(140)의 상면에 스퍼터링법, 열증발법, 전자빔증착법, 펄스 레이저증착법, 화학기상증착법 중 어느 하나를 실시하되, 특정 형상을 갖도록 함으로써 상기 상부몸체(120)와 하부몸체(140)의 결합시에 코팅유로(146)가 형성될 수 있도록 구성된다.In addition, the guide film 160 is formed by a physical or chemical coating. That is, the guide film 160 is any one of the sputtering method, thermal evaporation method, electron beam deposition method, pulse laser deposition method, chemical vapor deposition method on the upper surface of the lower body 140, by having a specific shape of the upper body ( The coating flow path 146 may be formed when the 120 and the lower body 140 are coupled to each other.

따라서, 상기 안내필름(160)은 금속, 세라믹, 반도체, 고분자 수지 중 어느 하나 이상의 재료를 채택하여 형성될 수 있으며, 상기 코팅용액(W)과 반응하지 않는 재질로 형성됨이 바람직하다.Therefore, the guide film 160 may be formed by adopting any one or more materials of metal, ceramic, semiconductor, and polymer resin, and is preferably formed of a material that does not react with the coating solution (W).

그리고, 상기 하부몸체(140)의 상면 우측부는 코팅유로(146)의 하면을 형성하게 되고, 상부몸체(120)의 하면 우측부는 코팅유로(146)의 상면을 형성하게 되므로, 상기 하부몸체(140)와 상부몸체(120)의 서로 마주하는 면은 코팅용액(W)이 코팅유로(146) 내에서 원활하게 유동할 수 있도록 10㎛ 이하의 표면조도를 갖도록 가공됨이 바람직하다.The lower right side of the lower body 140 forms the lower surface of the coating flow path 146, and the lower right side of the upper body 120 forms the upper surface of the coating flow path 146. ) And the surfaces of the upper body 120 that face each other are preferably processed to have a surface roughness of 10 μm or less so that the coating solution W may smoothly flow in the coating passage 146.

한편, 상기 안내필름(160)은 첨부된 도 4 및 도 5와 같이 변경 실시가 가능하다.On the other hand, the guide film 160 can be modified as shown in Figure 4 and 5 attached.

도 4는 본 발명에 의한 슬롯 다이 코터의 다른 실시예의 구성을 보인 분해 사시도이고, 도 5는 내부 구성을 보인 종단면도로서, 상기 안내필름(160)은 하부몸체(140)의 상면 중에서 완충댐(142)의 상측과 우측 일부를 제외한 면을 덮을 수 있도록 형성된다. 이것은 상기 상부몸체(120)와 하부몸체(140) 사이의 밀착력을 높여 코팅용액(W)의 누설을 방지하기 위함이다.Figure 4 is an exploded perspective view showing a configuration of another embodiment of a slot die coater according to the present invention, Figure 5 is a longitudinal cross-sectional view showing the internal configuration, the guide film 160 is a buffer dam (top) of the upper surface of the lower body 140 ( 142 is formed to cover the surface except for the upper portion and the right portion. This is to increase the adhesion between the upper body 120 and the lower body 140 to prevent the leakage of the coating solution (W).

그리고, 도 3 내지 도 5에 도시되진 않았으나, 상부몸체(120) 및/또는 하부몸체(140) 일측에는 완충댐(142)에 공급된 코팅용액(W)의 유동성을 유지할 수 있도록 가열체가 구비됨이 바람직하다.And, although not shown in Figures 3 to 5, one side of the upper body 120 and / or lower body 140 is provided with a heating body to maintain the fluidity of the coating solution (W) supplied to the buffer dam 142. This is preferred.

한편, 도 6에는 본 발명에 의한 슬롯 다이 코터의 또 다른 실시예의 내부 구성을 보인 종단면도가 도시되어 있다.On the other hand, Figure 6 is a longitudinal cross-sectional view showing the internal configuration of another embodiment of a slot die coater according to the present invention.

도면과 같이, 상기 안내필름(160)은 코팅층(180)의 상측에 형성될 수 있다.As shown in the drawing, the guide film 160 may be formed on the upper side of the coating layer 180.

즉, 상기 코팅층(180)은 하부몸체(140)의 상면 중 완충댐(142)이 형성된 부분을 제외한 나머지 부위에 전체적으로 우선 증착 형성되고, 이렇게 형성된 코팅층(180) 상면에 안내필름(160)을 증착하여 형성할 수 있다.That is, the coating layer 180 is first deposited on the remaining portion of the upper surface of the lower body 140 except for the portion where the buffer dam 142 is formed, and the guide film 160 is deposited on the upper surface of the coating layer 180 thus formed. Can be formed.

이때 상기 안내필름(160)은 전술한 일실시예 및 다른 실시예와 같이 우측이 개구된 형상을 갖도록 형성됨이 바람직하며, 상기 코팅층(180)의 상면으로부터 10㎛이하의 두께로 형성된다.In this case, the guide film 160 is preferably formed to have an open shape on the right side as in the above-described embodiments and other embodiments, and is formed to a thickness of 10 μm or less from the top surface of the coating layer 180.

따라서, 상기 코팅유로(146)의 하면은 코팅층(180)의 상면에 의해 형성되므로 표면 조도를 보다 높일 수 있게 된다.Therefore, since the bottom surface of the coating channel 146 is formed by the top surface of the coating layer 180, the surface roughness may be further increased.

이하 첨부된 도 7 및 8을 참조하여 상기와 같이 구성되는 슬롯 다이 코터(100)의 작용을 설명한다.Hereinafter, the operation of the slot die coater 100 configured as described above will be described with reference to FIGS. 7 and 8.

먼저 도 7은 본 발명에 의한 슬롯 다이 코터의 다른 실시예의 사용 상태도로서, 공급유로(144)를 통해 좌측에서 우측으로 공급된 코팅용액(W)은 완충댐(142) 내부에 저장되며, 이때 가열장치에 의해 코팅용액(W)의 유동성은 유지될 수 있다.First, Figure 7 is a state diagram used in another embodiment of the slot die coater according to the present invention, the coating solution (W) supplied from left to right through the supply passage 144 is stored in the buffer dam 142, the heating The fluidity of the coating solution W can be maintained by the device.

그리고, 상기 완충댐(142)에 저장된 코팅용액(W)은 코팅유로(146)로 안내되기 전에 완충되며, 상기 코팅유로(146)를 통해 우측 방향으로 유동하는 코팅용액(W)은 코팅대상물에 코팅 가능하게 된다.In addition, the coating solution W stored in the buffer dam 142 is buffered before being guided to the coating passage 146, and the coating solution W flowing in the right direction through the coating passage 146 is applied to the coating object. Coating becomes possible.

도 8은 본 발명에 의한 슬롯 다이 코터의 또 다른 실시예의 사용 상태도로서, 도 7에서 코팅용액(W)의 유동경로인 공급유로(144)-완충댐(142)-코팅유로(146)와 동일한 유동 경로를 거친다.FIG. 8 is a state diagram of another embodiment of the slot die coater according to the present invention, which is the same as that of the supply passage 144, the buffer dam 142, and the coating passage 146, which is the flow path of the coating solution W in FIG. Go through the flow path.

다만, 상기 완충댐(142)으로부터 코팅유로(146)를 따라 유동하는 코팅용액(W)은 코팅층(180)의 상면을 따라 우측 방향으로 안내된다. However, the coating solution W flowing along the coating flow path 146 from the buffer dam 142 is guided in the right direction along the upper surface of the coating layer 180.

이러한 본 발명의 범위는 상기에서 예시한 실시예에 한정하지 않고, 상기와 같은 기술범위 안에서 당업계의 통상의 기술자에게 있어서는 본 발명을 기초로 하는 다른 많은 변형이 가능할 것이다.The scope of the present invention is not limited to the above-described embodiments, and many other modifications based on the present invention will be possible to those skilled in the art within the scope of the present invention.

예를 들어 본 발명의 실시예에서는, 코팅층과 안내필름이 하부몸체 상면에 형성되도록 구성하였으나, 필요에 따라서는 상부몸체와 하부몸체가 서로 마주보는 면에 모두 형성할 수도 있음은 물론이다.For example, in the embodiment of the present invention, the coating layer and the guide film is configured to be formed on the lower body upper surface, but if necessary, the upper body and the lower body may be formed on both of the surfaces facing each other.

100. 슬롯 다이 코터 120. 상부몸체
140. 하부몸체 142. 완충댐
144. 공급유로 146. 코팅유로
160. 안내필름 180. 코팅층
W . 코팅용액100. Slot die coater 120. Upper body
140. Lower Body 142. Damping Dam
144. Supply Euro 146. Coating Euro
160. Guidance film 180. Coating layer
W. Coating solution

Claims (7)

서로 결합하여 내부에 완충댐이 함몰 형성된 상부몸체 및 하부몸체와,
상기 하부몸체의 상면에 증착되어 코팅용액의 유동을 안내하는 코팅층과,
상기 코팅층의 일측에 물리적 또는 화학적 코팅에 의해 형성되고, 일방향으로 개구되어 완충댐이 외부와 연통되도록 하는 안내필름을 포함하여 구성되며,
상기 안내필름과 코팅층은 상부몸체와 하부몸체를 이격시켜 코팅유로를 형성하는 것을 특징으로 하는 박막 제조용 슬롯 다이 코터.An upper body and a lower body coupled to each other to form a buffer dam in the interior,
A coating layer deposited on the upper surface of the lower body to guide the flow of the coating solution;
It is formed by a physical or chemical coating on one side of the coating layer, and comprises a guide film which is opened in one direction to communicate the buffer dam with the outside,
The guide film and the coating layer is a slot die coater for manufacturing a thin film, characterized in that to form a coating flow path by separating the upper body and the lower body. 서로 결합하여 내부에 완충댐이 함몰 형성된 상부몸체 및 하부몸체와,
상기 하부몸체의 상면에 물리적 또는 화학적 코팅에 의해 형성되고, 일방향으로 개구되어 완충댐이 외부와 연통되도록 하는 안내필름을 포함하여 구성되며,
상기 안내필름은 상부몸체와 하부몸체를 이격시켜 코팅유로를 형성하는 것을 특징으로 하는 박막 제조용 슬롯 다이 코터.An upper body and a lower body coupled to each other to form a buffer dam in the interior,
It is formed by a physical or chemical coating on the upper surface of the lower body, and comprises a guide film which is opened in one direction to communicate the buffer dam with the outside,
The guide film is a slot die coater for manufacturing a thin film, characterized in that to form a coating flow path by separating the upper body and the lower body. 제 1 항 또는 제 2 항에 있어서, 상기 안내필름은, 스퍼터링법, 열증발법, 전자빔증발법, 펄스 레이저증착법, 화학기상증착법 중 어느 하나의 방법으로 형성됨을 특징으로 하는 박막 제조용 슬롯 다이 코터.The slot die coater according to claim 1 or 2, wherein the guide film is formed by any one of sputtering, thermal evaporation, electron beam evaporation, pulse laser deposition, and chemical vapor deposition. 제 1 항 또는 제 2 항에 있어서, 상기 안내필름은, 금속, 세라믹, 반도체, 고분자 수지 중 어느 하나 이상으로 형성됨을 특징으로 하는 박막 제조용 슬롯 다이 코터.The slot die coater of claim 1 or 2, wherein the guide film is formed of at least one of metal, ceramic, semiconductor, and polymer resin. 제 1 항 또는 제 2 항에 있어서, 상기 안내필름은, 코팅용액과 반응하지 않는 재질로 형성됨을 특징으로 하는 박막 제조용 슬롯 다이 코터.The slot die coater according to claim 1 or 2, wherein the guide film is formed of a material that does not react with the coating solution. 제 2 항에 있어서, 상기 상부몸체와 하부몸체의 마주하는 면은 10㎛ 이하의 표면조도를 갖는 것을 특징으로 하는 박막 제조용 슬롯 다이 코터.The slot die coater of claim 2, wherein the opposing surfaces of the upper body and the lower body have a surface roughness of 10 µm or less. 제 1 항 또는 제 2 항에 있어서, 상기 안내필름은 10㎛이하의 두께를 갖는 것을 특징으로 하는 박막 제조용 슬롯 다이 코터.The slot die coater according to claim 1 or 2, wherein the guide film has a thickness of 10 µm or less.
KR1020100039760A 2010-04-29 2010-04-29 A slot die coater for fabrication of thin films KR101011946B1 (en)

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Cited By (8)

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CN103962265A (en) * 2013-02-01 2014-08-06 三星Sdi株式会社 Size coating device
WO2015009033A1 (en) * 2013-07-16 2015-01-22 주식회사 엘지화학 Member for slot die coater, movable member for slot die coater, and slot die coater for producing electrode employing same
WO2019013474A3 (en) * 2017-07-13 2019-03-07 주식회사 엘지화학 Coating apparatus
KR102062061B1 (en) 2018-07-03 2020-01-03 재단법인 한국섬유기계융합연구원 Heating slot die for SMC manufacturing
KR102509506B1 (en) 2021-11-26 2023-03-14 한국기술교육대학교 산학협력단 Slot die coater that can be rolled and table coated
KR102518518B1 (en) 2022-01-12 2023-04-04 한국기술교육대학교 산학협력단 Slot die coater experimental equipment for multi-layer coating
US11964298B2 (en) 2020-05-28 2024-04-23 Lg Energy Solution, Ltd. Slot die coating device for electrode production

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JP2000140739A (en) * 1998-11-10 2000-05-23 Canon Inc Sheet coating apparatus, coating by using the same and production of color filter
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102688828A (en) * 2011-03-25 2012-09-26 恒辉新能源（昆山）有限公司 High-precision coater
CN103962265A (en) * 2013-02-01 2014-08-06 三星Sdi株式会社 Size coating device
WO2015009033A1 (en) * 2013-07-16 2015-01-22 주식회사 엘지화학 Member for slot die coater, movable member for slot die coater, and slot die coater for producing electrode employing same
US9539606B2 (en) 2013-07-16 2017-01-10 Lg Chem, Ltd. Member for slot die coater, movable member for slot die coater, and slot die coater including the members to produce electrode
WO2019013474A3 (en) * 2017-07-13 2019-03-07 주식회사 엘지화학 Coating apparatus
US11127936B2 (en) 2017-07-13 2021-09-21 Lg Chem, Ltd. Coating apparatus
US11764345B2 (en) 2017-07-13 2023-09-19 Lg Energy Solution, Ltd. Coating apparatus
KR102062061B1 (en) 2018-07-03 2020-01-03 재단법인 한국섬유기계융합연구원 Heating slot die for SMC manufacturing
US11964298B2 (en) 2020-05-28 2024-04-23 Lg Energy Solution, Ltd. Slot die coating device for electrode production
KR102509506B1 (en) 2021-11-26 2023-03-14 한국기술교육대학교 산학협력단 Slot die coater that can be rolled and table coated
KR102518518B1 (en) 2022-01-12 2023-04-04 한국기술교육대학교 산학협력단 Slot die coater experimental equipment for multi-layer coating

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