KR100976313B1 - 무전해도금을 실시한 전자 부품기재, 및 전자 부품기재의 제조 방법 - Google Patents
무전해도금을 실시한 전자 부품기재, 및 전자 부품기재의 제조 방법 Download PDFInfo
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- KR100976313B1 KR100976313B1 KR1020097022727A KR20097022727A KR100976313B1 KR 100976313 B1 KR100976313 B1 KR 100976313B1 KR 1020097022727 A KR1020097022727 A KR 1020097022727A KR 20097022727 A KR20097022727 A KR 20097022727A KR 100976313 B1 KR100976313 B1 KR 100976313B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
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Abstract
Description
Claims (14)
- 이미다졸실란과 귀금속 화합물을 포함한 용액을 이용하고, 상기 용액에 의해 팽윤성을 가진 B 스테이지의 수지기재 표면을 처리해서 이루어진 B 스테이지의 수지기재에, 무전해도금을 실시한 후 혹은 무전해도금 후 전기도금을 더 실시한 후, 가열하여, 상기 B 스테이지의 수지기재를 완전경화시킨 전자 부품기재.
- 이미다졸실란과 귀금속 화합물을 포함한 용액을 이용하고, 상기 용액에 의해 B 스테이지의 수지기재 표면을 팽윤시키면서, 상기 용액에 의해 표면을 처리해서 이루어지는 B 스테이지의 수지기재에, 무전해도금을 실시한 후 혹은 무전해도금 후 전기도금을 더 실시한 후, 가열하여, 상기 B 스테이지의 수지기재를 완전경화시킨 전자 부품기재.
- 청구항 1항에 있어서, 전자 부품기재가 빌드 업 기판인 전자 부품기재.
- 청구항 2항에 있어서, 전자 부품기재가 빌드 업 기판인 전자 부품기재.
- 청구항 1항 내지 4항 중 어느 한 항에 있어서, B 스테이지의 수지기재가, B 스테이지의 에폭시 수지인 전자 부품기재.
- 청구항 1항 내지 4항 중 어느 한 항에 있어서, 귀금속 화합물이 팔라듐 화합물인 전자 부품기재.
- 청구항 5항에 있어서, 귀금속 화합물이 팔라듐 화합물인 전자 부품기재.
- 이미다졸실란과 귀금속 화합물을 포함한 용액을 이용하고, 상기 용액에 의해 팽윤성을 가진 B 스테이지의 수지기재 표면을 처리해서 이루어진 B 스테이지의 수지기재에, 무전해도금을 실시한 후 혹은 무전해도금 후 전기도금을 더 실시한 후, 가열하여 상기 B 스테이지의 수지기재를 완전경화하는 공정을 포함하는 전자 부품기재의 제조방법.
- 이미다졸실란과 귀금속 화합물을 포함한 용액을 이용하고, 상기 용액에 의해 B 스테이지의 수지기재 표면을 팽윤시키면서, 상기 용액에 의해 표면을 처리해서 이루어지는 B 스테이지의 수지기재에, 무전해도금을 실시한 후 혹은 무전해도금 후 전기도금을 더 실시한 후, 가열하여 상기 B 스테이지의 수지기재를 완전경화하는 공정을 포함하는 전자 부품기재의 제조방법.
- 청구항 8항에 있어서, 전자 부품기재가 빌드 업 기판인 전자 부품기재의 제조방법.
- 청구항 9항에 있어서, 전자 부품기재가 빌드 업 기판인 전자 부품기재의 제조방법.
- 청구항 8항 내지 11항 중 어느 한 항에 있어서, B 스테이지의 수지기재가, B 스테이지의 에폭시 수지인 전자 부품기재의 제조방법.
- 청구항 8항 내지 11항 중 어느 한 항에 있어서, 귀금속 화합물이 팔라듐 화합물인 전자 부품기재의 제조방법.
- 청구항 12항에 있어서, 귀금속 화합물이 팔라듐 화합물인 전자 부품기재의 제조방법.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2005-066603 | 2005-03-10 | ||
JP2005066603 | 2005-03-10 | ||
JPJP-P-2005-248706 | 2005-08-30 | ||
JP2005248706 | 2005-08-30 |
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KR1020077021861A Division KR101106845B1 (ko) | 2005-03-10 | 2006-02-27 | 수지기재 |
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KR20090126317A KR20090126317A (ko) | 2009-12-08 |
KR100976313B1 true KR100976313B1 (ko) | 2010-08-16 |
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KR1020077021861A KR101106845B1 (ko) | 2005-03-10 | 2006-02-27 | 수지기재 |
KR1020097022727A KR100976313B1 (ko) | 2005-03-10 | 2006-02-27 | 무전해도금을 실시한 전자 부품기재, 및 전자 부품기재의 제조 방법 |
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KR1020077021861A KR101106845B1 (ko) | 2005-03-10 | 2006-02-27 | 수지기재 |
Country Status (6)
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US (1) | US8043705B2 (ko) |
JP (1) | JP4428579B2 (ko) |
KR (2) | KR101106845B1 (ko) |
CN (1) | CN101133187B (ko) |
TW (1) | TWI313687B (ko) |
WO (1) | WO2006095589A1 (ko) |
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JP4863715B2 (ja) * | 2003-11-05 | 2012-01-25 | Jx日鉱日石金属株式会社 | インクジェット用インク組成物 |
KR100980427B1 (ko) * | 2008-04-10 | 2010-09-07 | 주식회사 나노스페이스 | 무전해 금속도금의 전처리방법, 전처리제 및 이를 이용한무전해 금속도금방법 |
KR101445461B1 (ko) * | 2010-03-23 | 2014-09-26 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 무전해 도금 전처리제, 그것을 이용하는 무전해 도금 방법 및 무전해 도금물 |
EP2645830B1 (en) * | 2012-03-29 | 2014-10-08 | Atotech Deutschland GmbH | Method for manufacture of fine line circuitry |
CN104145537A (zh) * | 2012-03-29 | 2014-11-12 | 德国艾托特克公司 | 细线电路的制造方法 |
CN114341401B (zh) * | 2019-09-06 | 2024-04-05 | 四国化成工业株式会社 | 金属的表面处理液及其浓缩液、金属的表面处理液套组和表面处理方法以及印刷配线板的制造方法 |
CN111826643B (zh) * | 2020-07-14 | 2023-05-12 | 华东理工大学 | 一种改性金属表面活化镀铜提高镀层结合力的方法 |
Citations (1)
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KR20020075884A (ko) * | 2000-04-25 | 2002-10-07 | 가부시키 가이샤 닛코 마테리알즈 | 도금 전처리제 및 그것을 사용한 금속도금 방법 |
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US4024305A (en) * | 1975-06-04 | 1977-05-17 | International Business Machines Corporation | Method for producing a resin rich epoxy prepreg and laminate |
JPH0768256B2 (ja) | 1991-08-01 | 1995-07-26 | 株式会社ジャパンエナジー | 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤 |
JPH0839728A (ja) * | 1994-07-27 | 1996-02-13 | Sumitomo Metal Mining Co Ltd | 金属張積層基板の製造方法 |
JP2000313963A (ja) * | 1999-04-28 | 2000-11-14 | Sumitomo Metal Ind Ltd | 樹脂のめっき方法 |
US7045461B2 (en) * | 2000-01-07 | 2006-05-16 | Nikkon Materials Co., Ltd. | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these |
WO2001049898A1 (fr) * | 2000-01-07 | 2001-07-12 | Nikko Materials Co., Ltd. | Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere |
JP2002030216A (ja) | 2000-05-12 | 2002-01-31 | Toray Eng Co Ltd | ポリイミド樹脂前駆体溶液、その溶液を用いた電子部品用基材、およびその基材の製造方法 |
JP2002374055A (ja) | 2001-06-14 | 2002-12-26 | Toray Eng Co Ltd | 金属回路パターン形成方法 |
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- 2006-02-27 JP JP2007507047A patent/JP4428579B2/ja active Active
- 2006-02-27 KR KR1020077021861A patent/KR101106845B1/ko active IP Right Grant
- 2006-02-27 US US11/795,355 patent/US8043705B2/en active Active
- 2006-02-27 WO PCT/JP2006/303598 patent/WO2006095589A1/ja active Application Filing
- 2006-02-27 CN CN2006800070309A patent/CN101133187B/zh active Active
- 2006-02-27 KR KR1020097022727A patent/KR100976313B1/ko active IP Right Grant
- 2006-03-07 TW TW95107526A patent/TWI313687B/zh active
Patent Citations (2)
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KR20020075884A (ko) * | 2000-04-25 | 2002-10-07 | 가부시키 가이샤 닛코 마테리알즈 | 도금 전처리제 및 그것을 사용한 금속도금 방법 |
KR100495164B1 (ko) * | 2000-04-25 | 2005-06-14 | 가부시키 가이샤 닛코 마테리알즈 | 도금 전처리제 및 그것을 사용한 금속도금 방법 |
Also Published As
Publication number | Publication date |
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JP4428579B2 (ja) | 2010-03-10 |
CN101133187A (zh) | 2008-02-27 |
US8043705B2 (en) | 2011-10-25 |
WO2006095589A1 (ja) | 2006-09-14 |
CN101133187B (zh) | 2010-06-23 |
JPWO2006095589A1 (ja) | 2008-08-14 |
KR20090126317A (ko) | 2009-12-08 |
KR101106845B1 (ko) | 2012-01-19 |
TWI313687B (en) | 2009-08-21 |
US20080138629A1 (en) | 2008-06-12 |
TW200640938A (en) | 2006-12-01 |
KR20070110100A (ko) | 2007-11-15 |
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