KR100880937B1 - 스핀 현상 장치 - Google Patents
스핀 현상 장치 Download PDFInfo
- Publication number
- KR100880937B1 KR100880937B1 KR1020010088098A KR20010088098A KR100880937B1 KR 100880937 B1 KR100880937 B1 KR 100880937B1 KR 1020010088098 A KR1020010088098 A KR 1020010088098A KR 20010088098 A KR20010088098 A KR 20010088098A KR 100880937 B1 KR100880937 B1 KR 100880937B1
- Authority
- KR
- South Korea
- Prior art keywords
- vacuum
- substrate
- vacuum chuck
- static electricity
- chuck
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 230000005611 electricity Effects 0.000 claims abstract description 16
- 230000003068 static effect Effects 0.000 claims abstract description 16
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 210000002858 crystal cell Anatomy 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/22—Antistatic materials or arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
측정횟수 | A | B | C |
1 | -2.0 | -0.7 | -0.8 |
2 | -3.3 | -0.8 | -0.9 |
3 | -4.2 | -0.8 | -0.9 |
4 | -4.8 | -1.0 | -1.1 |
5 | -4.8 | -1.0 | -1.2 |
Claims (5)
- 기판과,상기 기판이 안착되는 진공척과,상기 진공척의 기판 안착면 상에서 동심원 형태로 돌출되는 진공라인들과,상기 진공라인들 사이에서 동심원 형태로 형성되어 상기 기판을 진공 흡착하기 위한 다수의 진공홀들과,상기 기판과 상기 진공라인들의 접촉으로 인해 발생되는 정전기량을 줄이기 위해 상기 진공라인들 상에 비주기적으로 형성되는 다수의 미세홈들을 구비하고,상기 미세홈들은 상기 진공홀들보다 낮은 깊이로 형성되는 것을 특징으로 하는 스핀 현상장치.
- 삭제
- 삭제
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010088098A KR100880937B1 (ko) | 2001-12-29 | 2001-12-29 | 스핀 현상 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010088098A KR100880937B1 (ko) | 2001-12-29 | 2001-12-29 | 스핀 현상 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030057977A KR20030057977A (ko) | 2003-07-07 |
KR100880937B1 true KR100880937B1 (ko) | 2009-02-04 |
Family
ID=32215734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010088098A KR100880937B1 (ko) | 2001-12-29 | 2001-12-29 | 스핀 현상 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100880937B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7791708B2 (en) * | 2006-12-27 | 2010-09-07 | Asml Netherlands B.V. | Lithographic apparatus, substrate table, and method for enhancing substrate release properties |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10112495A (ja) * | 1996-10-07 | 1998-04-28 | Dainippon Screen Mfg Co Ltd | 基板保持体 |
JP2001118913A (ja) * | 1999-10-18 | 2001-04-27 | Dainippon Printing Co Ltd | 基板吸着プレート |
KR20010095006A (ko) * | 2000-03-31 | 2001-11-03 | 히가시 데쓰로 | 기판처리장치 및 기판처리방법 |
JP2001341043A (ja) * | 2000-06-02 | 2001-12-11 | Sumitomo Osaka Cement Co Ltd | 吸着固定装置 |
-
2001
- 2001-12-29 KR KR1020010088098A patent/KR100880937B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10112495A (ja) * | 1996-10-07 | 1998-04-28 | Dainippon Screen Mfg Co Ltd | 基板保持体 |
JP2001118913A (ja) * | 1999-10-18 | 2001-04-27 | Dainippon Printing Co Ltd | 基板吸着プレート |
KR20010095006A (ko) * | 2000-03-31 | 2001-11-03 | 히가시 데쓰로 | 기판처리장치 및 기판처리방법 |
JP2001341043A (ja) * | 2000-06-02 | 2001-12-11 | Sumitomo Osaka Cement Co Ltd | 吸着固定装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20030057977A (ko) | 2003-07-07 |
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