KR100798895B1 - 방열패턴을 구비하는 반도체 집적회로 - Google Patents
방열패턴을 구비하는 반도체 집적회로 Download PDFInfo
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- KR100798895B1 KR100798895B1 KR1020060131969A KR20060131969A KR100798895B1 KR 100798895 B1 KR100798895 B1 KR 100798895B1 KR 1020060131969 A KR1020060131969 A KR 1020060131969A KR 20060131969 A KR20060131969 A KR 20060131969A KR 100798895 B1 KR100798895 B1 KR 100798895B1
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- integrated circuit
- semiconductor integrated
- pad
- output terminal
- output
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (6)
- 방열패턴을 구비하는 출력단자와 직접 연결된 적어도 하나의 출력용 패드(Output PAD);전원을 공급하는 전원공급용 패드; 및전원을 공급하는 메탈 라인(Metal Line) 또는 내부 기능블록의 내부 출력단자에 연결된 적어도 하나의 더미패드를 구비하며,상기 방열패턴은 상기 출력단자에 복수 개의 단위 콘택(Unit Contact)을 구비하거나 상기 단위 콘택을 적어도 2개 이상 더한 정도의 면적을 가지는 스트립 콘택(Strip Contact)을 복수 개 구비하는 것을 특징으로 하는 반도체 집적회로.
- 제1항에 있어서, 상기 더미패드는,상기 전원을 공급하는 메탈 라인 및 상기 내부 기능블록의 내부 출력단자와 상기 반도체 집적회로의 내부에서 직접 연결되는 것을 특징으로 하는 반도체 집적회로.
- 단위 콘택을 적어도 1개 구비하는 출력단자 또는 상기 단위 콘택을 적어도 2개 이상 더한 정도의 면적을 가지는 스트립 콘택을 적어도 1개 구비하는 출력단자와 연결된 적어도 하나의 출력용 패드, 반도체 집적회로에 전원을 공급하는 적어도 하나의 전원공급용 패드 및 상기 반도체 집적회로에 전원을 공급하는 메탈라인 또 는 상기 반도체 집적회로에 장착된 내부 기능블록의 출력단자와 연결된 적어도 하나의 더미패드들을 구비하는 반도체 집적회로; 및상기 출력용 패드, 상기 전원공급용 패드 및 상기 더미패드들과 연결된 적어도 하나의 방열수단을 구비하는 것을 특징으로 하는 시스템 보드.
- 제3항에 있어서,동일한 전기적 특성을 가진 전원공급용 패드 및 더미 패드들에 연결된 방열수단은 상기 시스템 보드 상에서 서로 연결된 것을 특징으로 하는 시스템 보드.
- 제3항에 있어서,상기 방열수단과 상기 반도체 집적회로의 입출력 패드, 전용공급용 패드 및 더미패드와 상기 시스템 보드를 전기적으로 연결시키는데 사용하는 물질은, 상기 반도체 집적회로의 내부에서 사용하는 메탈라인과 동일한 성분을 가지는 것을 특징으로 하는 시스템 보드.
- 제5항에 있어서,상기 방열수단의 성분은 구리(Cu)인 것을 특징으로 하는 시스템 보드.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060131969A KR100798895B1 (ko) | 2006-12-21 | 2006-12-21 | 방열패턴을 구비하는 반도체 집적회로 |
US12/520,088 US20100027223A1 (en) | 2006-12-21 | 2007-11-26 | Semiconductor integrated circuit having heat release pattern |
JP2009542630A JP2010514197A (ja) | 2006-12-21 | 2007-11-26 | 放熱パターンを有する半導体集積回路 |
CN2007800446735A CN101563766B (zh) | 2006-12-21 | 2007-11-26 | 具有热量释出图案的半导体集成电路以及***板 |
PCT/KR2007/005979 WO2008075838A1 (en) | 2006-12-21 | 2007-11-26 | Semiconductor integrated circuit having heat release pattern |
TW096145014A TWI350580B (en) | 2006-12-21 | 2007-11-27 | Semiconductor integrated circuit having heat release pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060131969A KR100798895B1 (ko) | 2006-12-21 | 2006-12-21 | 방열패턴을 구비하는 반도체 집적회로 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100798895B1 true KR100798895B1 (ko) | 2008-01-29 |
Family
ID=39219596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060131969A KR100798895B1 (ko) | 2006-12-21 | 2006-12-21 | 방열패턴을 구비하는 반도체 집적회로 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100027223A1 (ko) |
JP (1) | JP2010514197A (ko) |
KR (1) | KR100798895B1 (ko) |
CN (1) | CN101563766B (ko) |
TW (1) | TWI350580B (ko) |
WO (1) | WO2008075838A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5067295B2 (ja) * | 2008-07-17 | 2012-11-07 | 大日本印刷株式会社 | センサ及びその製造方法 |
KR101113031B1 (ko) | 2009-09-25 | 2012-02-27 | 주식회사 실리콘웍스 | 드라이버 집적회로 칩의 패드 배치 구조 |
Citations (1)
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KR20030006472A (ko) * | 2001-07-13 | 2003-01-23 | 엘지이노텍 주식회사 | 반도체 패키지의 방열 장치 |
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JPS61125047A (ja) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | 半導体集積回路装置 |
US5384487A (en) * | 1993-05-05 | 1995-01-24 | Lsi Logic Corporation | Off-axis power branches for interior bond pad arrangements |
KR0170023B1 (ko) * | 1994-12-16 | 1999-02-01 | 황인길 | 반도체 패키지 |
US5650595A (en) * | 1995-05-25 | 1997-07-22 | International Business Machines Corporation | Electronic module with multiple solder dams in soldermask window |
US6031283A (en) * | 1996-09-09 | 2000-02-29 | Intel Corporation | Integrated circuit package |
JP4032443B2 (ja) * | 1996-10-09 | 2008-01-16 | セイコーエプソン株式会社 | 薄膜トランジスタ、回路、アクティブマトリクス基板、液晶表示装置 |
JPH10233473A (ja) * | 1996-10-16 | 1998-09-02 | Nkk Corp | 半導体素子の放熱構造とその放熱方法 |
KR19980045612A (ko) * | 1996-12-10 | 1998-09-15 | 김광호 | 냉각부를 가지는 반도체 칩 |
JP3779789B2 (ja) * | 1997-01-31 | 2006-05-31 | 株式会社ルネサステクノロジ | 半導体装置およびその製造方法 |
KR100483403B1 (ko) * | 1997-11-27 | 2005-08-10 | 삼성전자주식회사 | 표시장치용인쇄회로기판의패드패턴 |
TW462121B (en) * | 2000-09-19 | 2001-11-01 | Siliconware Precision Industries Co Ltd | Heat sink type ball grid array package |
US6597059B1 (en) * | 2001-04-04 | 2003-07-22 | Amkor Technology, Inc. | Thermally enhanced chip scale lead on chip semiconductor package |
KR100508682B1 (ko) * | 2002-11-20 | 2005-08-17 | 삼성전자주식회사 | 더미 와이어를 이용한 열방출형 적층 칩 패키지 |
US7109573B2 (en) * | 2003-06-10 | 2006-09-19 | Nokia Corporation | Thermally enhanced component substrate |
US6954360B2 (en) * | 2003-08-22 | 2005-10-11 | Nokia Corporation | Thermally enhanced component substrate: thermal bar |
JP4084737B2 (ja) * | 2003-11-20 | 2008-04-30 | 松下電器産業株式会社 | 半導体装置 |
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EP2007180A4 (en) * | 2006-03-14 | 2011-03-23 | Sharp Kk | PCB, ELECTRONIC CIRCUIT ARRANGEMENT AND DISPLAY |
KR100798896B1 (ko) * | 2007-06-07 | 2008-01-29 | 주식회사 실리콘웍스 | 반도체 칩의 패드 배치 구조 |
KR101361828B1 (ko) * | 2007-09-03 | 2014-02-12 | 삼성전자주식회사 | 반도체 디바이스, 반도체 패키지, 스택 모듈, 카드, 시스템및 반도체 디바이스의 제조 방법 |
US7787252B2 (en) * | 2008-12-04 | 2010-08-31 | Lsi Corporation | Preferentially cooled electronic device |
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2006
- 2006-12-21 KR KR1020060131969A patent/KR100798895B1/ko active IP Right Grant
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2007
- 2007-11-26 CN CN2007800446735A patent/CN101563766B/zh active Active
- 2007-11-26 JP JP2009542630A patent/JP2010514197A/ja active Pending
- 2007-11-26 US US12/520,088 patent/US20100027223A1/en not_active Abandoned
- 2007-11-26 WO PCT/KR2007/005979 patent/WO2008075838A1/en active Application Filing
- 2007-11-27 TW TW096145014A patent/TWI350580B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030006472A (ko) * | 2001-07-13 | 2003-01-23 | 엘지이노텍 주식회사 | 반도체 패키지의 방열 장치 |
Non-Patent Citations (1)
Title |
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한국특허공개공보 1020030006472호 |
Also Published As
Publication number | Publication date |
---|---|
CN101563766A (zh) | 2009-10-21 |
CN101563766B (zh) | 2010-12-01 |
WO2008075838A1 (en) | 2008-06-26 |
US20100027223A1 (en) | 2010-02-04 |
JP2010514197A (ja) | 2010-04-30 |
TWI350580B (en) | 2011-10-11 |
TW200830492A (en) | 2008-07-16 |
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