KR100776888B1 - 비정질 탄소막의 성막방법 - Google Patents
비정질 탄소막의 성막방법 Download PDFInfo
- Publication number
- KR100776888B1 KR100776888B1 KR1020060062101A KR20060062101A KR100776888B1 KR 100776888 B1 KR100776888 B1 KR 100776888B1 KR 1020060062101 A KR1020060062101 A KR 1020060062101A KR 20060062101 A KR20060062101 A KR 20060062101A KR 100776888 B1 KR100776888 B1 KR 100776888B1
- Authority
- KR
- South Korea
- Prior art keywords
- evaporation source
- film
- evaporation
- amorphous carbon
- magnetic field
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Carbon And Carbon Compounds (AREA)
- Glass Compositions (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
Claims (2)
- 비평형 마그네트론 스퍼터링 증발원을 2개 이상, 또는 비평형 마그네트론 스퍼터링 증발원 및 자장 인가식 아크 방전 증발원을 각각 1개 이상 준비하는 단계; 및스퍼터링용 불활성 기체와 탄소 함유 기체의 혼합 기체의 분위기에서 상기 증발원 중 1개 이상의 비평형 마그네트론 스퍼터링 증발원의 스퍼터링 타겟재로서 고체 탄소를 사용하는 단계를 포함하는 비정질 탄소막의 성막방법으로서,상기 증발원 각각의 자장을 상기 각각의 증발원에 인접한 증발원의 자장과 극성이 상반되게 하고, 펄스 바이어스를 50 내지 400kHz 범위의 주파수로 각각의 비평형 마그네트론 스퍼터링 증발원에 부여하는 것을 특징으로 하는비정질 탄소막의 성막방법.
- 제 1 항에 있어서,펄스 전위가 50 내지 80% 범위의 듀티 사이클로 부여되는 비정질 탄소막의 성막방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00195303 | 2005-07-04 | ||
JP2005195303A JP4607687B2 (ja) | 2005-07-04 | 2005-07-04 | 非晶質炭素膜の成膜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070004449A KR20070004449A (ko) | 2007-01-09 |
KR100776888B1 true KR100776888B1 (ko) | 2007-11-19 |
Family
ID=36716897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060062101A KR100776888B1 (ko) | 2005-07-04 | 2006-07-03 | 비정질 탄소막의 성막방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070000770A1 (ko) |
EP (1) | EP1741801B1 (ko) |
JP (1) | JP4607687B2 (ko) |
KR (1) | KR100776888B1 (ko) |
AT (1) | ATE439456T1 (ko) |
DE (1) | DE602006008389D1 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0608582D0 (en) * | 2006-05-02 | 2006-06-07 | Univ Sheffield Hallam | High power impulse magnetron sputtering vapour deposition |
KR100796766B1 (ko) * | 2006-05-29 | 2008-01-22 | (주)레드로버 | 프로젝션용 스테레오 광학엔진 구조 |
KR100893675B1 (ko) * | 2007-05-11 | 2009-04-17 | 주식회사 테스 | 비정질 탄소막 형성 방법 및 이를 이용한 반도체 소자의제조 방법 |
WO2009052874A1 (en) * | 2007-10-26 | 2009-04-30 | Hauzer Techno Coating Bv | Dual magnetron sputtering power supply and magnetron sputtering apparatus |
WO2009079358A1 (en) * | 2007-12-14 | 2009-06-25 | The Regents Of The University Of California | Very low pressure high power impulse triggered magnetron sputtering |
WO2012078151A1 (en) | 2010-12-08 | 2012-06-14 | Galleon International Corporation | Hard and low friction nitride coatings |
US20140083814A1 (en) * | 2011-02-22 | 2014-03-27 | Glory Ltd. | Money handling apparatus, money handling system, money transport cassette, banknote handling apparatus and banknote handling method |
US9761424B1 (en) | 2011-09-07 | 2017-09-12 | Nano-Product Engineering, LLC | Filtered cathodic arc method, apparatus and applications thereof |
US10304665B2 (en) | 2011-09-07 | 2019-05-28 | Nano-Product Engineering, LLC | Reactors for plasma-assisted processes and associated methods |
JP5713872B2 (ja) * | 2011-10-28 | 2015-05-07 | 株式会社神戸製鋼所 | 成膜装置及び成膜方法 |
CN102719799A (zh) * | 2012-06-08 | 2012-10-10 | 深圳市华星光电技术有限公司 | 旋转磁控溅射靶及相应的磁控溅射装置 |
CN104328380A (zh) * | 2014-07-31 | 2015-02-04 | 宁夏天马滚动体制造有限公司 | 轴承滚柱非平衡磁控溅射离子镀装置及方法 |
US11834204B1 (en) | 2018-04-05 | 2023-12-05 | Nano-Product Engineering, LLC | Sources for plasma assisted electric propulsion |
WO2020187744A1 (en) * | 2019-03-15 | 2020-09-24 | Nanofilm Technologies International Pte Ltd | Improved coating processes |
CN114717512B (zh) * | 2022-04-21 | 2023-02-28 | 中国科学院兰州化学物理研究所 | 一种自适应长效润滑性能金/碳复合薄膜的制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003247060A (ja) * | 2001-12-17 | 2003-09-05 | Sumitomo Electric Ind Ltd | 非晶質炭素被膜の製造方法及び非晶質炭素被覆摺動部品 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9006073D0 (en) * | 1990-03-17 | 1990-05-16 | D G Teer Coating Services Limi | Magnetron sputter ion plating |
JPH06145975A (ja) * | 1992-03-20 | 1994-05-27 | Komag Inc | 炭素フィルムをスパタリングする方法及びその製造物 |
DE19651615C1 (de) * | 1996-12-12 | 1997-07-10 | Fraunhofer Ges Forschung | Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern |
DE19740793C2 (de) * | 1997-09-17 | 2003-03-20 | Bosch Gmbh Robert | Verfahren zur Beschichtung von Oberflächen mittels einer Anlage mit Sputterelektroden und Verwendung des Verfahrens |
US6726993B2 (en) * | 1997-12-02 | 2004-04-27 | Teer Coatings Limited | Carbon coatings, method and apparatus for applying them, and articles bearing such coatings |
JP3172139B2 (ja) * | 1998-08-04 | 2001-06-04 | 富士写真フイルム株式会社 | サーマルヘッド |
US6338777B1 (en) * | 1998-10-23 | 2002-01-15 | International Business Machines Corporation | Method and apparatus for sputtering thin films |
JP2001150351A (ja) * | 1999-11-19 | 2001-06-05 | Noritake Diamond Ind Co Ltd | ドレッシング用電着砥石 |
JP4615697B2 (ja) * | 2000-11-07 | 2011-01-19 | ティーア、コーティングズ、リミテッド | 炭素含有被覆を施した物品 |
JP2002367138A (ja) * | 2001-06-07 | 2002-12-20 | Fujitsu Ltd | 磁気情報記録媒体 |
JP2004285440A (ja) * | 2003-03-24 | 2004-10-14 | Daiwa Kogyo Kk | Hcd・ubmsハイブリッドpvd法およびその装置 |
JP2005138208A (ja) * | 2003-11-05 | 2005-06-02 | Sumitomo Electric Hardmetal Corp | 表面被覆切削工具とその作製方法 |
-
2005
- 2005-07-04 JP JP2005195303A patent/JP4607687B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-31 US US11/421,240 patent/US20070000770A1/en not_active Abandoned
- 2006-06-06 AT AT06011694T patent/ATE439456T1/de not_active IP Right Cessation
- 2006-06-06 DE DE602006008389T patent/DE602006008389D1/de active Active
- 2006-06-06 EP EP06011694A patent/EP1741801B1/en not_active Expired - Fee Related
- 2006-07-03 KR KR1020060062101A patent/KR100776888B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003247060A (ja) * | 2001-12-17 | 2003-09-05 | Sumitomo Electric Ind Ltd | 非晶質炭素被膜の製造方法及び非晶質炭素被覆摺動部品 |
Also Published As
Publication number | Publication date |
---|---|
KR20070004449A (ko) | 2007-01-09 |
ATE439456T1 (de) | 2009-08-15 |
DE602006008389D1 (de) | 2009-09-24 |
EP1741801B1 (en) | 2009-08-12 |
EP1741801A3 (en) | 2007-09-05 |
US20070000770A1 (en) | 2007-01-04 |
JP4607687B2 (ja) | 2011-01-05 |
EP1741801A2 (en) | 2007-01-10 |
JP2007009310A (ja) | 2007-01-18 |
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