KR100704067B1 - 광원 장치, 광원 장치 제조 방법 및 프로젝터 - Google Patents
광원 장치, 광원 장치 제조 방법 및 프로젝터 Download PDFInfo
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- KR100704067B1 KR100704067B1 KR1020050011110A KR20050011110A KR100704067B1 KR 100704067 B1 KR100704067 B1 KR 100704067B1 KR 1020050011110 A KR1020050011110 A KR 1020050011110A KR 20050011110 A KR20050011110 A KR 20050011110A KR 100704067 B1 KR100704067 B1 KR 100704067B1
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Classifications
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/208—Homogenising, shaping of the illumination light
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/315—Modulator illumination systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0026—Wavelength selective element, sheet or layer, e.g. filter or grating
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Projection Apparatus (AREA)
- Led Device Packages (AREA)
- Optical Couplings Of Light Guides (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (14)
- 사전 결정된 파장 영역의 광을 공급하는 고체 발광 칩과,상기 고체 발광 칩을 지지하는 고체 발광 칩 지지부와,상기 고체 발광 칩으로부터의 광을 반사시켜 조명 방향으로 사출하는 광 가이드와,상기 광 가이드를 지지하는 광 가이드 지지부를 갖되,상기 고체 발광 칩의 사출면과 상기 광 가이드의 입사면은 사전 결정된 간격을 두어 마련되는 것을 특징으로 하는 광원 장치.
- 제 1 항에 있어서,상기 사전 결정된 간격의 공간 내에 충전되어 있는 광학적 투명 유연재를 더 갖고,상기 광학적 투명 유연재의 굴절율은 상기 광 가이드를 구성하는 부재의 굴절율과 같은 것을 특징으로 하는 광원 장치.
- 제 1 항 또는 제 2 항에 있어서,상기 광 가이드는 적어도 상기 광 가이드 지지부와 접하는 부분에 상기 사전 결정된 파장 영역의 광을 반사하는 반사막을 갖는 것을 특징으로 하는 광원 장치.
- 제 3 항에 있어서,상기 광 가이드는 광이 진행되는 방향을 따른 면의 모든 영역에 상기 반사막이 형성되어 있는 것을 특징으로 하는 광원 장치.
- 제 1 항 또는 제 2 항에 있어서,상기 광 가이드 지지부는 상기 광 가이드와 접하는 영역에 반사면이 형성되어 있는 것을 특징으로 하는 광원 장치.
- 제 1 항에 있어서,상기 고체 발광 칩 지지부는 상기 고체 발광 칩에서 발생하는 열을 저감하기 위한 히트 싱크(heat sink)와, 상기 고체 발광 칩을 구동하기 위한 전극을 갖는 것을 특징으로 하는 광원 장치.
- 제 1 항에 있어서,상기 광 가이드는 사출 단면이 입사 단면보다 큰 테이퍼 형상, 또는 상기 입사 단면과 상기 사출 단면이 같은 통 형상을 갖고,상기 광 가이드의 상기 입사 단면은 상기 고체 발광 칩의 사출면과 동일, 또는 상기 사출면보다 큰 것을 특징으로 하는 광원 장치.
- 제 1 항에 있어서,상기 고체 발광 칩은 상기 발광 영역의 법선 방향에 직교하는 방향에 측면을 갖고,상기 고체 발광 칩 지지부는 상기 측면에 대향하는 면에 반사부가 형성되어 있는 것을 특징으로 하는 광원 장치.
- 제 8 항에 있어서,상기 광 가이드의 상기 입사 단면은 상기 고체 발광 칩의 상기 사출면과 상기 반사부를 포함시킨 영역과 동일, 또는 상기 영역보다 큰 것을 특징으로 하는 광원 장치.
- 제 1 항에 있어서,상기 고체 발광 칩의 사출면은 제 1 변과, 상기 제 1 변과 같거나 이보다 짧은 제 2 변을 갖는 직사각형 형상이며,상기 사전 결정된 간격은 상기 제 2 변의 길이보다 짧은 것을 특징으로 하는 광원 장치.
- 사전 결정된 파장 영역의 광을 공급하는 고체 발광 칩을 지지하는 고체 발광 칩 지지 공정과,상기 고체 발광 칩으로부터의 광을 반사시켜 조명 방향으로 사출하는 광 가이드를 지지하는 광 가이드 지지 공정과,고체 발광 칩 지지부와 광 가이드 지지부를 고정하는 공정을 포함하는 것을 특징으로 하는 광원 장치 제조 방법.
- 제 11 항에 있어서,상기 고체 발광 칩의 위치와 상기 광 가이드의 위치를 일치시키는 위치 조정 공정을 더 포함하는 것을 특징으로 하는 광원 장치 제조 방법.
- 제 11 항 또는 제 12 항에 있어서,상기 고체 발광 칩의 사출 단면과 상기 광 가이드의 입사면 사이에 광학적 투명 물질을 충전하는 투명 물질 충전 공정을 더 포함하는 것을 특징으로 하는 광원 장치 제조 방법.
- 청구항 1에 기재된 광원 장치와,상기 광원 장치로부터의 광을 화상 신호에 따라 변조하는 공간 광 변조 장치와,상기 변조된 광을 투사하는 투사 렌즈를 갖는 것을 특징으로 하는 프로젝터.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2004-00033484 | 2004-02-10 | ||
JP2004033484A JP2005227339A (ja) | 2004-02-10 | 2004-02-10 | 光源装置、光源装置製造方法、及びプロジェクタ |
Publications (2)
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KR20060041795A KR20060041795A (ko) | 2006-05-12 |
KR100704067B1 true KR100704067B1 (ko) | 2007-04-05 |
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Country Status (5)
Country | Link |
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US (1) | US7390129B2 (ko) |
JP (1) | JP2005227339A (ko) |
KR (1) | KR100704067B1 (ko) |
CN (1) | CN100495100C (ko) |
TW (1) | TWI278127B (ko) |
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US7329982B2 (en) * | 2004-10-29 | 2008-02-12 | 3M Innovative Properties Company | LED package with non-bonded optical element |
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JP2005227339A (ja) | 2005-08-25 |
US7390129B2 (en) | 2008-06-24 |
TWI278127B (en) | 2007-04-01 |
CN100495100C (zh) | 2009-06-03 |
TW200527725A (en) | 2005-08-16 |
CN1655052A (zh) | 2005-08-17 |
US20050173719A1 (en) | 2005-08-11 |
KR20060041795A (ko) | 2006-05-12 |
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