KR100661044B1 - 전자 장치 - Google Patents
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- KR100661044B1 KR100661044B1 KR1020057009038A KR20057009038A KR100661044B1 KR 100661044 B1 KR100661044 B1 KR 100661044B1 KR 1020057009038 A KR1020057009038 A KR 1020057009038A KR 20057009038 A KR20057009038 A KR 20057009038A KR 100661044 B1 KR100661044 B1 KR 100661044B1
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Abstract
Description
Claims (17)
- 메탈 코어 인터포저 기판이, 메탈 베이스 기판 또는 메탈 코어 기판 마더 보드 상에 땜납으로 접속되어 있는 구조에서,상기 마더 보드는, 베이스 메탈 또는 코어 메탈이 노출하고 있는 영역을 가지고,그 노출하고 있는 베이스 메탈 또는 코어 메탈과 상기 메탈 코어 인터포저 기판의 패드가 땜납으로 접속되어 있는 것을 특징으로 하는 전자 장치.
- 제1항에 있어서,상기 메탈 코어 인터포저 기판은, 코어 메탈 상에 절연층이 없는 영역을 가지고,그 영역에 반도체 칩이 다이 본딩되어 있는 것을 특징으로 하는 전자 장치.
- 제1항에 있어서,상기 메탈 코어 인터포저 기판은, 코어 메탈이 노출한 영역을 가지고,그 코어 메탈이 노출한 영역에 반도체 칩이 다이 본딩되어 있는 것을 특징으로 하는 전자 장치.
- 제1항 내지 제3항 중 어느 한 항에 있어서,상기 마더 보드는, 인터포저 기판 비탑재면 측의 일부에, 코어 메탈이 노출되어 있는 영역을 갖는 것을 특징으로 하는 전자 장치.
- 제1항 내지 제3항 중 어느 한 항에 있어서,상기 마더 보드는, 인터포저 기판 비탑재면 측의 일부에, 코어 메탈 상의 절연층이 제거되어 있는 영역을 갖는 것을 특징으로 하는 전자 장치.
- 제1항 내지 제3항 중 어느 한 항에 있어서.상기 마더 보드의 인터포저 기판 비탑재면과 케이싱 사이에, 상기 마더 보드와 상기 케이싱을 접착하고 있는 접착제보다도 열전도율이 큰 부재를 포함하고 있는 것을 특징으로 하는 전자 장치.
- 삭제
- 메탈 코어 기판이 인터포저 기판으로서 마더 보드에 탑재된 전자 장치로서,상기 인터포저 기판의 코어 메탈 상의 절연층이 제거되어 있고,상기 인터포저 기판의 코어 메탈과 상기 마더 보드는, 상기 절연층이 제거된 영역 내에 있는 땜납으로 접속되어 있는 것을 특징으로 하는 전자 장치.
- 제8항에 있어서,상기 인터포저 기판에는, 전자 부품이 탑재되어 있고,상기 인터포저 기판과 상기 마더 보드의 접속은, 신호를 전달하기 위한 접속과, 방열용의 접속이 있으며,상기 신호를 전달하기 위한 접속은, 절연층 상에 형성된 땜납 접속용 패드를 이용하여 이루어져 있고,상기 방열용의 접속은, 상기 코어 메탈 상에 형성된 땜납 접속용 패드를 이용하여 이루어져 있는 것을 특징으로 하는 전자 장치.
- 제9항에 있어서,상기 마더 보드는, 금속을 베이스로 하는 편면 배선 기판이고,상기 메탈 베이스 기판에 방열용으로 형성된 베이스 메탈 노출 영역의 땜납 접속용의 패드와, 상기 인터포저 기판의 코어 메탈 상의 땜납 접속용 패드가 접속되어 있는 것을 특징으로 하는 전자 장치.
- 제9항에 있어서,상기 마더 보드가, 금속판을 코어로 하여 코어 메탈 양면에 배선층을 포함한 메탈 코어 기판이고,상기 메탈 코어 기판에 방열용으로 형성된 코어 메탈 노출 영역에 땜납 접속용의 패드가 형성되고, 그 땜납 접속용 패드와 상기 인터포저 기판의 코어 메탈 상의 땜납 접속용 패드가 접속되어 있는 것을 특징으로 하는 전자 장치
- 제11항에 있어서,상기 마더 보드의 부품 비탑재면 측에 방열용의 카운터 보어(counterbore)가 형성되어 있는 것을 특징으로 하는 전자 장치.
- 제12항에 있어서,상기 마더 보드의 부품 비탑재면 측의 방열용 카운터 보어부 코어 메탈 노출 부분과 금속 케이싱 사이에, 상기 마더 보드의 부품 비탑재면과 상기 금속 케이싱의 접착에 사용한 접착제보다도 열전도율이 큰 부재가 충전된 전자 장치.
- LSI와,코어 메탈의 표리에 절연층과 배선층이 형성된 메탈 코어 기판으로 구성된 인터포저 기판과,메탈 코어 기판 또는 베이스 메탈의 표면에 절연층과 배선층이 형성된 메탈 베이스 기판으로 구성된 마더 보드를 갖는 전자 장치로서,상기 LSI는, 상기 인터포저 기판의 코어 메탈이 노출되어 있는 부분에 접착되고, 또한, 와이어 본딩에 의해 상기 인터포저 기판의 전극과 접속되어 있고,상기 인터포저 기판은, 상기 마더 보드 측의 면의, 상기 코어 메탈이 노출되어 있는 부분에 방열용 패드를 포함하고,상기 마더 보드는, 상기 인터포저 기판측의 면의, 상기 코어 메탈 또는 상기 베이스 메탈이 노출되어 있는 부분에 방열용 패드를 포함하고,상기 인터포저 기판의 방열용 패드와 상기 마더 보드의 방열용 패드는, 땜납으로 접속되어 있는 것을 특징으로 하는 전자 장치.
- 제14항에 있어서,상기 인터포저 기판은, 그 인터포저 기판의 상기 배선층에 형성된 신호용 패드를 포함하고,상기 마더 보드는, 그 마더 보드의 상기 배선층에 형성된 신호용 패드를 포함하고,상기 방열용 패드는, 상기 인터포저 기판의 상기 신호용 패드 및 상기 마더 보드의 상기 신호용 패드보다도 작은 것을 특징으로 하는 전자 장치.
- 제15항에 있어서,동일한 크기의 땜납 볼의 용융에 의해 형성된 땜납 범프에 의해, 상기 인터포저 기판 및 상기 마더 보드의 상기 신호용 패드 사이, 상기 인터포저 기판 및 상기 마더 보드의 상기 방열용 패드 사이가 각각 접속되어 있는 것을 특징으로 하는 전자 장치.
- 메탈 코어 인터포저 기판이 메탈 베이스 기판 또는 메탈 코어 기판 마더 보드에 땜납으로 접속되어 있는 구조를 가지며,상기 마더 보드의 인터포저 기판 비탑재면과 케이싱이 접착제에 의해 접착되고,상기 마더 보드의 인터포저 기판 비탑재면과 상기 케이싱 사이에, 상기 접착제보다도 열전도율이 큰 부재를 포함하고 있는 것을 특징으로 하는 전자 장치.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JP2002337365A JP3938017B2 (ja) | 2002-11-21 | 2002-11-21 | 電子装置 |
JP2002337366A JP3988629B2 (ja) | 2002-11-21 | 2002-11-21 | 電子装置 |
JPJP-P-2002-00337366 | 2002-11-21 | ||
JPJP-P-2002-00337365 | 2002-11-21 | ||
PCT/JP2003/007862 WO2004047168A1 (ja) | 2002-11-21 | 2003-06-20 | 電子装置 |
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KR20050075032A KR20050075032A (ko) | 2005-07-19 |
KR100661044B1 true KR100661044B1 (ko) | 2006-12-26 |
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US (1) | US7554039B2 (ko) |
EP (1) | EP1571706B1 (ko) |
KR (1) | KR100661044B1 (ko) |
CN (1) | CN100378968C (ko) |
AU (1) | AU2003244322A1 (ko) |
WO (1) | WO2004047168A1 (ko) |
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JP2007158279A (ja) * | 2005-12-09 | 2007-06-21 | Hitachi Ltd | 半導体装置及びそれを用いた電子制御装置 |
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TW200919685A (en) * | 2007-10-17 | 2009-05-01 | Phoenix Prec Technology Corp | Package on package(pop) structure |
US20090115045A1 (en) * | 2007-11-02 | 2009-05-07 | Phoenix Precision Technology Corporation | Stacked package module and method for fabricating the same |
US7939940B2 (en) * | 2007-12-18 | 2011-05-10 | Omnivision Technologies, Inc. | Multilayer chip scale package |
TWI573201B (zh) * | 2008-07-18 | 2017-03-01 | 聯測總部私人有限公司 | 封裝結構性元件 |
JP5290215B2 (ja) * | 2010-02-15 | 2013-09-18 | ルネサスエレクトロニクス株式会社 | 半導体装置、半導体パッケージ、インタポーザ、及びインタポーザの製造方法 |
US8772817B2 (en) | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
KR101431918B1 (ko) * | 2012-12-31 | 2014-08-19 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 표면처리방법 |
WO2017017885A1 (ja) * | 2015-07-24 | 2017-02-02 | 日本電気株式会社 | 実装構造体、実装構造体の製造方法、無線機 |
JP2017139316A (ja) * | 2016-02-03 | 2017-08-10 | ソニー株式会社 | 半導体装置および製造方法、並びに電子機器 |
FR3049156B1 (fr) * | 2016-03-15 | 2018-04-13 | Alstom Transport Technologies | Carte electronique comprenant un circuit intercalaire en matrice de billes |
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JP2020009879A (ja) * | 2018-07-06 | 2020-01-16 | 太陽誘電株式会社 | 回路基板および回路モジュール |
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TWI806218B (zh) * | 2021-11-03 | 2023-06-21 | 群光電子股份有限公司 | 電子裝置及其電路板模組 |
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2003
- 2003-06-20 WO PCT/JP2003/007862 patent/WO2004047168A1/ja active Application Filing
- 2003-06-20 EP EP03811481.5A patent/EP1571706B1/en not_active Expired - Fee Related
- 2003-06-20 AU AU2003244322A patent/AU2003244322A1/en not_active Abandoned
- 2003-06-20 US US10/535,857 patent/US7554039B2/en not_active Expired - Fee Related
- 2003-06-20 KR KR1020057009038A patent/KR100661044B1/ko active IP Right Grant
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CN100378968C (zh) | 2008-04-02 |
US20060234420A1 (en) | 2006-10-19 |
EP1571706B1 (en) | 2018-09-12 |
CN1701437A (zh) | 2005-11-23 |
AU2003244322A1 (en) | 2004-06-15 |
EP1571706A1 (en) | 2005-09-07 |
KR20050075032A (ko) | 2005-07-19 |
US7554039B2 (en) | 2009-06-30 |
EP1571706A4 (en) | 2008-08-06 |
WO2004047168A1 (ja) | 2004-06-03 |
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