KR100621991B1 - 칩 스케일 적층 패키지 - Google Patents
칩 스케일 적층 패키지 Download PDFInfo
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- KR100621991B1 KR100621991B1 KR1020030000281A KR20030000281A KR100621991B1 KR 100621991 B1 KR100621991 B1 KR 100621991B1 KR 1020030000281 A KR1020030000281 A KR 1020030000281A KR 20030000281 A KR20030000281 A KR 20030000281A KR 100621991 B1 KR100621991 B1 KR 100621991B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (7)
- 일면에 형성된 볼 랜드패드들과 그에 연결되어 형성된 회로패턴을 포함하며 관통구멍이 형성된 서브스트레이트(substrate)와, 그 서브스트레이트의 관통구멍에 본딩패드가 위치하도록 서브스트레이트의 다른 면에 부착된 반도체 칩과, 본딩패드와 그에 대응되는 회로패턴을 관통구멍을 경유하여 상호 연결시키는 본딩와이어와, 반도체 칩을 봉지하는 제 1봉지부와, 본딩와이어 및 그 접합 부분을 봉지하는 제 2봉지부를 포함하는 단위 랜드 그리드 어레이 패키지들 두 개가 볼 랜드패드가 서로 반대방향을 향하도록 적층되어 부착되어 있는 칩 스케일 적층 패키지로서, 적층된 단위 랜드 그리드 어레이 패키지들은 볼 랜드패드가 서로 미러(mirror) 상으로 형성되어 있고 각각의 회로패턴들이 금속 배선이 형성된 연결 기판의 상기 금속 배선에 접합되어 의해 전기적으로 상호 연결되어 있으며, 하위 랜드 그리드 어레이 패키지의 볼 랜드패드에 외부접속단자가 부착된 것을 특징으로 하는 칩 스케일 적층 패키지.
- 제 1항에 있어서, 상기 반도체 칩은 센터패드형 반도체 칩인 것을 특징으로 하는 칩 스케일 적층 패키지.
- 제 1항에 있어서, 상기 상위 단위 칩 스케일 패키지의 상부에 상기 하위 단위 칩 스케일 패키지와 동일한 단위 칩 스케일 패키지가 볼 랜드패드에 볼이 부착되어 더 적층되어 있는 것을 특징으로 하는 칩 스케일 적층 패키지.
- 제 1항에 있어서, 상기 칩 스케일 적층 패키지 상부에 동일한 칩 스케일 적층 패키지가 볼 랜드패드에 볼이 부착되어 적어도 하나 이상 더 적층되어 있는 것을 특징으로 하는 칩 스케일 적층 패키지.
- 제 1항에 있어서, 상기 연결 기판은 베이스 필름에 금속배선이 형성된 유연성 회로 기판인 것을 특징으로 하는 칩 스케일 적층 패키지.
- 제 1항에 있어서, 상기 연결 기판은 "ㄷ"자 형태인 것을 특징으로 하는 칩 스케일 적층 패키지.
- 제 1항에 있어서, 상기 단위 칩 스케일 패키지들은 제 1봉지부들이 접착제로 부착된 것을 특징으로 하는 칩 스케일 적층 패키지.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030000281A KR100621991B1 (ko) | 2003-01-03 | 2003-01-03 | 칩 스케일 적층 패키지 |
US10/750,979 US7190061B2 (en) | 2003-01-03 | 2004-01-02 | stack package made of chip scale packages |
US11/536,611 US7479408B2 (en) | 2003-01-03 | 2006-09-28 | Stack package made of chip scale packages |
US12/338,905 US7843053B2 (en) | 2003-01-03 | 2008-12-18 | Stack package made of chip scale packages |
US12/683,861 US8299593B2 (en) | 2003-01-03 | 2010-01-07 | Stack package made of chip scale packages |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030000281A KR100621991B1 (ko) | 2003-01-03 | 2003-01-03 | 칩 스케일 적층 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040062764A KR20040062764A (ko) | 2004-07-09 |
KR100621991B1 true KR100621991B1 (ko) | 2006-09-13 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020030000281A KR100621991B1 (ko) | 2003-01-03 | 2003-01-03 | 칩 스케일 적층 패키지 |
Country Status (2)
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US (4) | US7190061B2 (ko) |
KR (1) | KR100621991B1 (ko) |
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2003
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2004
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US7190061B2 (en) | 2007-03-13 |
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US7843053B2 (en) | 2010-11-30 |
US20040201087A1 (en) | 2004-10-14 |
KR20040062764A (ko) | 2004-07-09 |
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