KR100582392B1 - 반도체메모리소자 - Google Patents
반도체메모리소자 Download PDFInfo
- Publication number
- KR100582392B1 KR100582392B1 KR1020040113610A KR20040113610A KR100582392B1 KR 100582392 B1 KR100582392 B1 KR 100582392B1 KR 1020040113610 A KR1020040113610 A KR 1020040113610A KR 20040113610 A KR20040113610 A KR 20040113610A KR 100582392 B1 KR100582392 B1 KR 100582392B1
- Authority
- KR
- South Korea
- Prior art keywords
- voltage
- power supply
- level
- supply voltage
- precharge
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 230000004044 response Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 13
- 238000010248 power generation Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000013256 coordination polymer Substances 0.000 description 5
- 230000003321 amplification Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- YJCDGKMVAYETOP-UHFFFAOYSA-N BL V Chemical compound CC(=O)OC1=C(OC(C)=O)C(C2=CC(O)=C(O)C=C2O2)=C2C(O)=C1C1=CC=C(O)C=C1 YJCDGKMVAYETOP-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/406—Management or control of the refreshing or charge-regeneration cycles
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4074—Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4094—Bit-line management or control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/021—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in voltage or current generators
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/028—Detection or location of defective auxiliary circuits, e.g. defective refresh counters with adaption or trimming of parameters
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/12—Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/401—Indexing scheme relating to cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C2211/406—Refreshing of dynamic cells
- G11C2211/4068—Voltage or leakage in refresh operations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Dram (AREA)
Abstract
Description
Claims (3)
- 외부 전원전압을 인가받아 제1 전원전압을 생성하기 위한 제1 전원전압 생성수단; 및상기 제1 전원전압의 하프 전압레벨을 갖는 프리차지전압을 드라이빙하기 위한 제1 전원전압 하프 드라이버와, 상기 프리차지전압의 기대되는 레벨을 갖는 기준전압을 생성하기 위한 기준전압 생성부와, 상기 기준전압에 대응하는 레벨이 유지되도록 상기 프리차지전압의 공급단을 풀다운 구동하기 위한 풀다운 구동부를 구비하는 프리차지전압 생성수단을 구비하는 반도체메모리소자.
- 제1항에 있어서,상기 풀다운 구동부는,상기 기준전압에 대한 상기 프리차지전압의 레벨을 감지하여 레벨 감지신호를 출력하기 위한 레벨 감지부와,파워업신호에 응답하여 상기 레벨 감지부를 초기화 시키기 위한 초기화부와,상기 레벨 감지신호에 응답하여 상기 프리차지전압의 공급단을 풀다운 구동하기 위한 풀다운 드라이버를 구비하는 것을 특징으로 하는 반도체메모리소자.
- 제2항에 있어서,상기 풀다운 드라이버는,상기 레벨 감지신호를 게이트 입력으로 가지며 상기 프리차지전압의 공급단과 제2 전원전압의 공급단 사이에 드레인-소스 경로를 갖는 NMOS트랜지스터로 구현되는 것을 특징으로 하는 반도체메모리소자.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040113610A KR100582392B1 (ko) | 2004-12-28 | 2004-12-28 | 반도체메모리소자 |
US11/149,788 US7203119B2 (en) | 2004-12-28 | 2005-06-09 | Semiconductor memory device |
TW094119062A TWI276114B (en) | 2004-12-28 | 2005-06-09 | Semiconductor memory device |
US11/704,073 US7372762B2 (en) | 2004-12-28 | 2007-02-07 | Semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040113610A KR100582392B1 (ko) | 2004-12-28 | 2004-12-28 | 반도체메모리소자 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100582392B1 true KR100582392B1 (ko) | 2006-05-22 |
Family
ID=36611314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040113610A KR100582392B1 (ko) | 2004-12-28 | 2004-12-28 | 반도체메모리소자 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7203119B2 (ko) |
KR (1) | KR100582392B1 (ko) |
TW (1) | TWI276114B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100827512B1 (ko) | 2006-12-12 | 2008-05-06 | 주식회사 하이닉스반도체 | 반도체 메모리 장치 |
US9135961B2 (en) | 2014-02-10 | 2015-09-15 | SK Hynix Inc. | Semiconductor memory apparatus, and reference voltage control circuit and internal voltage generation circuit therefor |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100582392B1 (ko) * | 2004-12-28 | 2006-05-22 | 주식회사 하이닉스반도체 | 반도체메모리소자 |
US7580287B2 (en) * | 2005-09-01 | 2009-08-25 | Micron Technology, Inc. | Program and read trim setting |
KR100780623B1 (ko) | 2006-06-30 | 2007-11-29 | 주식회사 하이닉스반도체 | 반도체 소자의 내부전압 생성장치 |
KR100816729B1 (ko) * | 2006-09-28 | 2008-03-25 | 주식회사 하이닉스반도체 | 코어전압 생성 장치 및 그를 포함하는 반도체 메모리 장치 |
US7782697B2 (en) * | 2007-04-24 | 2010-08-24 | Novelics, Llc. | DRAM with hybrid sense amplifier |
US7869277B1 (en) | 2007-04-25 | 2011-01-11 | Apple Inc. | Managing data writing to memories |
TWI381394B (zh) * | 2008-06-09 | 2013-01-01 | Promos Technologies Inc | 動態隨機存取記憶體之資料感測方法 |
CN102196940B (zh) * | 2008-10-31 | 2013-09-25 | 丰田自动车株式会社 | 电动车辆的电源***及其控制方法 |
KR101090393B1 (ko) | 2009-09-30 | 2011-12-07 | 주식회사 하이닉스반도체 | 테스트 회로, 이를 이용한 반도체 메모리 장치 및 테스트 방법 |
EP3641381B1 (en) | 2018-10-16 | 2021-12-01 | Rohde & Schwarz GmbH & Co. KG | Method and system for providing transparent communication |
US10867684B1 (en) * | 2019-08-29 | 2020-12-15 | Micron Technology, Inc. | Driving access lines to target voltage levels |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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WO1990016069A1 (en) * | 1989-06-12 | 1990-12-27 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
GB2259589A (en) * | 1991-09-12 | 1993-03-17 | Motorola Inc | Self - timed random access memories |
JP3266141B2 (ja) * | 1999-05-26 | 2002-03-18 | 日本電気株式会社 | 半導体記憶装置 |
JP2002373495A (ja) * | 2001-06-14 | 2002-12-26 | Hitachi Ltd | 半導体チップ、半導体集積回路装置及び半導体集積回路装置の製造方法 |
KR100419992B1 (ko) * | 2002-01-12 | 2004-02-26 | 삼성전자주식회사 | 유니-트랜지스터 랜덤 액세스 메모리 장치 및 그것의읽기, 쓰기 그리고 리프레쉬 방법 |
JP2003228981A (ja) * | 2002-02-05 | 2003-08-15 | Toshiba Corp | 半導体記憶装置 |
WO2003073433A1 (fr) * | 2002-02-28 | 2003-09-04 | Renesas Technology Corp. | Memoire a semi-conducteurs non volatile |
JP4370100B2 (ja) * | 2003-01-10 | 2009-11-25 | パナソニック株式会社 | 半導体記憶装置 |
JP4119773B2 (ja) * | 2003-03-06 | 2008-07-16 | 松下電器産業株式会社 | 半導体記憶装置および半導体装置 |
JP4342383B2 (ja) * | 2004-06-22 | 2009-10-14 | 株式会社東芝 | 半導体記憶装置 |
US7236415B2 (en) * | 2004-09-01 | 2007-06-26 | Micron Technology, Inc. | Sample and hold memory sense amplifier |
KR100582392B1 (ko) * | 2004-12-28 | 2006-05-22 | 주식회사 하이닉스반도체 | 반도체메모리소자 |
-
2004
- 2004-12-28 KR KR1020040113610A patent/KR100582392B1/ko active IP Right Grant
-
2005
- 2005-06-09 US US11/149,788 patent/US7203119B2/en active Active
- 2005-06-09 TW TW094119062A patent/TWI276114B/zh active
-
2007
- 2007-02-07 US US11/704,073 patent/US7372762B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100827512B1 (ko) | 2006-12-12 | 2008-05-06 | 주식회사 하이닉스반도체 | 반도체 메모리 장치 |
US9135961B2 (en) | 2014-02-10 | 2015-09-15 | SK Hynix Inc. | Semiconductor memory apparatus, and reference voltage control circuit and internal voltage generation circuit therefor |
Also Published As
Publication number | Publication date |
---|---|
TWI276114B (en) | 2007-03-11 |
US20060140019A1 (en) | 2006-06-29 |
US7203119B2 (en) | 2007-04-10 |
US20070133336A1 (en) | 2007-06-14 |
US7372762B2 (en) | 2008-05-13 |
TW200623144A (en) | 2006-07-01 |
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