KR100537084B1 - 감광성 수지조성물, 감광성 엘리먼트, 레지스트패턴의제조방법 및 프린트배선판의 제조방법 - Google Patents
감광성 수지조성물, 감광성 엘리먼트, 레지스트패턴의제조방법 및 프린트배선판의 제조방법 Download PDFInfo
- Publication number
- KR100537084B1 KR100537084B1 KR10-2002-7015775A KR20027015775A KR100537084B1 KR 100537084 B1 KR100537084 B1 KR 100537084B1 KR 20027015775 A KR20027015775 A KR 20027015775A KR 100537084 B1 KR100537084 B1 KR 100537084B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- photosensitive resin
- component
- weight
- meth
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
- Y10S430/121—Nitrogen in heterocyclic ring
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (11)
- 삭제
- 삭제
- 삭제
- 삭제
- (A) 바인더폴리머, (B) 광중합성 화합물 및 (C) 광중합개시제를 함유하는 감광성 수지조성물로서, 상기 (B) 성분은 분자내에 에틸렌글리콜쇄 및 프로필렌글리콜쇄의 양쪽을 갖는 폴리알킬렌글리콜디(메타)아크릴레이트를 포함하고, 상기 (C) 성분은, 하기 일반식(Ⅱ)로 표시되는 분자내에 적어도 1개의 아크리디닐기를 갖는 아크리딘계 화합물을 포함하고,다만, 식중, R3은 탄소원자수 6∼12의 알킬렌기인 감광성 수지조성물.
- 제5항에 있어서, 상기 (A) 성분은 중량평균분자량이 30,000∼70,000인 폴리머 성분이고, 상기 (B) 성분은 분자내에 적어도 1개의 에틸렌성 불포화결합을 갖고, 탄소수 2∼6의 알킬렌글리콜 유니트의 수가 15 이상인 폴리알킬렌글리콜디(메타)아크릴레이트를 함유하는 감광성 수지조성물.
- 제5항에 있어서, 상기 (A) 성분은 중량평균분자량이 30,000∼70,000인 폴리머 성분이고, 상기 (B) 성분은 분자내에 적어도 1개의 에틸렌성 불포화결합을 갖고, 분자량이 900 이상인 폴리알킬렌글리콜디(메타)아크릴레이트를 함유하는 감광성 수지조성물.
- 제 5항 내지 제 7항 중 어느 한 항에 있어서, (A) 성분 및 (B) 성분의 총량 100중량부에 대해서, (A) 성분의 배합량이 40∼80중량부, (B) 성분의 배합량이 20∼60중량부 및 (C) 성분의 배합량이 0.01∼3중량부인 것을 특징으로 하는 감광성 수지조성물.
- 제 5항 내지 제 7항 중 어느 한 항에 기재된 감광성 수지조성물을 지지체상에 도포, 건조하여 이루어지는 감광성 엘리먼트.
- 제 9항에 기재된 감광성 엘리먼트를, 회로형성용 기판상에 감광성 수지조성물층이 밀착하도록 하여 적층하고, 활성광선을 화상상으로 조사하고, 노광부를 광경화시켜, 미노광부를 현상에 의해 제거하는 것을 특징으로 하는 레지스트패턴의 제조방법.
- 제 10항에 기재된 레지스트패턴의 제조방법에 의해, 레지스트패턴이 제조된 회로형성용 기판을 에칭 또는 도금하는 것을 특징으로 하는 프린트배선판의 제조방법.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00157530 | 2000-05-29 | ||
JP2000157530 | 2000-05-29 | ||
JP2000395193 | 2000-12-26 | ||
JPJP-P-2000-00395193 | 2000-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030076223A KR20030076223A (ko) | 2003-09-26 |
KR100537084B1 true KR100537084B1 (ko) | 2005-12-16 |
Family
ID=26592761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-7015775A KR100537084B1 (ko) | 2000-05-29 | 2001-05-29 | 감광성 수지조성물, 감광성 엘리먼트, 레지스트패턴의제조방법 및 프린트배선판의 제조방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7517636B2 (ko) |
JP (1) | JP3855929B2 (ko) |
KR (1) | KR100537084B1 (ko) |
CN (1) | CN1228688C (ko) |
AU (1) | AU6063901A (ko) |
TW (1) | TWI306546B (ko) |
WO (1) | WO2001092958A1 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4632117B2 (ja) * | 2004-07-27 | 2011-02-16 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
JP2006106287A (ja) * | 2004-10-04 | 2006-04-20 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法 |
JP4586067B2 (ja) * | 2005-05-30 | 2010-11-24 | 日立化成工業株式会社 | 感光性樹脂組成物これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
KR101190945B1 (ko) | 2005-10-25 | 2012-10-12 | 히다치 가세고교 가부시끼가이샤 | 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법 |
US7094523B1 (en) * | 2005-11-30 | 2006-08-22 | Kesheng Feng | Developer solution and process for use |
KR100994311B1 (ko) | 2006-09-13 | 2010-11-12 | 히다치 가세고교 가부시끼가이샤 | 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법 |
US8460852B2 (en) * | 2008-04-28 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board |
KR101247912B1 (ko) * | 2008-06-02 | 2013-03-26 | 히타치가세이가부시끼가이샤 | 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 제조방법, 및 프린트 배선판의 제조방법 |
JP5344034B2 (ja) * | 2009-03-13 | 2013-11-20 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP5488866B2 (ja) * | 2009-03-16 | 2014-05-14 | 日立化成株式会社 | 感光性エレメント、並びにこれを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
JP4873043B2 (ja) * | 2009-04-28 | 2012-02-08 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法 |
CN103076717A (zh) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
JP5826006B2 (ja) * | 2011-12-01 | 2015-12-02 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
JP5673762B2 (ja) * | 2013-09-17 | 2015-02-18 | 日立化成株式会社 | 感光性エレメント、並びにこれを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
JP6486672B2 (ja) * | 2013-12-20 | 2019-03-20 | 旭化成株式会社 | 感光性エレメント、及びその製造方法 |
JP6092802B2 (ja) * | 2014-03-20 | 2017-03-08 | 藤森工業株式会社 | 粘着フィルムの製造方法、粘着剤組成物及び粘着フィルム |
CN104834182B (zh) * | 2015-05-20 | 2019-05-03 | 杭州福斯特应用材料股份有限公司 | 一种具有高分辨率和优异掩孔性能的感光干膜 |
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JPS63147159A (ja) * | 1986-12-11 | 1988-06-20 | Fuji Photo Film Co Ltd | 光重合性組成物 |
EP0305545B1 (en) * | 1987-03-17 | 1993-02-10 | Hitachi Chemical Co., Ltd. | Substituted acridine derivatives and their use |
US5260149A (en) * | 1988-01-15 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Photopolymerizable compositions in elements for hologram imaging |
JP2730630B2 (ja) | 1988-08-19 | 1998-03-25 | 日立化成工業 株式会社 | 積層体エレメントおよびその滲み出しの防止方法 |
DE59209143D1 (de) | 1991-03-27 | 1998-02-26 | Ciba Geigy Ag | Photoempfindliches Gemisch auf Basis von Acrylaten |
TW223683B (ko) | 1991-03-27 | 1994-05-11 | Ciba Geigy Ag | |
JPH05271129A (ja) | 1992-01-30 | 1993-10-19 | Idemitsu Petrochem Co Ltd | (ペルフルオロデカリン)アルコール体 |
JPH05224413A (ja) * | 1992-02-14 | 1993-09-03 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた積層体 |
JPH05232699A (ja) | 1992-02-24 | 1993-09-10 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JPH0675371A (ja) | 1992-08-26 | 1994-03-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JPH06236031A (ja) * | 1993-02-12 | 1994-08-23 | Asahi Denka Kogyo Kk | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JPH06242603A (ja) | 1993-02-15 | 1994-09-02 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
EP0699961B1 (en) * | 1993-03-31 | 2000-11-15 | Nippon Zeon Co., Ltd. | Photosensitive composition, photosensitive rubber plate and process for producing the plate, and flexographic plate and process for producing the plate |
JPH08157744A (ja) * | 1994-12-12 | 1996-06-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
TW424172B (en) * | 1995-04-19 | 2001-03-01 | Hitachi Chemical Co Ltd | Photosensitive resin composition and photosensitive element using the same |
JP3199600B2 (ja) | 1995-04-19 | 2001-08-20 | 日立化成工業株式会社 | 感光性樹脂組成物及びこれを用いた感光性エレメント |
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SG85613A1 (en) * | 1998-02-06 | 2002-01-15 | Morton Int Inc | Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers |
-
2001
- 2001-05-29 AU AU60639/01A patent/AU6063901A/en not_active Abandoned
- 2001-05-29 WO PCT/JP2001/004496 patent/WO2001092958A1/ja active IP Right Grant
- 2001-05-29 CN CNB018102395A patent/CN1228688C/zh not_active Expired - Lifetime
- 2001-05-29 TW TW090112863A patent/TWI306546B/zh not_active IP Right Cessation
- 2001-05-29 US US10/296,911 patent/US7517636B2/en not_active Expired - Fee Related
- 2001-05-29 KR KR10-2002-7015775A patent/KR100537084B1/ko active IP Right Grant
- 2001-05-29 JP JP2002501106A patent/JP3855929B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2001092958A1 (fr) | 2001-12-06 |
JP3855929B2 (ja) | 2006-12-13 |
AU6063901A (en) | 2001-12-11 |
CN1432141A (zh) | 2003-07-23 |
US20030186166A1 (en) | 2003-10-02 |
KR20030076223A (ko) | 2003-09-26 |
CN1228688C (zh) | 2005-11-23 |
TWI306546B (ko) | 2009-02-21 |
US7517636B2 (en) | 2009-04-14 |
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