KR100530743B1 - 부품실장장치 - Google Patents
부품실장장치 Download PDFInfo
- Publication number
- KR100530743B1 KR100530743B1 KR10-2002-0032847A KR20020032847A KR100530743B1 KR 100530743 B1 KR100530743 B1 KR 100530743B1 KR 20020032847 A KR20020032847 A KR 20020032847A KR 100530743 B1 KR100530743 B1 KR 100530743B1
- Authority
- KR
- South Korea
- Prior art keywords
- lane
- printed circuit
- circuit board
- rail
- width
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5196—Multiple station with conveyor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (7)
- 공급을 위한 다수의 부품이 준비된 부품공급유니트;상기 부품공급유니트로부터 공급된 부품을 흡착하여 인쇄회로기판에 실장하는 헤드유니트;듀얼레인인 작업레인을 구비하여 반입된 인쇄회로기판을 정지시켜 부품을 실장후 반출하는 작업부;싱글레인으로 이루어지고 인쇄회로기판의 이송방향으로 연장된 폭조절레일을 구비하는 분배레인을 구비하여, 상기 작업부에 인쇄회로기판을 분배시켜 이송하는 반입부; 및싱글레인으로 이루어지고 인쇄회로기판의 이송방향으로 연장된 폭조절레일을 구비하는 반출레인을 구비하여, 상기 작업부로부터 이송된 인쇄회로기판을 반출시키는 반출부를 포함하는 것을 특징으로 하는 부품실장장치.
- 제1항에 있어서,상기 분배레인 및 반출레인에 구비된 레일 중 하나는 상기 폭조절레일과 나란하게 설치된 분배조절레일이고,상기 작업레인은,베이스;상기 베이스의 양측부에 각각 고정되며, 인쇄회로기판의 이송방향으로 연장되고 서로 나란하게 배치된 제1,2고정레일; 및상기 베이스의 내측부에 상기 제1,2고정레일과 나란하고 인쇄회로기판의 이송방향과 수직한 방향으로 이동 가능하게 각각 설치된 제1,2이동레일을 구비하는 것을 특징으로 하는 부품실장장치.
- 제2항에 있어서,상기 반입부 및 반출부는, 반입되는 인쇄회로기판의 폭에 대응하여 상기 폭조절레일과 상기 분배조절레일 사이의 폭을 조절하는 폭조절수단; 및 상기 폭조절수단에 의해 조절된 상기 폭조절레일과 상기 분배조절레일 사이의 폭을 일정하게 유지한 채, 상기 폭조절레일과 상기 분배조절레일을 인쇄회로기판의 이송방향과 수직한 방향으로 동시에 이동시키는 분배조절수단;을 각각 더 구비하며,상기 작업부는, 반입되는 인쇄회로기판의 폭에 대응하여 상기 제1,2이동레일을 인쇄회로기판의 이송방향과 수직한 방향으로 이동시키는 이동레일이동수단을 더 구비하는 것을 특징으로 하는 부품실장장치.
- 제3항에 있어서,상기 폭조절수단은, 상기 폭조절레일에 회전 가능하게 결합되며, 회전에 의해 상기 폭조절레일을 상기 분배조절레일에 대해 상대 이동시키는 폭조절이송나사; 및 상기 폭조절이송나사를 회전시키는 폭조절모터;이고,상기 분배조절수단은, 상기 분배조절레일에 회전 가능하게 결합되며, 회전 에 의해 상기 폭조절레일 및 분배조절레일을 동시에 이동시키는 분배조절이송나사; 및 상기 분배조절이송나사를 회전시키는 분배조절모터;이며,상기 이동레일이동수단은, 상기 제1,2이동레일과 회전 가능하게 각각 결합되며, 회전에 의해 상기 제1,2이동레일을 상기 제1,2고정레일에 대해 상대 이동시키는 제1,2이동레일이송나사; 및 상기 제1,2이동레일이송나사를 각각 회전시키는 제1,2이동레일이동모터;인 것을 특징으로 하는 부품실장장치.
- 제3항에 있어서,상기 반입부 및 반출부는, 상기 폭조절레일 및 분배조절레일이 슬라이딩 가능하게 결합되어 상기 폭조절레일 및 분배조절레일의 이동을 가이드하는 이송가이드를 더 구비하는 것을 특징으로 하는 부품실장장치.
- 제2항에 있어서,상기 반입부와 반출부는 동일한 구성을 갖는 것을 특징으로 하는 부품실장장치.
- 삭제
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0032847A KR100530743B1 (ko) | 2002-06-12 | 2002-06-12 | 부품실장장치 |
JP2003165951A JP4227466B2 (ja) | 2002-06-12 | 2003-06-11 | 部品実装装置及び部品実装法 |
US10/460,001 US6944943B2 (en) | 2002-06-12 | 2003-06-12 | Surface mounter for mounting components |
CNB031424988A CN100438726C (zh) | 2002-06-12 | 2003-06-12 | 芯片安装工具和使用该安装工具的芯片安装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0032847A KR100530743B1 (ko) | 2002-06-12 | 2002-06-12 | 부품실장장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030095573A KR20030095573A (ko) | 2003-12-24 |
KR100530743B1 true KR100530743B1 (ko) | 2005-11-23 |
Family
ID=29728633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-0032847A KR100530743B1 (ko) | 2002-06-12 | 2002-06-12 | 부품실장장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6944943B2 (ko) |
JP (1) | JP4227466B2 (ko) |
KR (1) | KR100530743B1 (ko) |
CN (1) | CN100438726C (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4036642B2 (ja) * | 2001-12-20 | 2008-01-23 | 富士機械製造株式会社 | 対回路基板作業機 |
JP2004128400A (ja) * | 2002-10-07 | 2004-04-22 | Fuji Mach Mfg Co Ltd | 部品実装装置、その作動を制御するプログラムおよび部品実装システム |
KR100861512B1 (ko) * | 2007-03-06 | 2008-10-02 | 삼성테크윈 주식회사 | 복수의 칩마운터 통합 제어 시스템 |
US8132317B2 (en) * | 2007-06-11 | 2012-03-13 | Research In Motion Limited | Apparatus for manufacture of electronic assemblies |
JP4957453B2 (ja) * | 2007-08-23 | 2012-06-20 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP5155834B2 (ja) * | 2008-12-02 | 2013-03-06 | 富士機械製造株式会社 | 回路基板検査装置 |
KR101619466B1 (ko) | 2010-03-26 | 2016-05-11 | 삼성전자주식회사 | 반도체 소자 실장 장치 |
US8267637B2 (en) * | 2010-07-09 | 2012-09-18 | Ouellette Machinery Systems, Inc. | Apparatus for vertically aligning and accumulating stacks of pallets delivered to a pallet dispenser |
FR2966807B1 (fr) * | 2010-10-28 | 2012-12-14 | Sidel Participations | Unite regulatrice versatile pour flux de recipients |
JP5440483B2 (ja) | 2010-12-09 | 2014-03-12 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP5323137B2 (ja) * | 2011-06-14 | 2013-10-23 | ヤマハ発動機株式会社 | 段取り方法、部品実装方法および部品実装システム |
KR20120138114A (ko) * | 2011-06-14 | 2012-12-24 | 삼성전자주식회사 | 기판 처리 장치 및 방법 |
US8833547B2 (en) * | 2012-11-02 | 2014-09-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Transmission device and transmission method for glass substrate |
CN106211745B (zh) * | 2016-08-12 | 2021-10-29 | 杭州创思达精密技术有限公司 | 分段贴装工作台 |
KR102117311B1 (ko) * | 2018-01-18 | 2020-06-01 | (주)펨트론 | 듀얼 레인 및 듀얼 헤드를 갖는 3차원 광학 검사 장치 |
CN109540157B (zh) * | 2018-11-12 | 2021-02-02 | 广东星舆科技有限公司 | 一种车载导航***及控制方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980084253A (ko) * | 1997-05-22 | 1998-12-05 | 이대원 | 칩 마운터 및 그 제어방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59202991D1 (de) * | 1991-01-28 | 1995-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Leiterplatten. |
US5517748A (en) * | 1994-10-07 | 1996-05-21 | Samsung Electronics Co., Ltd. | Apparatus for conveying circuit boards through a component-mounting station |
JPH08236989A (ja) * | 1995-02-28 | 1996-09-13 | Nippondenso Co Ltd | 部品供給装置 |
US6643917B1 (en) * | 2000-01-19 | 2003-11-11 | Delaware Capital Formation | Redundant system for assembly of electronic components to substrates |
US6460692B2 (en) * | 2000-12-22 | 2002-10-08 | Delaware Capital Formation | Dual lane conveying apparatus |
-
2002
- 2002-06-12 KR KR10-2002-0032847A patent/KR100530743B1/ko active IP Right Grant
-
2003
- 2003-06-11 JP JP2003165951A patent/JP4227466B2/ja not_active Expired - Lifetime
- 2003-06-12 US US10/460,001 patent/US6944943B2/en not_active Expired - Fee Related
- 2003-06-12 CN CNB031424988A patent/CN100438726C/zh not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980084253A (ko) * | 1997-05-22 | 1998-12-05 | 이대원 | 칩 마운터 및 그 제어방법 |
Also Published As
Publication number | Publication date |
---|---|
US20030230838A1 (en) | 2003-12-18 |
US6944943B2 (en) | 2005-09-20 |
CN1468051A (zh) | 2004-01-14 |
CN100438726C (zh) | 2008-11-26 |
JP4227466B2 (ja) | 2009-02-18 |
KR20030095573A (ko) | 2003-12-24 |
JP2004023100A (ja) | 2004-01-22 |
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