KR100528435B1 - A conductive tape - Google Patents

A conductive tape Download PDF

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Publication number
KR100528435B1
KR100528435B1 KR10-2002-0038869A KR20020038869A KR100528435B1 KR 100528435 B1 KR100528435 B1 KR 100528435B1 KR 20020038869 A KR20020038869 A KR 20020038869A KR 100528435 B1 KR100528435 B1 KR 100528435B1
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South Korea
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polymer
resin
conductive
conductive tape
adhesive
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KR10-2002-0038869A
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Korean (ko)
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KR20040004821A (en
Inventor
문석기
김태성
유성현
변정일
임소연
장종윤
안우영
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엘에스전선 주식회사
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Priority to KR10-2002-0038869A priority Critical patent/KR100528435B1/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Abstract

본 발명은 액정디스플레이 (LCD; liquid crystal display) 혹은 인쇄회로기판(PCB; printed circuit boards) 등의 전자회로의 연결에 사용되는 전도성 테이프에 관한 것으로, 열경화성 수지 또는 열가소성 수지로 구성되는 고분자 접착수지(10) 및 상기 고분자 접착수지(10)의 내부에 분포되어 있는 다수개의 전도성 입자(20)로 구성되는 전도성 테이프에 있어서, 상기 고분자 접착수지(10)의 내부에 다수개의 고분자 필러(30)가 더 배합되어 있는 것을 특징으로 한다. 본 발명에 따르면 비등방 전도성 접착필름의 유동성을 개선함으로써 접속 신뢰성과 작업성이 향상되어 공정조건이나 접착기의 오류로 인한 불량요인을 사전에 차단할 수 있는 특징이 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive tape used to connect electronic circuits such as liquid crystal displays (LCDs) or printed circuit boards (PCBs), and includes a polymer adhesive resin composed of a thermosetting resin or a thermoplastic resin ( 10) and a conductive tape composed of a plurality of conductive particles 20 distributed in the polymer adhesive resin 10, a plurality of polymer filler 30 is further inside the polymer adhesive resin (10) It is characterized by being mix | blended. According to the present invention, the connection reliability and workability are improved by improving the fluidity of the anisotropic conductive adhesive film, so that the defects caused by the process conditions or the error of the adhesive may be blocked in advance.

Description

전도성 테이프{A conductive tape}Conductive tape {A conductive tape}

본 발명은 전도성 테이프에 관한 것으로, 보다 상세하게는 액정디스플레이 (LCD; liquid crystal display) 혹은 인쇄회로기판(PCB; printed circuit boards) 등의 전자회로의 연결에 사용되는 전도성 테이프에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to conductive tapes, and more particularly, to conductive tapes used to connect electronic circuits such as liquid crystal displays (LCDs) or printed circuit boards (PCBs).

도 1은 종래의 전도성 테이프의 개략적인 모식도이다. 도 1에 도시된 바와 같이 종래의 전도성 테이프는 열경화성 수지 또는 열가소성 수지로 구성되는 고분자 접착수지(10) 및 상기 고분자 접착수지(10)의 내부에 분포되어 있는 다수개의 전도성 입자(20)로 구성되어 있다.1 is a schematic diagram of a conventional conductive tape. As shown in FIG. 1, the conventional conductive tape includes a polymer adhesive resin 10 composed of a thermosetting resin or a thermoplastic resin and a plurality of conductive particles 20 distributed inside the polymer adhesive resin 10. have.

상기와 같이 종래의 회로 접속에 사용된 비등방 전도성 접착필름은 흐름성이 많아 작업 공정성을 저하시키는 문제점이 있으며, 본딩시 필름의 흐름성 때문에 신뢰성을 저하시키는 문제점이 있었다. 즉, 접착필름의 접착 공정 중에 상기 필름이 본더에 달라 붙거나 커팅시 커터에 달라 붙는 등의 작업공정상의 불편함이 있었다.As described above, the anisotropic conductive adhesive film used in the conventional circuit connection has a problem of deteriorating work processability due to its high flowability, and has a problem of lowering reliability due to the flowability of the film during bonding. That is, during the bonding process of the adhesive film, there was an inconvenience in the work process such that the film stuck to the bonder or stuck to the cutter during cutting.

본 발명은 상기와 같은 문제점을 해결하기 위하여 창작한 것으로서, 본 발명의 목적은 비등방 전도성 접착필름의 유동성을 개선함으로써 접속 신뢰성과 작업성이 향상된 접착 필름용 조성물을 제공하는 것이다.The present invention has been made to solve the above problems, an object of the present invention is to provide a composition for an adhesive film improved connection reliability and workability by improving the fluidity of the anisotropic conductive adhesive film.

상기와 같은 본 발명의 목적은, 열경화성 수지 또는 열가소성 수지로 구성되는 고분자 접착수지(10) 및 상기 고분자 접착수지(10)의 내부에 분포되어 있는 다수개의 전도성 입자(20)로 구성되는 전도성 테이프에 있어서, 상기 고분자 접착수지(10)의 내부에 다수개의 고분자 필러(30)가 더 배합되어 있는 것을 특징으로 하는 전도성 테이프에 의하여 달성된다.An object of the present invention as described above, to the conductive tape consisting of a plurality of conductive particles 20 distributed in the polymer adhesive resin 10 and the polymer adhesive resin 10 composed of a thermosetting resin or a thermoplastic resin In the above, the polymer adhesive resin 10 is achieved by a conductive tape, characterized in that the plurality of polymer filler 30 is further compounded.

본 발명에서는 비등방 전도성 접착 필름의 구성물에 고분자 필러를 첨가함으로써 비등방 전도성 접착필름이 접착공정 중에도 본더에 달라붙지 않으며 커팅시 커터에 달라 붙지 않아 공정조건을 향상시켰으며, 접착기의 오류에 의한 불량요인을 제거하고 접속신뢰성을 높일 수 있는 비등방 전도성 접착필름 조성물을 개발하였다.In the present invention, by adding the polymer filler to the composition of the anisotropic conductive adhesive film, the anisotropic conductive adhesive film does not stick to the bonder during the bonding process and does not stick to the cutter during cutting, thereby improving the process conditions, and improving the defects caused by the failure of the adhesive. An anisotropic conductive adhesive film composition can be developed to remove and increase connection reliability.

즉, 본 발명에서 개발된 비등방 접착 필름은 공정 조건이나 접착기의 오류로 인한 불량요인을 사전에 제거하여 비등방 전도성 접착필름의 접속 신뢰성 확보가 가능하고 작업 공정상의 향상도 이룰 수 있다.That is, the anisotropic adhesive film developed in the present invention can secure the connection reliability of the anisotropic conductive adhesive film by removing the defects caused by the process conditions or the error of the adhesive device in advance, and can also improve the working process.

본 발명의 그 밖의 목적, 특정한 장점 및 신규한 특징들은 첨부한 도면들과 연관되어지는 이하의 발명의 상세한 설명과 바람직한 실시예로부터 더욱 분명해질 것이다.Other objects, specific advantages, and novel features of the present invention will become more apparent from the following detailed description of the invention and the preferred embodiments in connection with the accompanying drawings.

이하 본 발명에 따른 전도성 테이프의 구성에 대하여 설명하기로 한다.Hereinafter, the configuration of the conductive tape according to the present invention will be described.

도 2는 본 발명의 일 실시예에 따른 전도성 테이프의 개략적인 모식도이다. 도 2에 도시된 바와 같이 상기 전도성 테이프는 고분자 접착수지(10), 전도성 입자(20) 및 고분자 필러(30)로 구성되어 있다.2 is a schematic diagram of a conductive tape according to an embodiment of the present invention. As shown in FIG. 2, the conductive tape is composed of a polymer adhesive resin 10, conductive particles 20, and a polymer filler 30.

상기 고분자 접착수지(10)는 열경화성 수지, 열가소성 수지, 경화개시제, 안정제 등으로 구성되어 있다. 상기 열가소성 수지 및 열경화성 수지로는 에폭시 수지, 멜라민 수지, 폴리우레탄 수지, 폴리이미드 수지, 폴리 아미드 수지, 폴리에틸렌 수지, 폴리프로필렌 수지, 천연고무 등을 사용할 수 있다. 상기 열경화성 수지의 경화제로서는 지방족 아민류, 방향족 아민류, 아마이드류, 산무수물류, 페놀류, 이미다졸 유도체 등을 사용할 수 있다.The polymer adhesive resin 10 is composed of a thermosetting resin, a thermoplastic resin, a curing initiator, a stabilizer and the like. As the thermoplastic resin and the thermosetting resin, an epoxy resin, melamine resin, polyurethane resin, polyimide resin, polyamide resin, polyethylene resin, polypropylene resin, natural rubber, or the like can be used. Aliphatic amines, aromatic amines, amides, acid anhydrides, phenols, imidazole derivatives, etc. can be used as a hardening | curing agent of the said thermosetting resin.

상기 전도성 입자(20)는 상기 고분자 접착수지(10)의 내부에 복수개가 분산되어 있으며, 상기 전도성 입자(20)로서는 금속코팅 고분자, 코팅 니켈, 금, 구리, 주석, 납 등을 단독 또는 합금으로 사용할 수 있고, 거기에다 절연성 수지로 코팅을 하여 사용할 수도 있다.The conductive particles 20 are dispersed in a plurality of the inside of the polymer adhesive resin 10, the conductive particles 20 as a metal coating polymer, coating nickel, gold, copper, tin, lead, etc. alone or alloy It can be used, and it can also be used, after coating with insulating resin.

상기 고분자 필러(30)도 상기 전도성 입자(20)처럼 상기 고분자 접착수지(10)의 내부에 복수개가 분산되어 있다. 상기 고분자 필러(30)는 전도성 입자(20) 보다 탄성계수가 작거나 같도록 구성된 고분자로서 폴리스티렌(PS; ploystyrene) 수지나 폴리에틸렌(PE; polyethylene) 수지를 사용한다. 상기 고분자 필러(30)의 갯수는 상기 전도성 입자(20) 갯수에 비하여 2 ~ 5배로 배합되도록 하는 것이 바람직하다. 고분자 필러(30)의 갯수가 전도성 입자(20)의 갯수 보다 5배를 넘으면, 본딩시 압력을 저하시킬 수 있으며, 접착력을 저하시킬 수 있다.A plurality of polymer fillers 30 are also dispersed in the polymer adhesive resin 10 like the conductive particles 20. The polymer filler 30 uses a polystyrene (PS; ploystyrene) resin or a polyethylene (PE; polyethylene) resin as a polymer configured to have an elastic modulus smaller or equal to that of the conductive particles 20. The number of the polymer fillers 30 is preferably to be blended 2 to 5 times as compared to the number of the conductive particles 20. When the number of the polymer fillers 30 is more than five times the number of the conductive particles 20, the pressure may be reduced during bonding, and the adhesion may be reduced.

도 3은 도 2의 전도성 테이프의 양면에 상부회로기판과 하부회로기판이 부착되어 있는 상태의 개략적인 모식도이다. 도 3에 도시된 바와 같이, 상기 전도성 테이프의 윗면에는 상부회로기판(40)이 부착되어 있으며, 아랫면에는 하부회로기판(42)이 부착되어 있다. 상기 상부회로기판(40)의 하부면에는 다수개의 상부전극(50)이 부착되어 있으며, 상기 하부회로기판(42)의 상부면에는 다수개의 하부전극(52)이 부착되어 있다.3 is a schematic diagram of a state in which an upper circuit board and a lower circuit board are attached to both surfaces of the conductive tape of FIG. 2. As shown in FIG. 3, an upper circuit board 40 is attached to an upper surface of the conductive tape, and a lower circuit board 42 is attached to a lower surface of the conductive tape. A plurality of upper electrodes 50 are attached to the lower surface of the upper circuit board 40, and a plurality of lower electrodes 52 are attached to the upper surface of the lower circuit board 42.

이하 상기와 같은 구성을 갖는 본 발명에 따른 전도성 테이프의 작용 및 실시예에 대하여 설명하기로 한다.Hereinafter will be described the operation and the embodiment of the conductive tape according to the present invention having the configuration as described above.

상기와 같이 고분자 필러(30)가 고분자 접착수지의 내부에 삽입되므로써 필름의 흐름성이 높아지고 이는 곧 액상에서의 점도가 높아짐과 연결된다. 그러나, 필름 원액의 점도가 높아지는 것이 아니므로 필름 제조상의 공정은 저하되지 않는다.As described above, the polymer filler 30 is inserted into the polymer adhesive resin, thereby increasing the flowability of the film, which leads to the increase in viscosity in the liquid phase. However, since the viscosity of a film stock solution does not become high, the process on film manufacture does not fall.

상기와 같이 고분자 필러(30)가 들어간 전도성 테이프는 표면접착력이 낮아져 커팅시 커터에 붙지 않아 작업성이 향상된다. 또한, 본딩시 가장 작업성을 저하시킨 접착제의 흐름으로 인한 본딩의 오염이 발생하지 않거나, 발생 빈도가 낮아서 작업성이 향상된다.As described above, the conductive tape containing the polymer filler 30 has a low surface adhesive force and thus does not adhere to the cutter during cutting, thereby improving workability. In addition, contamination of the bonding due to the flow of the adhesive that degraded the most workability at the time of bonding does not occur, or the frequency of occurrence is low workability is improved.

상기 고분자 필러(30)는 상기 전도성 입자(20) 보다 크기가 같거나 작기 때문에 본딩시 전도성 입자에 가해지는 압력을 저하시키지 않으며 접속저항에 양향을 미치지 않는다.Since the polymer filler 30 is the same or smaller than the conductive particles 20, the polymer filler 30 does not lower the pressure applied to the conductive particles during bonding and does not affect the connection resistance.

열가소성 수지와 열경화성 수지를 일정한 비율로 섞은 후에 메틸에틸케톤(MEK; methylethylketone)을 섞어 녹인 후에 경화개시제와 평균 입도 5㎛의 도전성 입자(금속코팅 고분자)를 전체 고체 내용물(solid content)로 하여 2% 첨가하고 고분자 필러(30)를 6% 첨가하여 2차 믹싱을 한다. 믹싱 후에 닥터 블레이드를 이용하여 필름을 만든다.After mixing thermoplastic resin and thermosetting resin in a constant ratio, methyl ethyl ketone (MEK) is mixed to dissolve, and 2% of the curing initiator and conductive particles (metal coating polymer) having an average particle size of 5 µm are used as the total solid content. After the addition, 6% of the polymer filler 30 is added to perform secondary mixing. After mixing, the film is made using a doctor blade.

상기와 같이 피름을 제조하여 커팅해 본 결과, 상기 전도성 테이프가 커터에 잘 붙지 않았다. 또한 본딩시 본더에 필름이 흘러 나와 달라붙는 현상이 사라졌다.As a result of manufacturing the cut and cutting as described above, the conductive tape did not adhere well to the cutter. In addition, the phenomenon that the film flows out and adheres to the bonder during bonding disappears.

상기 언급한 바와 같이 본 발명에 따른 전도성 테이프에 의하면, 전도성 테이프에 고분자 필러를 첨가함으로써 유동성이 개선되어 접속 신뢰성이 높아졌으며 작업의 공정성이 향상되었다. 또한, 비등방 전도성 접착 필름이 접착 공정 중에 본더에 달라 붙지 않으며, 표면접착력이 낮아져 커팅시에도 커터에 달라 붙지 않아 공정조건이나 접착기의 오류로 인한 불량요인을 사전에 차단할 수 있는 효과가 있다. As mentioned above, according to the conductive tape according to the present invention, by adding the polymer filler to the conductive tape, the fluidity is improved to improve the connection reliability and the processability of the work. In addition, the anisotropic conductive adhesive film does not adhere to the bonder during the bonding process, the surface adhesive force is lowered because it does not adhere to the cutter during cutting, there is an effect that can block in advance the defects caused by the process conditions or the error of the adhesive.

비록 본 발명이 상기 언급된 바람직한 실시예와 관련하여 설명되어졌지만, 발명의 요지와 범위로부터 벗어남이 없이 다양한 수정이나 변형을 하는 것이 가능하다. 따라서 첨부된 특허청구범위는 본 발명의 요지에 속하는 이러한 수정이나 변형을 포함한다.Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. Accordingly, the appended claims include such modifications and variations as fall within the spirit of the invention.

도 1은 종래의 전도성 테이프의 개략적인 모식도이다.1 is a schematic diagram of a conventional conductive tape.

도 2는 본 발명의 일 실시예에 따른 전도성 테이프의 개략적인 모식도이다.2 is a schematic diagram of a conductive tape according to an embodiment of the present invention.

도 3은 도 2의 전도성 테이프의 양면에 상부회로기판과 하부회로기판이 부착되어 있는 상태의 개략적인 모식도이다.3 is a schematic diagram of a state in which an upper circuit board and a lower circuit board are attached to both surfaces of the conductive tape of FIG. 2.

*도면의 주요 부분에 대한 부호 설명* Explanation of symbols on the main parts of the drawings

10 : 고분자 접착수지10: polymer adhesive resin

20 : 전도성 입자20: conductive particles

30 : 고분자 필러30: polymer filler

40 : 상부회로기판40: upper circuit board

42 : 하부회로기판42: lower circuit board

50 : 상부전극50: upper electrode

52 : 하부전극52: lower electrode

Claims (4)

열경화성 수지 또는 열가소성 수지로 구성되는 고분자 접착수지(10) 및 상기 고분자 접착수지(10)의 내부에 분포되어 있는 다수개의 전도성 입자(20)로 구성되는 전도성 테이프에 있어서, In the conductive tape composed of a polymer adhesive resin 10 composed of a thermosetting resin or a thermoplastic resin and a plurality of conductive particles 20 distributed in the polymer adhesive resin 10, 상기 고분자 접착수지(10)의 내부에 다수개의 고분자 필러(30)를 배합하되, 상기 고분자 필러는 폴리스티렌 수지 또는 폴리에틸렌 수지로 이루어지고;Compounding a plurality of polymer fillers 30 in the polymer adhesive resin 10, wherein the polymer filler is made of polystyrene resin or polyethylene resin; 상기 고분자 필러의 갯수는 상기 전도성 입자(20) 갯수의 2 - 5배로 구성되는 것을 특징으로 전도성 테이프.The number of the polymer filler is a conductive tape, characterized in that consisting of 2 to 5 times the number of the conductive particles (20). 삭제delete 제 1 항에 있어서, 상기 고분자 필러(30)의 입경은 상기 전도성 입자(20)의 입경 보다 작거나 같도록 구성되는 것을 특징으로 하는 전도성 테이프.The conductive tape according to claim 1, wherein the particle diameter of the polymer filler (30) is smaller than or equal to the particle diameter of the conductive particles (20). 제 1 항에 있어서, 상기 고분자 필러(30)의 탄성계수는 상기 전도성 입자(20)의 탄성계수 보다 작거나 같도록 구성되는 것을 특징으로 하는 전도성 테이프.The conductive tape according to claim 1, wherein the elastic modulus of the polymer filler (30) is smaller than or equal to the elastic modulus of the conductive particles (20).
KR10-2002-0038869A 2002-07-05 2002-07-05 A conductive tape KR100528435B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10343375B2 (en) 2017-08-03 2019-07-09 Ich Co., Ltd Low-resistance conductive tape enhancing and maintaining RF performance and having excellent effect of preventing galvanic corrosion and oxidation
KR20200009583A (en) 2018-07-19 2020-01-30 김영훈 Low-resistance conductive tapes for aluminium material enhancing radio frquency, having excellent resistance to galvanic corrosion and oxidation
KR102071559B1 (en) 2018-12-21 2020-01-30 김영훈 Conductive tape with excellent waterproof performance
US11485879B2 (en) 2018-08-31 2022-11-01 Ich Co., Ltd. High-dielectric adhesive film

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KR100665289B1 (en) * 2005-11-17 2007-01-09 삼성전기주식회사 A wire tape

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US5106540A (en) * 1986-01-14 1992-04-21 Raychem Corporation Conductive polymer composition
JPH07126489A (en) * 1993-10-29 1995-05-16 Sumitomo Bakelite Co Ltd Electrically conductive resin paste
JPH08113654A (en) * 1994-10-14 1996-05-07 Soken Chem & Eng Co Ltd Conductive particle and anisotropic conductive adhesive
JP2001049209A (en) * 1999-08-11 2001-02-20 Bridgestone Corp Anisotropic conductive film
WO2001041213A1 (en) * 1999-11-30 2001-06-07 3M Innovative Properties Company Heat conductive sheet and method of producing the sheet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10343375B2 (en) 2017-08-03 2019-07-09 Ich Co., Ltd Low-resistance conductive tape enhancing and maintaining RF performance and having excellent effect of preventing galvanic corrosion and oxidation
KR20200009583A (en) 2018-07-19 2020-01-30 김영훈 Low-resistance conductive tapes for aluminium material enhancing radio frquency, having excellent resistance to galvanic corrosion and oxidation
US11485879B2 (en) 2018-08-31 2022-11-01 Ich Co., Ltd. High-dielectric adhesive film
KR102071559B1 (en) 2018-12-21 2020-01-30 김영훈 Conductive tape with excellent waterproof performance

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