KR100521974B1 - Pick up tool for attaching semiconductor chip - Google Patents
Pick up tool for attaching semiconductor chip Download PDFInfo
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- KR100521974B1 KR100521974B1 KR10-2000-0063023A KR20000063023A KR100521974B1 KR 100521974 B1 KR100521974 B1 KR 100521974B1 KR 20000063023 A KR20000063023 A KR 20000063023A KR 100521974 B1 KR100521974 B1 KR 100521974B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 반도체 칩 부착용 픽업 툴에 관한 것으로서, 더욱 상세하게는 반도체 칩의 부착 공정시 부재의 칩 탑재영역과 반도체 칩과의 사이에 도포되는 에폭시 수지를 균일한 두께로 제어할 수 있고 부재의 휘어지는 현상을 방지할 수 있도록, 칩을 픽업하는 툴의 저면 테두리에 부재면에 밀착 지지되는 지지판을 형성하여, 이 지지판이 칩 부착 공정시 휨 현상이 일어나는 부재를 평행하게 잡아주는 동시에 반도체 칩이 에폭시 수지를 균일한 두께로 가압할 수 있도록 한 반도체 칩 부착용 픽업 툴에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pickup tool for attaching a semiconductor chip, and more particularly, an epoxy resin applied between a chip mounting region of a member and a semiconductor chip in a process of attaching a semiconductor chip to a uniform thickness can be controlled. In order to prevent the phenomenon, a support plate which is closely adhered to the member surface is formed on the bottom edge of the tool picking up the chip, so that the support plate holds the members in which the warpage phenomenon occurs in the chip attaching process in parallel, and at the same time, the semiconductor chip is epoxy resin. The present invention relates to a pick-up tool for attaching a semiconductor chip to pressurize to a uniform thickness.
Description
본 발명은 반도체 칩 부착용 픽업 툴에 관한 것으로서, 더욱 상세하게는 픽업 툴의 저면 테두리에 부재면에 지지되는 지지판을 일체로 형성하여, 반도체 칩의 부착 공정시 휨 현상이 일어나는 부재를 평행하게 잡아주면서 반도체 칩을 부착시키는 동시에 에폭시 수지의 두께를 균일하게 제어 할 수 있도록 한 반도체 칩 부착용 픽업 툴에 관한 것이다.The present invention relates to a pick-up tool for attaching a semiconductor chip, and more particularly, a support plate supported on a member surface is integrally formed on the bottom edge of the pick-up tool, while holding a member in parallel when a bending phenomenon occurs during the attaching process of the semiconductor chip. The present invention relates to a pick-up tool for attaching a semiconductor chip which allows the semiconductor chip to be attached and at the same time control the thickness of the epoxy resin uniformly.
통상적으로 반도체 패키지의 제조 공정은 리드프레임, 인쇄 회로기판, 필름 등의 부재에 형성된 반도체 칩탑재영역에 칩을 부착하는 공정과, 상기 부재의 본딩 영역과 상기 반도체 칩의 본드패드간을 와이어로 본딩하는 공정과, 상기 반도체 칩과 와이어등을 수지로 몰딩하는 공정등으로 이루어진다.In general, a process of manufacturing a semiconductor package includes attaching a chip to a semiconductor chip mounting region formed on a member such as a lead frame, a printed circuit board, or a film, and bonding a wire between a bonding region of the member and a bond pad of the semiconductor chip. And a step of molding the semiconductor chip, the wire, or the like with a resin.
특히, 상기 부재의 칩탑재영역에 칩을 부착하는 공정은 픽업 툴을 사용하여 칩을 진공으로 흡착 고정시킨 다음, 부재의 칩탑재영역 또는 적층을 위한 또 다른 반도체 칩상에 도포된 에폭시 수지에 부착시키게 되는데, 이때 중요한 점은 소위 BLT(Bond Line Thickness)라 하여, 칩과 칩 탑재영역 사이에 위치되는 에폭시 수지의 두께를 균일하게 제어하는데 있다.In particular, the step of attaching the chip to the chip mounting region of the member is such that the chip is sucked and fixed in a vacuum using a pick-up tool, and then attached to the epoxy resin coated on the chip mounting region of the member or another semiconductor chip for lamination. In this case, an important point is called BLT (Bond Line Thickness) to uniformly control the thickness of the epoxy resin positioned between the chip and the chip mounting area.
종래의 반도체 칩 부착용 픽업 툴은 첨부한 도 4에 도시한 바와 같이 저면이 오목하게 파여져 성형된 것으로서, 저면 중앙에는 진공홀(12)이 형성되어 있고, 이 진공홀(12)의 주변에는 반도체 칩이 밀착되는 돌출면(14)이 형성되어 있다.In the conventional pick-up tool for attaching a semiconductor chip, as shown in FIG. 4, the bottom surface is concave and formed, and a vacuum hole 12 is formed in the center of the bottom surface, and a semiconductor chip is formed around the vacuum hole 12. The protruding surface 14 in close contact with this is formed.
따라서, 상기 종래의 픽업 툴(10b)의 저면 돌출면(14)이 반도체 칩(24)의 상면에 밀착되는 동시에 상기 진공홀(12)의 진공 흡착으로 반도체 칩(24)이 고정되어진다.Accordingly, the bottom protruding surface 14 of the conventional pickup tool 10b is in close contact with the upper surface of the semiconductor chip 24 and the semiconductor chip 24 is fixed by vacuum suction of the vacuum hole 12.
이에 따라, 상기 종래의 픽업 툴(10b)의 저면에 형성된 진공홀(12)을 통하여 흡착 고정된 반도체 칩(24)을 에폭시 수지(22)와 같은 접착수단이 도포된 부재(20)의 칩탑재영역 또는 적층된 반도체 칩상에 부착시키게 된다.Accordingly, the chip mounting of the member 20 to which the adhesive means such as the epoxy resin 22 is applied is applied to the semiconductor chip 24 which is fixed and adsorbed through the vacuum hole 12 formed in the bottom surface of the conventional pickup tool 10b. It is attached to a region or a stacked semiconductor chip.
이때, 상기 종래의 픽업 툴(10b)이 반도체 칩(24)을 가압함에 따라, 반도체 칩(24)은 에폭시 수지(22)를 사방으로 퍼지게 하면서 부착된다.At this time, as the conventional pickup tool 10b presses the semiconductor chip 24, the semiconductor chip 24 is attached while spreading the epoxy resin 22 in all directions.
그러나, 상기 종래의 반도체 칩 부착용 픽업 툴(10b)을 사용하여 반도체 칩(24)을 부재의 칩 탑재영역에 도포된 에폭시 수지(22)에 가압 부착함에 있어서, 점점 얇아지고 넓게 제작되는 추세의 상기 부재(20)들은 제조 공정상의 외부력이나 열적 요인에 의하여 쉽게 휘어지는 현상이 일어나기 때문에 상기 에폭시 수지(22)를 균일한 두께로 제어하기 어렵고, 반도체 칩(24)의 부착 상태도 평행하지 않고 불안정된 상태가 되어 반도체 패키지의 불량을 초래하게 된다.However, in the case where the semiconductor chip 24 is pressure-adhered to the epoxy resin 22 applied to the chip mounting region of the member by using the conventional pick-up tool 10b for attaching the semiconductor chip, the trend of thinner and wider fabrication has been achieved. Since the members 20 are easily bent due to external forces or thermal factors in the manufacturing process, it is difficult to control the epoxy resin 22 to a uniform thickness, and the attachment state of the semiconductor chip 24 is also not parallel and unstable. It will be in a state and will cause the defect of a semiconductor package.
따라서, 본 발명은 상기와 같은 단점을 해결하기 위하여 반도체 칩 부착용 픽업 툴의 저면 테두리에 부재면에 밀착 지지되는 지지판을 일체로 형성한 반도체 칩 부착용 픽업 툴을 제공하는데 그 목적이 있다.Accordingly, an object of the present invention is to provide a pick-up tool for attaching a semiconductor chip which integrally forms a support plate that is tightly supported on a member surface at a bottom edge of the pick-up tool for attaching a semiconductor chip.
이에, 칩 부착 공정시 지지판이 부재를 평행하게 눌러 잡아줄 수 있고, 반도체 칩은 일정한 가압력을 받는 동시에 에폭시 수지를 균일한 두께로 제어하게 되며, 결국 칩탑재영역에 반도체 칩이 평행한 상태로 부착되는 효과를 제공할 수 있게 된다. Therefore, during the chip attachment process, the support plate can press and hold the members in parallel, and the semiconductor chip receives a constant pressing force and simultaneously controls the epoxy resin to a uniform thickness, so that the semiconductor chip is attached to the chip mounting area in parallel. It can provide an effect.
이하, 첨부도면을 참조로 본 발명을 상세하게 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
상기한 목적을 달성하기 위한 본 발명은: 저면 중앙에 진공홀(12)을 포함하는 반도체 칩 부착용 픽업 툴(10a)에 있어서, 상기 픽업 툴(10a)의 저면 테두리에 부재(20)면에 지지되는 지지판(16)을 일체로 형성하여서 된 것을 특징으로 한다.The present invention for achieving the above object: in the pickup tool for attaching a semiconductor chip (10a) comprising a vacuum hole 12 in the center of the bottom surface, is supported on the surface of the member 20 on the bottom edge of the pickup tool (10a) Characterized in that the support plate 16 is formed integrally.
상기 픽업 툴(10a)의 지지판(16) 사방면에는 공기 흐름용 슬릿(18)이 형성된 것을 특징으로 한다.On the four sides of the support plate 16 of the pick-up tool 10a, an air flow slit 18 is formed.
여기서, 본 발명을 실시예로서, 첨부한 도면을 참조로 더욱 상세하게 설명하면 다음과 같다.Herein, the present invention will be described in more detail with reference to the accompanying drawings.
첨부한 도 1은 본 발명에 따른 반도체 칩 부착용 픽업 툴(10a)의 저면의 구조를 나타내는 저면 사시도로서, 상기 픽업 툴(10a)의 저면 중앙에는 진공홀(12)이 형성되어 있고 이 진공홀(12)의 주변에는 반도체 칩(24)에 밀착되는 돌출면(14)이 형성되어 있으며, 특히 상기 픽업 툴(10a)의 저면 테두리에는 상기 돌출면(14)보다 긴 지지판(16)이 일체로 형성된다.1 is a bottom perspective view showing the structure of the bottom surface of the pickup tool 10a for semiconductor chip attachment according to the present invention, wherein a vacuum hole 12 is formed in the center of the bottom surface of the pickup tool 10a. 12 is formed around the semiconductor chip 24, the protruding surface 14 is in close contact with, in particular, the bottom edge of the pick-up tool 10a is formed integrally with the support plate 16 longer than the protruding surface 14 do.
첨부한 도 2는 본 발명에 따른 반도체 칩 부착용 픽업 툴(10a)이 에폭시 수지(22)가 도포된 부재(20)의 칩 탑재영역에 반도체 칩(24)을 부착하는 상태를 나타내는 단면도로서, 상기 반도체 칩(24)은 픽업 툴(10a)의 돌출면(14)에 밀착되어 진공홀(12)을 통한 흡착으로 고정된 상태가 된다. 2 is a cross-sectional view showing a state in which the pick-up tool 10a for attaching the semiconductor chip according to the present invention attaches the semiconductor chip 24 to the chip mounting region of the member 20 to which the epoxy resin 22 is applied. The semiconductor chip 24 is brought into close contact with the protruding surface 14 of the pick-up tool 10a and is fixed by adsorption through the vacuum hole 12.
따라서, 상기 칩(24)을 칩탑재영역에 도포된 에폭시 수지(22)에 부착하는 바, 이때 상기 픽업 툴(10a)의 저면 테두리에 일체로 형성된 지지판(16)이 칩탑재영역의 주변 부재(20)면에 밀착되는 상태가 된다.Therefore, the chip 24 is attached to the epoxy resin 22 applied to the chip mounting area. At this time, the support plate 16 formed integrally with the bottom edge of the pick-up tool 10a includes a peripheral member of the chip mounting area. 20) It is in a state of being in close contact with the surface.
이에 따라, 상기 반도체 칩(24)은 픽업 툴(10a)의 가압력에 의하여 상기 에폭시 수지(22)를 사방으로 퍼지게 하며 부착된다.Accordingly, the semiconductor chip 24 is attached while spreading the epoxy resin 22 in all directions by the pressing force of the pick-up tool 10a.
이때, 상기 픽업 툴(10a)의 저면 테두리에 일체로 형성된 지지판(16)이 상기 부재(20)면에 밀착되며, 부재(20)를 평행하게 잡아주기 때문에 부재(20)의 휨 현상을 방지할 수 있게 된다.At this time, the support plate 16 integrally formed on the bottom edge of the pickup tool 10a is in close contact with the surface of the member 20, and the member 20 is held in parallel to prevent bending of the member 20. It becomes possible.
상기 지지판(16)이 부재(20)를 평행하게 잡아줌에 따라, 부재(20)의 칩탑재영역도 평행한 상태가 되어, 결국 반도체 칩(24)이 칩탑재영역에 부착될때, 에폭시 수지(22)를 고른 가압력으로 고르게 퍼지게 하며 부착되어진다.As the support plate 16 grips the member 20 in parallel, the chip mounting region of the member 20 also becomes parallel, so that when the semiconductor chip 24 is attached to the chip mounting region, an epoxy resin ( 22) Evenly spread with even pressing force.
그에따라, 상기 에폭시 수지(22)는 균일한 두께로 제어되고, 반도체 칩(24)의 부착 상태는 평행을 유지하며 견고히 부착된다.Accordingly, the epoxy resin 22 is controlled to a uniform thickness, and the adhesion state of the semiconductor chip 24 is firmly attached while keeping parallelism.
한편, 상기 픽업 툴(10a)의 지지판(16)의 사방에는 슬릿(18)이 형성되어 있는 바, 칩 부착 공정시 지지판(16) 내부의 공기가 슬릿(18)을 통하여 외부로 빠져나가게 되어, 칩 부착 공정시 지지판(16)의 내부에서 공압이 작용하지 않게 된다.On the other hand, the slits 18 are formed on all sides of the support plate 16 of the pick-up tool 10a, so that the air inside the support plate 16 escapes to the outside through the slits 18 during the chip attaching process. In the chip attaching process, the pneumatic pressure is prevented from working inside the support plate 16.
이상에서 본 바와 같이, 본 발명에 따른 반도체 칩 부착용 픽업 툴에 의하면, 반도체 칩을 에폭시 수지가 도포된 부재의 칩 탑재영역에 부착시킬때 픽업 툴의 저면 테두리에 일체로 형성된 지지판이 부재면에 밀착됨에 따라, 칩 부착공정시 외부력이나 열적 요인으로 인한 휨 현상이 일어나는 부재를 평행하게 잡아주면서 반도체 칩을 부착시킬 수 있으며, 동시에 에폭시 수지의 두께를 균일하게 제어할 수 있게 된다.As described above, according to the pick-up tool for semiconductor chip attachment according to the present invention, when the semiconductor chip is attached to the chip mounting area of the member coated with epoxy resin, the support plate integrally formed on the bottom edge of the pick-up tool adheres closely to the member surface. As a result, the semiconductor chip may be attached while holding in parallel a member in which the bending phenomenon due to external force or thermal factor occurs in the chip attaching process, and at the same time, the thickness of the epoxy resin may be uniformly controlled.
도 1은 본 발명에 따른 반도체 칩 부착용 픽업 툴의 저면의 구조를 나타내는 저면 사시도.1 is a bottom perspective view showing the structure of a bottom surface of a pickup tool for attaching a semiconductor chip according to the present invention;
도 2는 본 발명에 따른 반도체 칩 부착용 픽업 툴의 사용상태를 나타내는 단면도.2 is a cross-sectional view showing a state of use of the pickup tool for semiconductor chip attachment according to the present invention.
도 3은 종래의 반도체 칩 부착용 픽업 툴의 저면의 구조를 나타내는 저면 사시도.3 is a bottom perspective view showing the structure of a bottom of a conventional pickup tool for attaching semiconductor chips.
도 4는 종래의 반도체 칩 부착용 픽업 툴의 사용상태를 나타내는 단면도.4 is a cross-sectional view showing a state of use of a conventional pickup tool for attaching semiconductor chips.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
10a,10b : 픽업 툴(pick up tool) 12 : 진공홀10a, 10b: pick up tool 12: vacuum hole
14 : 돌출면 16 : 지지판14 projecting surface 16 supporting plate
18 : 슬릿(slit) 20 : 부재18: slit 20: absence
22 : 에폭시 수지 24 : 반도체 칩22: epoxy resin 24: semiconductor chip
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0063023A KR100521974B1 (en) | 2000-10-25 | 2000-10-25 | Pick up tool for attaching semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0063023A KR100521974B1 (en) | 2000-10-25 | 2000-10-25 | Pick up tool for attaching semiconductor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020032121A KR20020032121A (en) | 2002-05-03 |
| KR100521974B1 true KR100521974B1 (en) | 2005-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2000-0063023A KR100521974B1 (en) | 2000-10-25 | 2000-10-25 | Pick up tool for attaching semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100521974B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190135861A (en) * | 2018-05-29 | 2019-12-09 | (주)포인트엔지니어링 | Transfer head for micro led and micro led transfer system using the same |
-
2000
- 2000-10-25 KR KR10-2000-0063023A patent/KR100521974B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190135861A (en) * | 2018-05-29 | 2019-12-09 | (주)포인트엔지니어링 | Transfer head for micro led and micro led transfer system using the same |
| KR102540860B1 (en) | 2018-05-29 | 2023-06-07 | (주)포인트엔지니어링 | Transfer head for micro led and micro led transfer system using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020032121A (en) | 2002-05-03 |
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| E701 | Decision to grant or registration of patent right | ||
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| LAPS | Lapse due to unpaid annual fee |