KR100509382B1 - 발광 모듈 - Google Patents
발광 모듈 Download PDFInfo
- Publication number
- KR100509382B1 KR100509382B1 KR10-2003-0026661A KR20030026661A KR100509382B1 KR 100509382 B1 KR100509382 B1 KR 100509382B1 KR 20030026661 A KR20030026661 A KR 20030026661A KR 100509382 B1 KR100509382 B1 KR 100509382B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting module
- wiring
- external electrode
- mounting side
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 12
- 239000010949 copper Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 230000020169 heat generation Effects 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
Description
Claims (12)
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 배선 기판에 발광 부품을 실장한 발광 모듈에 있어서,상기 발광 부품은 발광 소자가 실장된 리드 프레임과 도통한 실장측 외부 전극과, 상기 발광 소자와 본딩 와이어로 전기적으로 접속된 리드 프레임과 도통한 비실장측 외부 전극을 구비하고,상기 배선 기판에 형성되어 있는 배선 부분 중, 상기 실장측 외부 전극에 접속되어 있는 배선 부분의 방열성을, 상기 비실장측 외부 전극에 접속되어 있는 배선 부분의 방열성 보다도 높게 한 것을 특징으로 하는 발광 모듈.
- 제 7항에 있어서,상기 실장측 외부 전극에 접속되어 있는 배선 부분의 면적을, 상기 비실장측 외부 전극에 접속되어 있는 배선 부분의 면적 보다도 크게 한 것을 특징으로 하는 발광 모듈.
- 제 7항에 있어서,상기 실장측 외부 전극에 접속되어 있는 배선 부분의 체적을, 상기 비실장측 외부 전극에 접속되어 있는 배선 부분의 체적 보다도 크게 한 것을 특징으로 하는 발광 모듈.
- 제 7항에 있어서,상기 실장측 외부 전극에 접속되어 있는 배선 부분의 열전도율을, 상기 비실장측 외부 전극에 접속되어 있는 배선 부분의 열전도율 보다도 크게 한 것을 특징으로 하는 발광 모듈.
- 제 7항에 있어서,상기 실장측 외부 전극에 접속되어 있는 배선 부분에 방열판을 설치한 것을 특징으로 하는 발광 모듈.
- 제 7항에 있어서,상기 배선 기판을 절연층과 열전도층의 다층 구조로하고,상기 실장측 외부 전극을 상기 열전도층으로 통과시킨 것을 특징으로 하는 발광 모듈.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2002-00128412 | 2002-04-30 | ||
JP2002128412A JP2003324214A (ja) | 2002-04-30 | 2002-04-30 | 発光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030085489A KR20030085489A (ko) | 2003-11-05 |
KR100509382B1 true KR100509382B1 (ko) | 2005-08-18 |
Family
ID=29208204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2003-0026661A KR100509382B1 (ko) | 2002-04-30 | 2003-04-28 | 발광 모듈 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6896393B2 (ko) |
EP (1) | EP1359627A3 (ko) |
JP (1) | JP2003324214A (ko) |
KR (1) | KR100509382B1 (ko) |
CN (1) | CN1235081C (ko) |
TW (1) | TWI266432B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11967670B2 (en) | 2020-02-19 | 2024-04-23 | Samsung Display Co., Ltd. | Display device |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006108517A (ja) * | 2004-10-08 | 2006-04-20 | Citizen Watch Co Ltd | Led接続用基板及びそれを用いた照明装置及びそれを用いた表示装置 |
EP1816685A4 (en) * | 2004-10-27 | 2010-01-13 | Kyocera Corp | LIGHT EMITTING ELEMENT PLATE, BEARING CAPACITOR FOR LIGHT EMITTING ELEMENTS, LIGHT EMITTING DEVICE AND LIGHTING DEVICE |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
KR101249230B1 (ko) * | 2005-03-30 | 2013-04-01 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 플렉시블 led 어레이 |
CN101176216B (zh) | 2005-06-07 | 2010-05-19 | 株式会社藤仓 | 发光元件安装用珐琅基板、发光元件模块、照明装置、显示装置及交通信号机 |
JP4697533B2 (ja) * | 2005-06-08 | 2011-06-08 | ミネベア株式会社 | 面状照明装置 |
WO2006134839A1 (ja) | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | 発光素子実装用基板、発光モジュール及び照明装置 |
KR20070006458A (ko) * | 2005-07-08 | 2007-01-11 | 삼성전자주식회사 | 발광 다이오드 모듈, 이를 구비한 백라이트 어셈블리, 및이를 구비한 표시 장치 |
US7365988B2 (en) | 2005-11-04 | 2008-04-29 | Graftech International Holdings Inc. | Cycling LED heat spreader |
JP4829902B2 (ja) * | 2006-01-31 | 2011-12-07 | 富士通株式会社 | 光モジュールおよびその製造方法 |
US20090168126A1 (en) * | 2006-02-22 | 2009-07-02 | Nippon Sheet Glass Co., Ltd. | Light Emitting Unit, Lighting Apparatus and Image Reading Apparatus |
US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
JP2007311760A (ja) * | 2006-04-20 | 2007-11-29 | Kokubu Denki Co Ltd | Ledモジュール |
US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
JP2008287960A (ja) | 2007-05-16 | 2008-11-27 | Nec Lighting Ltd | 照明装置 |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
DE102008011809A1 (de) * | 2007-12-20 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
KR101418374B1 (ko) * | 2008-01-29 | 2014-07-11 | 삼성디스플레이 주식회사 | 인쇄 회로 기판 및 이를 포함하는 백라이트 유니트, 액정표시 장치 |
WO2010018682A1 (ja) * | 2008-08-11 | 2010-02-18 | ローム株式会社 | 照明装置 |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
CN101900259A (zh) * | 2009-05-27 | 2010-12-01 | 台湾应解股份有限公司 | 发光二极管模块及其制造方法 |
KR101660721B1 (ko) * | 2009-06-15 | 2016-09-29 | 엘지전자 주식회사 | 발광 다이오드 패키지 및 이를 포함하는 백라이트 유닛과 디스플레이장치 |
EP2485284B1 (en) * | 2009-10-01 | 2017-04-12 | Nichia Corporation | Light emitting device |
JP4764519B1 (ja) * | 2010-01-29 | 2011-09-07 | 株式会社東芝 | Ledパッケージ |
JP2013161812A (ja) * | 2012-02-01 | 2013-08-19 | Nec Corp | 基板及び発熱部品の放熱方法 |
JP2013205570A (ja) * | 2012-03-28 | 2013-10-07 | Japan Display Inc | 液晶表示装置 |
CN102661496B (zh) * | 2012-04-09 | 2015-06-17 | 深圳市华星光电技术有限公司 | Led光源及相应的背光模块 |
KR20140020446A (ko) * | 2012-08-08 | 2014-02-19 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 이를 갖는 표시 장치 |
CN103065561A (zh) * | 2013-01-11 | 2013-04-24 | 林谊 | 一种led显示屏显示单元及其自动化生产方法 |
JP2014170834A (ja) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | パワー半導体の放熱構造およびこれを用いたオーディオ装置 |
US9768509B2 (en) * | 2013-08-09 | 2017-09-19 | Sumida Corporation | Antenna coil component, antenna unit, and method of manufacturing the antenna coil component |
JP6206266B2 (ja) * | 2014-03-14 | 2017-10-04 | 東芝ライテック株式会社 | 車両用発光モジュール、車両用照明装置、および車両用灯具 |
CN104091788A (zh) * | 2014-05-19 | 2014-10-08 | 常州市武进区半导体照明应用技术研究院 | 基板和在基板上安装芯片的工艺 |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
JP7089343B2 (ja) * | 2017-04-13 | 2022-06-22 | ローム株式会社 | 半導体発光装置 |
EP3503226A3 (en) * | 2017-08-27 | 2019-09-18 | Everlight Electronics Co., Ltd. | Semiconductor package structure |
JP7064127B2 (ja) * | 2017-09-29 | 2022-05-10 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
TWI645588B (zh) * | 2017-10-13 | 2018-12-21 | 胡文松 | 半導體的導熱及散熱結構 |
US11165006B2 (en) * | 2018-09-26 | 2021-11-02 | Nichia Corporation | Light emitting device including external connection electrodes, and method thereof |
JP7193735B2 (ja) * | 2018-09-26 | 2022-12-21 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
CN112530878A (zh) * | 2019-09-18 | 2021-03-19 | 深圳市中光工业技术研究院 | 用于焊接电子元器件的基底及其制备方法、半导体装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5528474A (en) * | 1994-07-18 | 1996-06-18 | Grote Industries, Inc. | Led array vehicle lamp |
US6175084B1 (en) * | 1995-04-12 | 2001-01-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
JP3671457B2 (ja) * | 1995-06-07 | 2005-07-13 | 株式会社デンソー | 多層基板 |
JPH0982760A (ja) * | 1995-07-07 | 1997-03-28 | Toshiba Corp | 半導体装置、半導体素子およびその半田接続部検査方法 |
JPH09289360A (ja) * | 1996-04-19 | 1997-11-04 | Matsushita Electric Ind Co Ltd | 配線板とその製造方法 |
JP2914342B2 (ja) * | 1997-03-28 | 1999-06-28 | 日本電気株式会社 | 集積回路装置の冷却構造 |
JPH1146018A (ja) * | 1997-07-28 | 1999-02-16 | Citizen Electron Co Ltd | 表面実装型発光ダイオード |
US6329605B1 (en) * | 1998-03-26 | 2001-12-11 | Tessera, Inc. | Components with conductive solder mask layers |
JP2000348501A (ja) * | 1999-06-01 | 2000-12-15 | Toshiba Lighting & Technology Corp | 発光装置および滑走路警戒灯 |
-
2002
- 2002-04-30 JP JP2002128412A patent/JP2003324214A/ja active Pending
-
2003
- 2003-04-03 EP EP03007449A patent/EP1359627A3/en not_active Withdrawn
- 2003-04-23 US US10/422,629 patent/US6896393B2/en not_active Expired - Lifetime
- 2003-04-28 TW TW092109895A patent/TWI266432B/zh not_active IP Right Cessation
- 2003-04-28 KR KR10-2003-0026661A patent/KR100509382B1/ko active IP Right Grant
- 2003-04-30 CN CNB031230903A patent/CN1235081C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11967670B2 (en) | 2020-02-19 | 2024-04-23 | Samsung Display Co., Ltd. | Display device |
Also Published As
Publication number | Publication date |
---|---|
CN1235081C (zh) | 2006-01-04 |
TWI266432B (en) | 2006-11-11 |
US20040012964A1 (en) | 2004-01-22 |
TW200308106A (en) | 2003-12-16 |
JP2003324214A (ja) | 2003-11-14 |
CN1455288A (zh) | 2003-11-12 |
EP1359627A3 (en) | 2007-04-11 |
US6896393B2 (en) | 2005-05-24 |
KR20030085489A (ko) | 2003-11-05 |
EP1359627A2 (en) | 2003-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100509382B1 (ko) | 발광 모듈 | |
KR101546741B1 (ko) | 광 출사 모듈 및 이를 갖는 표시장치 | |
US7443678B2 (en) | Flexible circuit board with heat sink | |
JP4903393B2 (ja) | 光源装置、および液晶表示装置 | |
US7168842B2 (en) | Light emitting diode backlight package | |
JP4238921B2 (ja) | 照明装置、電気光学装置及び電子機器 | |
US8952396B2 (en) | LED module, backlight unit including the LED module, and method for manufacturing the LED module | |
US8016471B2 (en) | Light emitting diode device and applications thereof | |
CN101500373A (zh) | 印刷电路板、背光单元和液晶显示装置 | |
CN100388092C (zh) | 背光模块的散热结构 | |
US20230326421A1 (en) | Light-emitting assembly | |
US7943855B2 (en) | Flexible printed circuit board and electronic component assembly | |
KR101107770B1 (ko) | 발광 다이오드 패키지 및 백라이트 유닛 | |
US11340395B2 (en) | Light source, backlight module and manufacturing method thereof, and display device | |
KR101285311B1 (ko) | 발광 다이오드 패키지 및 백라이트 유닛 | |
CN111816752A (zh) | Mini LED制备方法及Mini LED | |
KR101445804B1 (ko) | 비대칭 led 패키지를 채택한 백라이트 모듈 | |
CN219372950U (zh) | 显示模组以及显示装置 | |
CN218825068U (zh) | 一种灯板、背光模组和显示装置 | |
KR102063519B1 (ko) | 인쇄회로기판 및 이를 갖는 광원 모듈 | |
CN117409664A (zh) | 背光模组以及显示装置 | |
KR100574407B1 (ko) | Led칩을 포함하는 광원 장치 및 그 제조 방법 | |
JP2021168228A (ja) | 線状発光部材及び面状発光装置 | |
KR20040091204A (ko) | 방열판 및 피씨비 일체형 광저장 장치용 모듈 | |
KR102070639B1 (ko) | 방열회로기판, 이를 포함하는 백라이트 유닛 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120724 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20130719 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20140721 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20150716 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20160720 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20170720 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20180719 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20190722 Year of fee payment: 15 |