KR100398357B1 - 전자부품 및 그 제조방법 - Google Patents
전자부품 및 그 제조방법 Download PDFInfo
- Publication number
- KR100398357B1 KR100398357B1 KR10-2001-0008912A KR20010008912A KR100398357B1 KR 100398357 B1 KR100398357 B1 KR 100398357B1 KR 20010008912 A KR20010008912 A KR 20010008912A KR 100398357 B1 KR100398357 B1 KR 100398357B1
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- Prior art keywords
- circuit board
- printed circuit
- component
- mother printed
- shielding case
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (5)
- 표면 실장 부품이 실딩 케이스의 내부에 수용된 구조를 갖는 전자부품의 제조방법으로, 복수의 표면 실장 부품이 실장되는 마더인쇄 회로판(mother printed-circuit board)으로서, 상기 표면 실장 부품의 외부 전극이 접속되는 부품 접속 전극, 실딩 케이스(shielding case)의 걸어맞춤 돌기부가 삽입되는 걸어맞춤 구멍, 및 상기 걸어맞춤 구멍 내부에 형성된 케이스 고정 전극을 포함하는 마더인쇄 회로판을 준비하는 단계;상기 마더인쇄 회로판에 복수의 표면 실장 부품을 실장하고, 상기 표면 실장 부품의 상기 외부 전극을 상기 마더인쇄 회로판의 부품 접속 전극에 접속하는 단계;그 후, 상기 표면 실장 부품이 실장된 부품 실장면으로부터 마더인쇄 회로판 상의 걸어맞춤 구멍의 주변, 또는 상기 걸어맞춤 구멍의 적어도 일부 및 상기 걸어맞춤 구멍의 주변을 피복하는 영역에, 솔더링 페이스트가 상기 걸어맞춤 구멍 내부에 완전히 충전되지 않도록 솔더링 페이스트를 도포하는 단계;상기 실딩 케이스의 상기 걸어맞춤 돌기부가 상기 마더인쇄 회로판의 상기 걸어맞춤 구멍에 삽입되도록, 복수의 상기 실딩 케이스를 상기 마더인쇄 회로판과 걸어맞추는 단계;상기 솔더링 페이스트를 용해시켜서, 상기 실딩 케이스의 상기 걸어맞춤 돌기부를 상기 걸어맞춤 구멍 내부의 상기 케이스 고정 전극에 솔더링하는 단계;그 후, 각 실딩 케이스가 실장된 각각의 영역으로 상기 마더인쇄 회로판을 절삭하고, 상기 마더인쇄 회로판을, 상기 표면 실장 부품이 상기 실딩 케이스 내부에 각각 수용된 복수의 전자부품으로 분할하는 단계; 를 포함하는 것을 특징으로 하는 전자부품의 제조방법.
- 표면 실장 부품이 실딩 케이스의 내부에 수용된 구조를 갖는 전자부품의 제조방법으로, 복수의 표면 실장 부품이 실장되는 마더인쇄 회로판으로서, 상기 표면 실장 부품의 외부전극이 접속되는 부품 접속 전극, 실딩 케이스의 걸어맞춤 돌기부가 삽입되는 걸어맞춤 구멍, 및 상기 걸어맞춤 구멍의 내부에 형성된 케이스 고정 전극을 포함하는 마더인쇄 회로판을 준비하는 단계;상기 마더인쇄 회로판에 소정의 수의 상표면 실장 부품의 일부를 실장하고, 상기 표면 실장 부품의 외부 전극을 상기 마더인쇄 회로판의 부품 접속 전극에 접속하는 단계;그 후, 솔더링 페이스트를 상기 표면 실장 부품이 아직 실장되지 않은 부품 접속 전극에 도포하고, 상기 표면 실장 부품이 실장된 부품 실장면측으로부터, 상기 마더인쇄 회로판의 상기 걸어맞춤 구멍의 주변, 또는 상기 걸어맞춤 구멍의 적어도 일부 및 상기 걸어맞춤 구멍의 주변을 피복하는 영역에, 솔더링 페이스트가 걸어맞춤 구멍 내부에 완전히 충전되지 않도록 솔더링 페이스트를 도포하는 단계;상기 표면 실장 부품의 상기 외부 전극이 상기 부품 접속 전극에 도포된 상기 솔더링 페이스트와 대향하도록, 아직 실장되지 않은 상기 표면 실장 부품을 상기 마더인쇄 회로판에 배치하는 단계;상기 실딩 케이스의 상기 걸어맞춤 돌기부가 상기 마더인쇄 회로판의 상기 걸어맞춤 구멍에 삽입되도록, 상기 복수의 실딩 케이스를 상기 마더인쇄 회로판과 걸어맞추는 단계;솔더링 페이스트를 용해함으로써, 상기 마더인쇄 회로판에 놓여진 상기 표면 실장 부품의 상기 외부 전극을 뒤에서부터 상기 부품 접속 전극에 솔더링하고, 상기 실딩 케이스의 상기 걸어맞춤 돌기부를 케이스 고정 전극에 솔더링하는 단계;그 후, 상기 각 실딩 케이스가 실장된 각각의 영역으로 상기 마더인쇄 회로판을 절삭하고, 상기 마더인쇄 회로판을, 상기 표면 실장 부품이 상기 실딩 케이스 내부에 수용된 복수의 전자부품으로 분할하는 단계; 를 포함하는 것을 특징으로 하는 전자부품의 제조방법.
- 제 1항 또는 제 2항에 있어서, 상기 실딩 케이스에 전기적으로 접속되는 랜드 전극이 상기 마더인쇄 회로판의 상기 부품 실장면의 상기 걸어맞춤 구멍의 주변에 형성되고, 솔더링에 의해 상기 실딩 케이스의 일부 및 상기 랜드 전극이 서로 접속되는 것을 특징으로 하는 전자부품의 제조방법.
- 마더인쇄 회로판의 부품 접속 전극에 솔더링된 표면 실장 부품 및상기 표면 실장 부품을 수용하고, 상기 마더인쇄 회로판의 측면상의 오목부의 내면에 형성된 케이스 고정 전극에 오목부의 일부를 차지하는 소량의 솔더에 의해 솔더링되는 실딩 케이스를 포함하되,제 1항 또는 제 2항의 제조방법에 의해 제조되는 것을 특징으로 하는 전자부품.
- 마더인쇄 회로판의 부품 접속 전극에 솔더링된 표면 실장 부품 및상기 표면 실장 부품을 수용하고, 상기 마더인쇄 회로판의 측면상의 오목부의 내면에 형성된 케이스 고정 전극에 오목부의 일부를 차지하는 소량의 솔더에 의해 솔더링되는 실딩 케이스를 포함하되,제 3항의 제조방법에 의해 제조되는 것을 특징으로 하는 전자부품.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000044021A JP2001237585A (ja) | 2000-02-22 | 2000-02-22 | 電子部品及びその製造方法 |
JP2000-044021 | 2000-02-22 |
Publications (2)
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KR20010083238A KR20010083238A (ko) | 2001-08-31 |
KR100398357B1 true KR100398357B1 (ko) | 2003-09-19 |
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KR10-2001-0008912A KR100398357B1 (ko) | 2000-02-22 | 2001-02-22 | 전자부품 및 그 제조방법 |
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US (1) | US6817093B2 (ko) |
JP (1) | JP2001237585A (ko) |
KR (1) | KR100398357B1 (ko) |
CN (1) | CN1226905C (ko) |
Families Citing this family (9)
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JP4601879B2 (ja) * | 2001-09-14 | 2010-12-22 | パナソニック株式会社 | 携帯電子機器及びbgaパッケージ保護装置 |
JP3969453B1 (ja) * | 2006-05-17 | 2007-09-05 | 株式会社村田製作所 | ケース付き多層モジュール |
CN100397712C (zh) * | 2006-07-28 | 2008-06-25 | 友达光电股份有限公司 | 导电连接件及其切割方法 |
KR20090079595A (ko) * | 2008-01-18 | 2009-07-22 | 주식회사 케이엠더블유 | 인쇄 회로 기판의 장착 방법 |
JP4751948B1 (ja) * | 2010-02-16 | 2011-08-17 | ヤマハ発動機株式会社 | 部品実装装置および部品実装方法 |
JP5949374B2 (ja) * | 2012-09-20 | 2016-07-06 | 富士通株式会社 | 電子機器 |
CN103811432B (zh) * | 2012-11-12 | 2016-09-14 | 财团法人工业技术研究院 | 环境敏感电子元件封装体 |
JP2017157739A (ja) * | 2016-03-03 | 2017-09-07 | イビデン株式会社 | 電子部品付き配線板の製造方法 |
CN110972398A (zh) * | 2019-12-11 | 2020-04-07 | 芜湖雅葆轩电子科技股份有限公司 | 免贴耐高温材料pcb板加工工艺 |
Citations (5)
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2000
- 2000-02-22 JP JP2000044021A patent/JP2001237585A/ja active Pending
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2001
- 2001-02-22 KR KR10-2001-0008912A patent/KR100398357B1/ko active IP Right Grant
- 2001-02-22 US US09/791,104 patent/US6817093B2/en not_active Expired - Lifetime
- 2001-02-22 CN CNB011113936A patent/CN1226905C/zh not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
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KR20010083238A (ko) | 2001-08-31 |
US6817093B2 (en) | 2004-11-16 |
CN1226905C (zh) | 2005-11-09 |
US20010036684A1 (en) | 2001-11-01 |
JP2001237585A (ja) | 2001-08-31 |
CN1310580A (zh) | 2001-08-29 |
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