KR100325410B1 - A vacuum evaporation coating apparatus and coating method, and coating laminates - Google Patents

A vacuum evaporation coating apparatus and coating method, and coating laminates Download PDF

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KR100325410B1
KR100325410B1 KR1019990050033A KR19990050033A KR100325410B1 KR 100325410 B1 KR100325410 B1 KR 100325410B1 KR 1019990050033 A KR1019990050033 A KR 1019990050033A KR 19990050033 A KR19990050033 A KR 19990050033A KR 100325410 B1 KR100325410 B1 KR 100325410B1
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coating
vacuum deposition
thin film
vacuum
inner cylinder
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KR1019990050033A
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Korean (ko)
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KR20000006904A (en
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유흥상
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유흥상
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Priority to KR2019990024752U priority patent/KR200185068Y1/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Abstract

본 발명은 진공증착 코팅장치와 증착 코팅방법 및 이러한 장치 및 방법으로 제조된 코팅 적층체에 관한 것으로, 더 구체적으로는 유해전자파가 발생되는 전기, 전자 부품 및 통신기기의 사출물(피코팅체)에 전도성 실드 박막층을 형성하여 유해전자파가 외부로 유출되는 것을 방지하는데 사용되는 진공증착 코팅장치와 증착 코팅방법 및 이러한 장치 및 방법으로 제조된 코팅 적층체에 관한 것이다.The present invention relates to a vacuum deposition coating apparatus and a deposition coating method, and a coating laminate prepared by such an apparatus and method, and more particularly, to injection products (coated bodies) of electrical, electronic components, and communication devices that generate harmful electromagnetic waves. The present invention relates to a vacuum deposition coating apparatus and a deposition coating method used to form a conductive shield thin film layer to prevent harmful electromagnetic waves from leaking to the outside, and a coating laminate manufactured by the apparatus and method.

본 발명의 구체적 구성은 고정된 외통(10)과 회전이 가능한 내통(20)으로 된 진공증착 챔버(1)로서, 상기 진공 증착 챔버(1)의 내통(20) 내주면에 사출품이 장착되는 복수개의 치구(21)를 갖고, 코팅물질을 용융시키는 이베퍼레이터(23)와, 상기 피코팅체를 코팅하는 스퍼터링 타겟(22)을 동시에 구비한 것이다.A specific configuration of the present invention is a vacuum deposition chamber (1) consisting of a fixed outer cylinder (10) and a rotatable inner cylinder (20), a plurality of injection molded product is mounted on the inner peripheral surface of the inner cylinder (20) of the vacuum deposition chamber (1) Two jig 21, an evaporator 23 for melting a coating material and a sputtering target 22 for coating the object to be coated.

Description

진공증착 코팅장치와 그의 코팅방법 및 코팅 적층체{A VACUUM EVAPORATION COATING APPARATUS AND COATING METHOD, AND COATING LAMINATES}Vacuum deposition coating apparatus, coating method thereof and coating laminate {A VACUUM EVAPORATION COATING APPARATUS AND COATING METHOD, AND COATING LAMINATES}

본 발명은 진공증착 코팅장치와 증착 코팅방법 및 이러한 장치 및 방법으로 제조된 코팅 적층체에 관한 것으로, 더 구체적으로는 유해전자파가 발생되는 전기, 전자 부품 및 통신기기의 사출물에 전도성 박막층을 코팅하여 유해전자파가 외부로 유출되는 것을 방지하기 위해서 기존 사출물(피코팅체)의 내부에 전도성 실드박막층을 형성하는데 사용되는 진공증착 코팅 장치와 증착 코팅방법 및 이러한 장치 및 방법으로 제조된 코팅 적층체에 관한 것이다.The present invention relates to a vacuum deposition coating apparatus and a deposition coating method and a coating laminate prepared by the apparatus and method, and more specifically, by coating a conductive thin film layer on the injection of electrical, electronic components and communication devices generating harmful electromagnetic waves In order to prevent harmful electromagnetic waves from leaking to the outside, a vacuum deposition coating apparatus and a deposition coating method used to form a conductive shield thin film layer inside an existing injection molded product (coated body), and a coating laminate manufactured by the apparatus and method will be.

일반적으로 사출물(피코팅체)에 전도성 박막을 코팅하는 방법으로는 수지에 전도성 금속 분말을 섞어서 스프레이 방식으로 코팅을 하는 방식이 많이 이용되고 있다. 그러나 이러한 방법은 작업성이 좋지 않고, 필요한 도전율을 얻기 위해서는코팅층을 두껍게 형성해야 하는 문제점이 있다.In general, as a method of coating a conductive thin film on an injection molded product (coated body), a method of mixing a conductive metal powder with a resin and spraying the coating is widely used. However, this method is not good workability, there is a problem in that the coating layer must be formed thick in order to obtain the required conductivity.

또한 스퍼터링에 의해서 막을 형성하는 방법도 있으나 이러한 방법은 부착력은 있으나 필요한 박막 두께를 코팅하고자 할때 다량의 열이 발생하여 기판이 뒤틀리거나 열에 의한 팽창이 심하여 막이 파괴되는 문제가 있다.There is also a method of forming a film by sputtering, but this method has adhesion but there is a problem in that a large amount of heat is generated when coating a required thin film thickness, the substrate is warped or the film is swelled due to heat expansion, thereby destroying the film.

또한 저항 가열 방식에 의한 방법은 많은 사출물을 다량으로 코팅할 수 있으나 이러한 방법은 또한 부착력이 약해서 전도성 실드 박막의 강도에 문제점 있다.In addition, the method by the resistance heating method can be coated a large amount of a large amount of the injection molding, but this method also has a weak adhesion force has a problem in the strength of the conductive shield thin film.

따라서 본 발명은 코팅의 부착력이 우수하고, 코팅막이 견고하며 아울러 기판이 뒤틀리거나 하여 막이 파손되는 문제점을 해소하고 하는 것을 기술적 과제로 한다.Therefore, the present invention is to solve the problem that the adhesion of the coating is excellent, the coating film is robust, and the film is broken due to the distortion of the substrate.

또, 이베퍼레이터와 스퍼터 타겟을 챔버내에 동시에 장착할 수 있는 구조를 제공하여 코팅 효율을 높이는 것을 기술적 과제로 한다.Another object of the present invention is to provide a structure in which an evaporator and a sputter target can be simultaneously mounted in a chamber, thereby improving the coating efficiency.

따라서 본 발명은 고정된 외통과 회전하는 내통으로 된 진공증착 챔버로서, 상기 내통의 내주면에 사출품이 장착되는 복수개의 치구를 갖고, 코팅 물질을 용융시켜 피코팅체를 코팅할 수 있는 이베퍼레이터와, 스퍼터링 타겟을 동시에 구비한 진공증착 코팅장치를 제공하는데 있다.Therefore, the present invention is a vacuum deposition chamber consisting of a fixed outer cylinder and a rotating inner cylinder, having a plurality of jig to be mounted on the inner peripheral surface of the inner cylinder, an evaporator capable of melting the coating material to coat the coated body And to provide a vacuum deposition coating apparatus having a sputtering target at the same time.

또한 본 발명은 코팅하고자 하는 기판을 내통의 치구에 장착한 후, 진공증착 챔버를 진공배기하고, 일정한 진공상태에 도달하면 치구가 장착된 내통을 회전시켜 코팅할 부분을 에칭하는 동시에 스퍼터링 타겟과 이배퍼레이터에 의해서 코팅하는 진공 증착 방법을 제공하는데 있다.In addition, the present invention after mounting the substrate to be coated on the jig of the inner cylinder, vacuum evacuation of the vacuum deposition chamber, and reaches a constant vacuum state by rotating the inner cylinder equipped with the jig to etch the portion to be coated and at the same time double the sputtering target It is to provide a vacuum deposition method for coating by a perator.

또한 상기 이베퍼레이터에 의한 코팅 방법으로서 저항 가열식 또는 전자빔 방식중 어느 한 방법으로 코팅물질을 용융하여 증착코팅하는 진공증착 코팅방법을 제공하는데 있다.In addition, the coating method by the evaporator to provide a vacuum deposition coating method for the deposition coating by melting the coating material by any method of resistance heating or electron beam method.

또한 본 발명은 코팅하고자 하는 기판을 내통의 치구에 장착한 후, 진공증착 챔버를 진공배기하고, 일정한 진공상태에 도달하면 치구가 장착된 내통을 회전시켜 피코팅체의 코팅할 부분을 플라즈마 또는 글로우방전된 방전대를 통과시켜 에칭하는 동시에 스퍼터링 타겟 또는 이배퍼레이터로 코팅하는 진공 증착 방법에 있어서, 폴리카보네이트 또는 플라스틱재으로 된 기판, 수지 또는 도료의 중간 밀착막층, 구리 또는 은으로 된 주전도성 박막층, SUS 또는 Ni로 된 막보호 박막층을 차례로 적층하여 된 진공증착 코팅적층체를 제공하는데 있다.In another aspect, the present invention after mounting the substrate to be coated on the jig of the inner cylinder, vacuum evacuation of the vacuum deposition chamber, and when reaching a certain vacuum state by rotating the inner cylinder equipped with the jig to plasma or glow the part to be coated In a vacuum deposition method in which a discharged discharge zone is passed through an etching and coated with a sputtering target or an evaporator, the substrate is made of polycarbonate or plastic, an intermediate adhesive layer of resin or paint, and a main conductive thin film layer of copper or silver. The present invention provides a vacuum deposition coating laminate obtained by sequentially laminating a film protective thin film layer made of SUS or Ni.

도1은 본 발명의 진공증착 코팅장치의 내부 평면도.1 is a plan view of the inside of the vacuum deposition coating apparatus of the present invention.

도2는 진공증착 코팅 적층체를 도시한 단면도.2 is a cross-sectional view showing a vacuum deposition coating laminate.

도3은 본 발명의 진공증착 코팅장치의 전체 정면도.Figure 3 is an overall front view of the vacuum deposition coating apparatus of the present invention.

이하 본 발명을 달성하기 위한 구체적인 장치의 구성과 제조 방법 및 이의 적층체에 대해서 첨부한 도면을 참조하여 구체적으로 설명한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, a structure, a manufacturing method, and a laminate thereof of a specific apparatus for achieving the present invention will be specifically described with reference to the accompanying drawings.

도1은 본 발명의 진공증착 코팅장치의 내부 평면도이고, 도2는 진공증착 코팅 적층체를 도시한 단면도이다. 여기서, 부호 1은 본 발명의 진공증착 코팅장치의 챔버이고, 부호 10은 챔버의 외통이고 20은 내통이다.1 is a plan view of the inside of the vacuum deposition coating apparatus of the present invention, Figure 2 is a cross-sectional view showing a vacuum deposition coating laminate. Here, reference numeral 1 denotes a chamber of the vacuum deposition coating apparatus of the present invention, reference numeral 10 denotes an outer cylinder of the chamber and 20 denotes an inner cylinder.

상기 진공증착 코팅장치의 챔버의 외통(10)은 고정되어 있고 상기 내통(20)은 회전이 가능하도록 되어 있다. 상기 내통의 내주면에는 보통 수지재의 기성 사출품(피코팅체)이 장착되는 복수개의 치구(21)가 설치되어 있다.The outer cylinder 10 of the chamber of the vacuum deposition coating apparatus is fixed and the inner cylinder 20 is rotatable. On the inner circumferential surface of the inner cylinder, a plurality of jig 21 for mounting a ready-made injection molded product (coated body) of ordinary resin material is provided.

그리고 상기 외통(10)과 내통(20)에 걸쳐서 글로우 방전 또는 플라즈마 방전을 발생시키는 방전수단(24, 24')이 대향하여 설치되어 있어 전원공급장치(13)로부터 전원이 공급받아 방전대를 형성하고, 상기한 플라즈마 방전 또는 글로우 방전에 필요한 불활성 주입가스 (Ar, N2, He)를 공급하는 가스 입력구(11)를 구비하고, 외통의 타측에는 진공 배기하기 위한 진공배기 수단(12)을 구비하고 있다.Discharge means (24, 24 ') for generating a glow discharge or a plasma discharge across the outer cylinder (10) and the inner cylinder (20) are provided so as to receive a power supply from the power supply device (13) to form a discharge table. And a gas input port 11 for supplying the inert injection gases Ar, N 2 and He necessary for the above-described plasma discharge or glow discharge, and on the other side of the outer cylinder, a vacuum exhaust means 12 for evacuating the vacuum. Equipped.

또한 기성 사출품(피코팅체)이 내주면의 치구(21)에 장착된 상태에서 코팅물질을 용융시켜 코팅하는 이베퍼레이터(23 ; Evaporator)와 스퍼터링 타겟(22)이 구비되어 있다.In addition, an evaporator 23 and a sputtering target 22 for melting and coating a coating material in a state where a ready-made injection molded product (coated body) is mounted on the jig 21 on the inner circumferential surface are provided.

그리고 상기 스퍼터링 타겟 (22)은 고정 수단(26)에 장착되어 있다.The sputtering target 22 is attached to the fixing means 26.

여기서 상기 이베퍼레이터(23)는 저항가열식 또는 전자빔 방식으로 코팅물질을 용융증발시켜 코팅하고, 상기 스퍼터링 타겟은 코팅물질을 스퍼터하여 분산시켜 피코팅체를 코팅하게 된다.Here, the evaporator 23 coats the coating material by melt-evaporating the coating material by resistance heating or electron beam method, and the sputtering target is sputtered by dispersing the coating material.

상기 저항 가열방식은 저항체에 전류를 흘려 주울열을 발생하는것을 이용한 가열방식을 사용한다. 여기서는 물체에 직접 전류를 흘려서 가열하는 직접식과 발열체의 열을 복사 대류 전도등으로 피가열물에 전달하는 간접식의 양자 방식을 모두 채택할 수 있음을 밝혀 둔다.The resistance heating method uses a heating method using a current to flow through the resistor to generate Joule heat. Here, it can be seen that both a direct method of heating a current directly through an object and an indirect method of transferring heat from a heating element to a heated object by radiant convection conduction or the like can be adopted.

플라즈마 또는 글로우 방전은 상기한 방전 수단(24, 24') 사이에서 상기한 불활성 주입가스와 전원 공급장치(13)으로부터 공급된 고압 전압의 스파크에 의해서 플라즈마 또는 글로우 방전대(25)가 형성된다. 이러한 상태에서 상기 내통(20)이 회전하면서 치구(21)에 안착되어 있는 피코팅체의 코팅부위에 상기한 방전대를 거치면서 에칭이 이루어지고, 이와 동시에 스퍼터링 타겟(22) 및/또는 이베퍼레이터(23)에 의해서 용융된 코팅물질이 비산 또는 스퍼터되어 상기한 피코팅체에 다층의 전도성 실드막이 형성되게 된다.In the plasma or glow discharge, the plasma or glow discharge zone 25 is formed by the above-described inert injection gas and the high-voltage voltage spark supplied from the power supply device 13 between the discharge means 24 and 24 '. In this state, the inner cylinder 20 is rotated while etching is carried out through the above-described discharge zone on the coated portion of the coated body seated on the jig 21, and at the same time, the sputtering target 22 and / or the evaporer The coating material melted by the radar 23 is scattered or sputtered to form a multilayer conductive shielding film on the above-mentioned to-be-coated body.

이상과 같이 피코팅체의 코팅 공정을 요약하면, 코팅하고자 하는 기판(피코팅체)을 내통(20)의 치구(21)에 장착한 후, 진공배기 장치(12)를 통하여 진공증착 챔버(1)를 진공배기하고, 챔버내가 일정한 진공상태에 도달하면 치구(21)가 장착된 내통(20)을 회전시켜 피코팅체의 코팅할 부분이 상기 플라즈마 또는 글로우 방전대에서 에칭이 이루어지는 동시에, 상기 스퍼터링 타겟(22) 또는 이배퍼레이터(23)로부터 용융 비산 또는 스퍼터되는 코팅물질이 피코팅체에 균일하게 코팅이 이루어 지는 것이다.Summarizing the coating process of the to-be-coated body as described above, after mounting the substrate (to-be-coated body) to be coated on the jig 21 of the inner cylinder 20, the vacuum deposition chamber 1 through the vacuum exhaust device 12 ), And when the chamber reaches a constant vacuum, the inner cylinder 20 equipped with the jig 21 is rotated so that the portion to be coated is etched in the plasma or glow discharge zone, and the sputtering The coating material melted or scattered from the target 22 or the evaporator 23 is uniformly coated on the coated body.

이상 기술한 바와 같은 진공 증착 코팅 방법으로 피코팅체(사출품)인 폴리카보네이트 또는 플라스틱재로 된 기판, 수지 또는 도료의 중간 밀착막층, 구리 또는 은으로 된 주전도성 박막층, SUS 또는 Ni로 된 막보호 박막층이 적층된 도전성 필름실드막이 형성된 코팅 적층체를 얻을 수 있다.The above-described vacuum vapor deposition coating method is a substrate made of a polycarbonate or plastic material to be coated (injected product), an intermediate adhesive film layer of resin or paint, a main conductive thin film layer made of copper or silver, a film made of SUS or Ni. The coating laminated body in which the electroconductive film shield film in which the protective thin film layer was laminated | stacked was formed can be obtained.

다음에 도3은 본 발명의 진공증착 코팅장치의 전체 정면도로서, 1은 상기한 상술한 코팅 공정이 진행되는 챔버이고, 41은 상기 챔버내를 진공배기하여 고진공 상태로 유지하는 고진공 밸브이고, 또한 42는 오일을 확산시키는 오일 확산 고진공 펌프이고, 43은 저진공 펌프이다.3 is an overall front view of the vacuum deposition coating apparatus of the present invention, where 1 is a chamber in which the above-described coating process is performed, 41 is a high vacuum valve for evacuating the chamber and maintaining it in a high vacuum state. 42 is an oil diffusion high vacuum pump that diffuses oil, and 43 is a low vacuum pump.

상기한 고진공 펌프와 확산펌프는 진공 코팅장치에서 통상적으로 사용되는 장치이므로 여기서는 그 구체적인 내용은 생략하기로 한다.The high vacuum pump and the diffusion pump is a device commonly used in a vacuum coating device, so the detailed description thereof will be omitted.

이상 상술한 바와 같이 본 발명은 유해전자파가 발생되는 전기, 전자 부품 및 통신기기의 사출물에 전도성 박막층을 코팅하여 유해전자파가 외부로 유출되는 것을 방지하기 위해서 기존 사출물(피코팅체)의 내부에 전도성 박막을 코팅하는데 유용하고, 상기 사출물에 전도성 박막을 코팅하는 방법에 있어서 작업성이 좋고, 선택적으로 코팅을 위한 장치인 이베퍼레이터와 스퍼터링 타겟을 하나의 챔버내에 구비함으로써 양자를 선택적으로 또는 동시에 동작시켜 코팅처리가 가능한 제반 장점이 있는 유용한 발명이다.As described above, the present invention coats a conductive thin film layer on the injection of electrical, electronic components, and communication devices that generate harmful electromagnetic waves to prevent harmful electromagnetic waves from leaking to the outside. It is useful for coating a thin film, has good workability in coating a conductive thin film on the injection molding, and selectively or simultaneously operates both by providing an evaporator and a sputtering target, which are devices for coating, in a chamber. It is a useful invention that has all the advantages that can be coated.

Claims (5)

고정된 외통(10)과 회전가능한 내통(20)으로 구성된 진공증착 챔버(1)를 갖고,Having a vacuum deposition chamber 1 consisting of a fixed outer cylinder 10 and a rotatable inner cylinder 20, 상기 챔버(1)의 내통(20)의 내주면에 사출품이 장착되는 복수개의 치구(21)와, 코팅물질을 용융시켜 상기 치구(21)에 장착된 피장착물에 전도성 실드박막을 형성하는 이베퍼레이터(23)와 스퍼터링 타겟(22), 및 상기 스퍼터링 타겟 (22)이 장착되는 고정 수단(26)을 구비하고,Ibe for forming a conductive shield thin film on the fixture mounted on the jig 21 by melting a plurality of jig 21 and the coating material on the inner peripheral surface of the inner cylinder 20 of the chamber (1) And a fixing means (26) on which the perlator (23), the sputtering target (22), and the sputtering target (22) are mounted, 상기 외통(10)과 내통(20)에 걸쳐서 글로우 방전 또는 플라즈마 방전을 발생시키는 방전수단(24, 24')과, 상기 방전수단(24, 24')으로 전원을 공급하는 전원공급수단(13)과, 상기 외통(10)의 일측에 상기 플라즈마 방전 또는 글로우 방전을 유발하는 불활성 주입가스(Ar 또는 N2또는 He)를 공급하는 가스 공급수단(11)과, 진공 배기하기 위한 진공배기 수단(12)을 구비한 것을 특징으로 하는 진공증착 코팅장치.Discharge means (24, 24 ') for generating glow discharge or plasma discharge over the outer cylinder (10) and inner cylinder (20), and power supply means (13) for supplying power to the discharge means (24, 24'). And a gas supply means 11 for supplying an inert injection gas Ar or N 2 or He for causing the plasma discharge or the glow discharge to one side of the outer cylinder 10, and a vacuum exhaust means 12 for evacuating the vacuum. Vacuum deposition coating apparatus characterized in that it comprises a). 코팅하고자 하는 기판을 내통(20)의 치구(21)에 장착한 후, 상기 진공 배기수단에 의해서 진공증착 챔버(1)를 진공 배기하고, 일정한 진공상태에 도달하면 치구(21)가 장착된 내통(20)을 회전시켜 피코팅체에 전도성 실드 박막층을 형성할 부분을 방전대(25)를 통과시키면서 에칭하는 동시에 스퍼터링 타겟(22)과 이베퍼레이터(23)로 전도성 실드 박막을 형성하는 것을 특징으로 하는 진공 증착 방법.After mounting the substrate to be coated on the jig 21 of the inner cylinder 20, the vacuum deposition chamber 1 is evacuated by the vacuum evacuation means, and when the constant vacuum state is reached, the inner cylinder on which the jig 21 is mounted. (20) by rotating the portion to form the conductive shield thin film layer on the coated body while passing through the discharge zone 25 and at the same time forming a conductive shield thin film with the sputtering target 22 and the evaporator 23 Vacuum deposition method. 제2항에 있어서,The method of claim 2, 상기 스퍼터링 타겟(22)을 이용하여 피코팅체에 전도성 실드 박막층 형성하거나, 이베퍼레이터(23)에 의해서 코팅물질을 용융시켜 피코팅체에 전도성 실드 박막층을 형성하는 것을 특징으로 하는 진공증착 코팅방법.Vacuum deposition coating method, characterized in that to form a conductive shield thin film layer on the coated body using the sputtering target 22, or to form a conductive shield thin film layer on the coated body by melting the coating material by the evaporator (23). . 제3항에 있어서,The method of claim 3, 상기 이베퍼레이터(23)에 의한 코팅물질 용융 방법으로서 저항 가열식 또는 전자빔 방식중 어느 한 방법으로, 코팅물질을 용융시켜 피코팅체에 전도성 실드 박막층을 형성하는 것을 특징으로 하는 진공증착 코팅방법.The coating material melting method using the evaporator (23), vacuum coating method characterized in that the coating material is melted by any method of resistance heating or electron beam method to form a conductive shield thin film layer on the coated object. 코팅하고자 하는 기판을 내통(20)의 치구(21)에 장착한 후, 상기 진공 배기장치에 의해서 진공증착 챔버(1)를 진공 배기하고, 일정한 진공상태에 도달하면 치구(21)가 장착된 내통(20)을 회전시켜 피코팅체에 전도성 실드 박막층을 형성할 부분을 에칭하는 동시에 스퍼터링 타겟(22)과 이베퍼레이터(23)로 상기 피코팅체를 코팅하는 진공 증착 코팅방법으로,After mounting the substrate to be coated on the jig 21 of the inner cylinder 20, the vacuum deposition chamber 1 is evacuated by the vacuum exhaust device, and when the constant vacuum state is reached, the inner cylinder on which the jig 21 is mounted. In the vacuum deposition coating method of rotating the part 20 to etch a portion to form a conductive shield thin film layer on the coated body, and simultaneously coating the coated body with the sputtering target 22 and the evaporator 23, 폴리카보네이트 또는 플라스틱재로 된 기판(30), 수지 또는 도료의 중간 밀착막층(31), 구리 또는 은으로 된 주전도성 박막층(32), SUS 또는 Ni로 된 막보호 박막층(33)을 차례로 형성하여 된 진공증착 코팅적층체.A substrate 30 made of polycarbonate or plastic, an intermediate adhesion layer 31 of resin or paint, a main conductive thin film layer 32 made of copper or silver, and a film protective thin film layer 33 made of SUS or Ni Vacuum deposition coating laminate.
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