JPWO2021255807A1 - - Google Patents
Info
- Publication number
- JPWO2021255807A1 JPWO2021255807A1 JP2022531127A JP2022531127A JPWO2021255807A1 JP WO2021255807 A1 JPWO2021255807 A1 JP WO2021255807A1 JP 2022531127 A JP2022531127 A JP 2022531127A JP 2022531127 A JP2022531127 A JP 2022531127A JP WO2021255807 A1 JPWO2021255807 A1 JP WO2021255807A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023212981A JP2024029010A (ja) | 2020-06-15 | 2023-12-18 | ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/023486 WO2021255807A1 (ja) | 2020-06-15 | 2020-06-15 | ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023212981A Division JP2024029010A (ja) | 2020-06-15 | 2023-12-18 | ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021255807A1 true JPWO2021255807A1 (ja) | 2021-12-23 |
JP7452649B2 JP7452649B2 (ja) | 2024-03-19 |
Family
ID=79268625
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022531127A Active JP7452649B2 (ja) | 2020-06-15 | 2020-06-15 | ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
JP2023212981A Pending JP2024029010A (ja) | 2020-06-15 | 2023-12-18 | ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023212981A Pending JP2024029010A (ja) | 2020-06-15 | 2023-12-18 | ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230094685A1 (ja) |
JP (2) | JP7452649B2 (ja) |
KR (1) | KR20230009492A (ja) |
CN (1) | CN115803684A (ja) |
TW (1) | TW202204981A (ja) |
WO (1) | WO2021255807A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230039275A (ko) * | 2021-09-14 | 2023-03-21 | 삼성전자주식회사 | 반도체 설비의 제진대 및 이를 포함하는 제진대 시스템 |
CN116884886B (zh) * | 2023-09-06 | 2023-11-24 | 北京华卓精科科技股份有限公司 | 一种精密力位输出装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332467A (ja) * | 2000-05-19 | 2001-11-30 | Canon Inc | ステージ装置、露光装置およびデバイス製造方法 |
JP2006086442A (ja) * | 2004-09-17 | 2006-03-30 | Nikon Corp | ステージ装置及び露光装置 |
WO2010131485A1 (ja) * | 2009-05-15 | 2010-11-18 | 株式会社ニコン | 移動体装置、用力伝達装置、及び露光装置、並びにデバイス製造方法 |
JP2013054144A (ja) * | 2011-09-02 | 2013-03-21 | Nikon Corp | 位置合わせ方法、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法 |
WO2015147039A1 (ja) * | 2014-03-26 | 2015-10-01 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5495948B2 (ja) | 2010-05-27 | 2014-05-21 | キヤノン株式会社 | ステージ装置、露光装置及びデバイスの製造方法 |
-
2020
- 2020-06-15 CN CN202080101898.5A patent/CN115803684A/zh active Pending
- 2020-06-15 JP JP2022531127A patent/JP7452649B2/ja active Active
- 2020-06-15 KR KR1020227043446A patent/KR20230009492A/ko unknown
- 2020-06-15 WO PCT/JP2020/023486 patent/WO2021255807A1/ja active Application Filing
-
2021
- 2021-06-10 TW TW110121165A patent/TW202204981A/zh unknown
-
2022
- 2022-11-30 US US18/072,144 patent/US20230094685A1/en active Pending
-
2023
- 2023-12-18 JP JP2023212981A patent/JP2024029010A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332467A (ja) * | 2000-05-19 | 2001-11-30 | Canon Inc | ステージ装置、露光装置およびデバイス製造方法 |
JP2006086442A (ja) * | 2004-09-17 | 2006-03-30 | Nikon Corp | ステージ装置及び露光装置 |
WO2010131485A1 (ja) * | 2009-05-15 | 2010-11-18 | 株式会社ニコン | 移動体装置、用力伝達装置、及び露光装置、並びにデバイス製造方法 |
JP2013054144A (ja) * | 2011-09-02 | 2013-03-21 | Nikon Corp | 位置合わせ方法、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法 |
WO2015147039A1 (ja) * | 2014-03-26 | 2015-10-01 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2024029010A (ja) | 2024-03-05 |
TW202204981A (zh) | 2022-02-01 |
CN115803684A (zh) | 2023-03-14 |
US20230094685A1 (en) | 2023-03-30 |
KR20230009492A (ko) | 2023-01-17 |
WO2021255807A1 (ja) | 2021-12-23 |
JP7452649B2 (ja) | 2024-03-19 |
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