JPWO2021255807A1 - - Google Patents

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Publication number
JPWO2021255807A1
JPWO2021255807A1 JP2022531127A JP2022531127A JPWO2021255807A1 JP WO2021255807 A1 JPWO2021255807 A1 JP WO2021255807A1 JP 2022531127 A JP2022531127 A JP 2022531127A JP 2022531127 A JP2022531127 A JP 2022531127A JP WO2021255807 A1 JPWO2021255807 A1 JP WO2021255807A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022531127A
Other versions
JP7452649B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021255807A1 publication Critical patent/JPWO2021255807A1/ja
Priority to JP2023212981A priority Critical patent/JP2024029010A/ja
Application granted granted Critical
Publication of JP7452649B2 publication Critical patent/JP7452649B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022531127A 2020-06-15 2020-06-15 ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 Active JP7452649B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023212981A JP2024029010A (ja) 2020-06-15 2023-12-18 ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/023486 WO2021255807A1 (ja) 2020-06-15 2020-06-15 ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023212981A Division JP2024029010A (ja) 2020-06-15 2023-12-18 ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Publications (2)

Publication Number Publication Date
JPWO2021255807A1 true JPWO2021255807A1 (ja) 2021-12-23
JP7452649B2 JP7452649B2 (ja) 2024-03-19

Family

ID=79268625

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022531127A Active JP7452649B2 (ja) 2020-06-15 2020-06-15 ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2023212981A Pending JP2024029010A (ja) 2020-06-15 2023-12-18 ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023212981A Pending JP2024029010A (ja) 2020-06-15 2023-12-18 ステージ装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Country Status (6)

Country Link
US (1) US20230094685A1 (ja)
JP (2) JP7452649B2 (ja)
KR (1) KR20230009492A (ja)
CN (1) CN115803684A (ja)
TW (1) TW202204981A (ja)
WO (1) WO2021255807A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230039275A (ko) * 2021-09-14 2023-03-21 삼성전자주식회사 반도체 설비의 제진대 및 이를 포함하는 제진대 시스템
CN116884886B (zh) * 2023-09-06 2023-11-24 北京华卓精科科技股份有限公司 一种精密力位输出装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332467A (ja) * 2000-05-19 2001-11-30 Canon Inc ステージ装置、露光装置およびデバイス製造方法
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置
WO2010131485A1 (ja) * 2009-05-15 2010-11-18 株式会社ニコン 移動体装置、用力伝達装置、及び露光装置、並びにデバイス製造方法
JP2013054144A (ja) * 2011-09-02 2013-03-21 Nikon Corp 位置合わせ方法、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法
WO2015147039A1 (ja) * 2014-03-26 2015-10-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5495948B2 (ja) 2010-05-27 2014-05-21 キヤノン株式会社 ステージ装置、露光装置及びデバイスの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332467A (ja) * 2000-05-19 2001-11-30 Canon Inc ステージ装置、露光装置およびデバイス製造方法
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置
WO2010131485A1 (ja) * 2009-05-15 2010-11-18 株式会社ニコン 移動体装置、用力伝達装置、及び露光装置、並びにデバイス製造方法
JP2013054144A (ja) * 2011-09-02 2013-03-21 Nikon Corp 位置合わせ方法、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法
WO2015147039A1 (ja) * 2014-03-26 2015-10-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Also Published As

Publication number Publication date
JP2024029010A (ja) 2024-03-05
TW202204981A (zh) 2022-02-01
CN115803684A (zh) 2023-03-14
US20230094685A1 (en) 2023-03-30
KR20230009492A (ko) 2023-01-17
WO2021255807A1 (ja) 2021-12-23
JP7452649B2 (ja) 2024-03-19

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