JPWO2021241763A1 - - Google Patents

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Publication number
JPWO2021241763A1
JPWO2021241763A1 JP2022526687A JP2022526687A JPWO2021241763A1 JP WO2021241763 A1 JPWO2021241763 A1 JP WO2021241763A1 JP 2022526687 A JP2022526687 A JP 2022526687A JP 2022526687 A JP2022526687 A JP 2022526687A JP WO2021241763 A1 JPWO2021241763 A1 JP WO2021241763A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022526687A
Other versions
JP7506152B2 (ja
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Publication date
Application filed filed Critical
Publication of JPWO2021241763A1 publication Critical patent/JPWO2021241763A1/ja
Application granted granted Critical
Publication of JP7506152B2 publication Critical patent/JP7506152B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022526687A 2020-05-28 2021-05-28 樹脂組成物 Active JP7506152B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020093706 2020-05-28
JP2020093735 2020-05-28
JP2020093706 2020-05-28
JP2020093735 2020-05-28
PCT/JP2021/020567 WO2021241763A1 (ja) 2020-05-28 2021-05-28 樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2021241763A1 true JPWO2021241763A1 (ja) 2021-12-02
JP7506152B2 JP7506152B2 (ja) 2024-06-25

Family

ID=

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04108879A (ja) * 1990-08-30 1992-04-09 Nippon Steel Chem Co Ltd ポリイミド樹脂コーテイング剤組成物
WO2014098235A1 (ja) * 2012-12-21 2014-06-26 旭化成イーマテリアルズ株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
WO2014148441A1 (ja) * 2013-03-18 2014-09-25 旭化成イーマテリアルズ株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
JP2016162403A (ja) * 2015-03-05 2016-09-05 旭化成株式会社 ポリイミドを貼り合わせ接着層とする光学部材
WO2019065164A1 (ja) * 2017-09-26 2019-04-04 東レ株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物、ポリイミド樹脂膜、積層体の製造方法、カラーフィルタの製造方法、液晶素子の製造方法および有機ｅｌ素子の製造方法
WO2019188305A1 (ja) * 2018-03-28 2019-10-03 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
WO2019208590A1 (ja) * 2018-04-23 2019-10-31 信越化学工業株式会社 ケイ素含有化合物
WO2019211972A1 (ja) * 2018-05-01 2019-11-07 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
JP2019203120A (ja) * 2018-05-16 2019-11-28 旭化成株式会社 ポリイミド前駆体樹脂組成物

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04108879A (ja) * 1990-08-30 1992-04-09 Nippon Steel Chem Co Ltd ポリイミド樹脂コーテイング剤組成物
WO2014098235A1 (ja) * 2012-12-21 2014-06-26 旭化成イーマテリアルズ株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
WO2014148441A1 (ja) * 2013-03-18 2014-09-25 旭化成イーマテリアルズ株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
JP2016162403A (ja) * 2015-03-05 2016-09-05 旭化成株式会社 ポリイミドを貼り合わせ接着層とする光学部材
WO2019065164A1 (ja) * 2017-09-26 2019-04-04 東レ株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物、ポリイミド樹脂膜、積層体の製造方法、カラーフィルタの製造方法、液晶素子の製造方法および有機ｅｌ素子の製造方法
WO2019188305A1 (ja) * 2018-03-28 2019-10-03 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
WO2019208590A1 (ja) * 2018-04-23 2019-10-31 信越化学工業株式会社 ケイ素含有化合物
WO2019211972A1 (ja) * 2018-05-01 2019-11-07 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
JP2019203120A (ja) * 2018-05-16 2019-11-28 旭化成株式会社 ポリイミド前駆体樹脂組成物

Also Published As

Publication number Publication date
TWI836943B (zh) 2024-03-21
TW202330733A (zh) 2023-08-01
CN115667368A (zh) 2023-01-31
WO2021241763A1 (ja) 2021-12-02
TWI836221B (zh) 2024-03-21
TW202204474A (zh) 2022-02-01
KR20220158818A (ko) 2022-12-01

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