JPWO2021157077A1 - - Google Patents
Info
- Publication number
- JPWO2021157077A1 JPWO2021157077A1 JP2021575572A JP2021575572A JPWO2021157077A1 JP WO2021157077 A1 JPWO2021157077 A1 JP WO2021157077A1 JP 2021575572 A JP2021575572 A JP 2021575572A JP 2021575572 A JP2021575572 A JP 2021575572A JP WO2021157077 A1 JPWO2021157077 A1 JP WO2021157077A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023209769A JP2024015380A (ja) | 2020-02-07 | 2023-12-13 | 吸着位置調整装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/004912 WO2021157077A1 (ja) | 2020-02-07 | 2020-02-07 | 吸着位置調整装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023209769A Division JP2024015380A (ja) | 2020-02-07 | 2023-12-13 | 吸着位置調整装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021157077A1 true JPWO2021157077A1 (ja) | 2021-08-12 |
JP7404405B2 JP7404405B2 (ja) | 2023-12-25 |
Family
ID=77199935
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021575572A Active JP7404405B2 (ja) | 2020-02-07 | 2020-02-07 | 吸着位置調整装置および吸着位置調整方法 |
JP2023209769A Pending JP2024015380A (ja) | 2020-02-07 | 2023-12-13 | 吸着位置調整装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023209769A Pending JP2024015380A (ja) | 2020-02-07 | 2023-12-13 | 吸着位置調整装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230060239A1 (ja) |
EP (1) | EP4102948A4 (ja) |
JP (2) | JP7404405B2 (ja) |
CN (1) | CN114902825B (ja) |
WO (1) | WO2021157077A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117279356B (zh) * | 2023-10-18 | 2024-04-16 | 江苏商贸职业学院 | 一种可逐个自动上料的贴片机及其贴片方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004146661A (ja) * | 2002-10-25 | 2004-05-20 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
JP2005183412A (ja) * | 2003-12-16 | 2005-07-07 | Juki Corp | 電子部品実装装置 |
JP2010073929A (ja) * | 2008-09-19 | 2010-04-02 | Panasonic Corp | 電子部品実装装置および電子部品実装方法 |
JP2013098289A (ja) * | 2011-10-31 | 2013-05-20 | Sony Corp | 部品実装装置、情報処理装置、情報処理方法及び基板の製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11251795A (ja) * | 1998-02-27 | 1999-09-17 | Nitto Seiko Co Ltd | プリント基板の撓み修正装置 |
EP1227711B9 (en) * | 1999-09-27 | 2008-08-13 | Matsushita Electric Industrial Co., Ltd. | Component mounting method and component mounting apparatus |
JP4324442B2 (ja) * | 2003-10-16 | 2009-09-02 | Juki株式会社 | 部品データ生成装置及び電子部品実装装置 |
JP2005203393A (ja) * | 2004-01-13 | 2005-07-28 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
WO2005101944A1 (ja) * | 2004-04-15 | 2005-10-27 | Fuji Machine Mfg. Co., Ltd. | テープフィーダおよび電子回路部品供給装置 |
JP2006324395A (ja) | 2005-05-18 | 2006-11-30 | I-Pulse Co Ltd | 表面実装機 |
JP4943300B2 (ja) * | 2007-11-07 | 2012-05-30 | Juki株式会社 | 部品実装装置 |
CN101884089B (zh) * | 2007-12-03 | 2012-02-08 | 松下电器产业株式会社 | 芯片安装*** |
KR20130086537A (ko) * | 2010-06-16 | 2013-08-02 | 파나소닉 주식회사 | 부품 실장 방법 및 부품 실장기 |
JP5774968B2 (ja) * | 2011-11-15 | 2015-09-09 | ヤマハ発動機株式会社 | 部品移載装置および部品移載装置における吸着位置調整方法 |
JP2013251398A (ja) * | 2012-05-31 | 2013-12-12 | Panasonic Corp | 部品実装装置および部品実装方法 |
JP6231791B2 (ja) * | 2013-07-04 | 2017-11-15 | 富士機械製造株式会社 | 実装装置 |
US10555450B2 (en) * | 2014-11-07 | 2020-02-04 | Fuji Corporation | Rotary head type component mounter |
WO2018083745A1 (ja) * | 2016-11-01 | 2018-05-11 | 株式会社Fuji | 画像処理用部品形状データ作成システム及び画像処理用部品形状データ作成方法 |
US10806037B2 (en) * | 2017-01-05 | 2020-10-13 | Panasonic Intellectual Property Management Co., Ltd. | Component mounting system |
CN110199585B (zh) * | 2017-01-25 | 2021-06-15 | 株式会社富士 | 控制装置、安装装置及控制方法 |
US11388849B2 (en) * | 2017-01-30 | 2022-07-12 | Fuji Corporation | Component mounting machine, component suctioning method, nozzle disposing method and method for disposing component supplying device |
-
2020
- 2020-02-07 WO PCT/JP2020/004912 patent/WO2021157077A1/ja unknown
- 2020-02-07 CN CN202080090738.5A patent/CN114902825B/zh active Active
- 2020-02-07 US US17/758,753 patent/US20230060239A1/en active Pending
- 2020-02-07 JP JP2021575572A patent/JP7404405B2/ja active Active
- 2020-02-07 EP EP20917648.6A patent/EP4102948A4/en active Pending
-
2023
- 2023-12-13 JP JP2023209769A patent/JP2024015380A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004146661A (ja) * | 2002-10-25 | 2004-05-20 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
JP2005183412A (ja) * | 2003-12-16 | 2005-07-07 | Juki Corp | 電子部品実装装置 |
JP2010073929A (ja) * | 2008-09-19 | 2010-04-02 | Panasonic Corp | 電子部品実装装置および電子部品実装方法 |
JP2013098289A (ja) * | 2011-10-31 | 2013-05-20 | Sony Corp | 部品実装装置、情報処理装置、情報処理方法及び基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20230060239A1 (en) | 2023-03-02 |
CN114902825B (zh) | 2024-04-02 |
JP7404405B2 (ja) | 2023-12-25 |
WO2021157077A1 (ja) | 2021-08-12 |
JP2024015380A (ja) | 2024-02-01 |
CN114902825A (zh) | 2022-08-12 |
EP4102948A1 (en) | 2022-12-14 |
EP4102948A4 (en) | 2023-01-18 |
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