JPWO2021157077A1 - - Google Patents

Info

Publication number
JPWO2021157077A1
JPWO2021157077A1 JP2021575572A JP2021575572A JPWO2021157077A1 JP WO2021157077 A1 JPWO2021157077 A1 JP WO2021157077A1 JP 2021575572 A JP2021575572 A JP 2021575572A JP 2021575572 A JP2021575572 A JP 2021575572A JP WO2021157077 A1 JPWO2021157077 A1 JP WO2021157077A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021575572A
Other versions
JP7404405B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021157077A1 publication Critical patent/JPWO2021157077A1/ja
Priority to JP2023209769A priority Critical patent/JP2024015380A/ja
Application granted granted Critical
Publication of JP7404405B2 publication Critical patent/JP7404405B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0452Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/041Incorporating a pick-up tool having multiple pick-up tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021575572A 2020-02-07 2020-02-07 吸着位置調整装置および吸着位置調整方法 Active JP7404405B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023209769A JP2024015380A (ja) 2020-02-07 2023-12-13 吸着位置調整装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/004912 WO2021157077A1 (ja) 2020-02-07 2020-02-07 吸着位置調整装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023209769A Division JP2024015380A (ja) 2020-02-07 2023-12-13 吸着位置調整装置

Publications (2)

Publication Number Publication Date
JPWO2021157077A1 true JPWO2021157077A1 (ja) 2021-08-12
JP7404405B2 JP7404405B2 (ja) 2023-12-25

Family

ID=77199935

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021575572A Active JP7404405B2 (ja) 2020-02-07 2020-02-07 吸着位置調整装置および吸着位置調整方法
JP2023209769A Pending JP2024015380A (ja) 2020-02-07 2023-12-13 吸着位置調整装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023209769A Pending JP2024015380A (ja) 2020-02-07 2023-12-13 吸着位置調整装置

Country Status (5)

Country Link
US (1) US20230060239A1 (ja)
EP (1) EP4102948A4 (ja)
JP (2) JP7404405B2 (ja)
CN (1) CN114902825B (ja)
WO (1) WO2021157077A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117279356B (zh) * 2023-10-18 2024-04-16 江苏商贸职业学院 一种可逐个自动上料的贴片机及其贴片方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146661A (ja) * 2002-10-25 2004-05-20 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2005183412A (ja) * 2003-12-16 2005-07-07 Juki Corp 電子部品実装装置
JP2010073929A (ja) * 2008-09-19 2010-04-02 Panasonic Corp 電子部品実装装置および電子部品実装方法
JP2013098289A (ja) * 2011-10-31 2013-05-20 Sony Corp 部品実装装置、情報処理装置、情報処理方法及び基板の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251795A (ja) * 1998-02-27 1999-09-17 Nitto Seiko Co Ltd プリント基板の撓み修正装置
EP1227711B9 (en) * 1999-09-27 2008-08-13 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
JP4324442B2 (ja) * 2003-10-16 2009-09-02 Juki株式会社 部品データ生成装置及び電子部品実装装置
JP2005203393A (ja) * 2004-01-13 2005-07-28 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
WO2005101944A1 (ja) * 2004-04-15 2005-10-27 Fuji Machine Mfg. Co., Ltd. テープフィーダおよび電子回路部品供給装置
JP2006324395A (ja) 2005-05-18 2006-11-30 I-Pulse Co Ltd 表面実装機
JP4943300B2 (ja) * 2007-11-07 2012-05-30 Juki株式会社 部品実装装置
CN101884089B (zh) * 2007-12-03 2012-02-08 松下电器产业株式会社 芯片安装***
KR20130086537A (ko) * 2010-06-16 2013-08-02 파나소닉 주식회사 부품 실장 방법 및 부품 실장기
JP5774968B2 (ja) * 2011-11-15 2015-09-09 ヤマハ発動機株式会社 部品移載装置および部品移載装置における吸着位置調整方法
JP2013251398A (ja) * 2012-05-31 2013-12-12 Panasonic Corp 部品実装装置および部品実装方法
JP6231791B2 (ja) * 2013-07-04 2017-11-15 富士機械製造株式会社 実装装置
US10555450B2 (en) * 2014-11-07 2020-02-04 Fuji Corporation Rotary head type component mounter
WO2018083745A1 (ja) * 2016-11-01 2018-05-11 株式会社Fuji 画像処理用部品形状データ作成システム及び画像処理用部品形状データ作成方法
US10806037B2 (en) * 2017-01-05 2020-10-13 Panasonic Intellectual Property Management Co., Ltd. Component mounting system
CN110199585B (zh) * 2017-01-25 2021-06-15 株式会社富士 控制装置、安装装置及控制方法
US11388849B2 (en) * 2017-01-30 2022-07-12 Fuji Corporation Component mounting machine, component suctioning method, nozzle disposing method and method for disposing component supplying device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146661A (ja) * 2002-10-25 2004-05-20 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP2005183412A (ja) * 2003-12-16 2005-07-07 Juki Corp 電子部品実装装置
JP2010073929A (ja) * 2008-09-19 2010-04-02 Panasonic Corp 電子部品実装装置および電子部品実装方法
JP2013098289A (ja) * 2011-10-31 2013-05-20 Sony Corp 部品実装装置、情報処理装置、情報処理方法及び基板の製造方法

Also Published As

Publication number Publication date
US20230060239A1 (en) 2023-03-02
CN114902825B (zh) 2024-04-02
JP7404405B2 (ja) 2023-12-25
WO2021157077A1 (ja) 2021-08-12
JP2024015380A (ja) 2024-02-01
CN114902825A (zh) 2022-08-12
EP4102948A1 (en) 2022-12-14
EP4102948A4 (en) 2023-01-18

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