JPWO2021153405A1 - - Google Patents
Info
- Publication number
- JPWO2021153405A1 JPWO2021153405A1 JP2021545737A JP2021545737A JPWO2021153405A1 JP WO2021153405 A1 JPWO2021153405 A1 JP WO2021153405A1 JP 2021545737 A JP2021545737 A JP 2021545737A JP 2021545737 A JP2021545737 A JP 2021545737A JP WO2021153405 A1 JPWO2021153405 A1 JP WO2021153405A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022172992A JP2023015160A (en) | 2020-01-29 | 2022-10-28 | Paste resin composition, high thermal conductive material, and semiconductor device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020012506 | 2020-01-29 | ||
JP2020012506 | 2020-01-29 | ||
PCT/JP2021/001980 WO2021153405A1 (en) | 2020-01-29 | 2021-01-21 | Paste-like resin composition, highly heat conductive material, and semiconductor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022172992A Division JP2023015160A (en) | 2020-01-29 | 2022-10-28 | Paste resin composition, high thermal conductive material, and semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021153405A1 true JPWO2021153405A1 (en) | 2021-08-05 |
JP7279802B2 JP7279802B2 (en) | 2023-05-23 |
Family
ID=77078539
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021545737A Active JP7279802B2 (en) | 2020-01-29 | 2021-01-21 | PASTE RESIN COMPOSITION FOR HIGH THERMAL CONDUCTIVE MATERIAL, HIGH THERMAL CONDUCTIVE MATERIAL, AND SEMICONDUCTOR DEVICE |
JP2022172992A Pending JP2023015160A (en) | 2020-01-29 | 2022-10-28 | Paste resin composition, high thermal conductive material, and semiconductor device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022172992A Pending JP2023015160A (en) | 2020-01-29 | 2022-10-28 | Paste resin composition, high thermal conductive material, and semiconductor device |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP7279802B2 (en) |
CN (1) | CN115023453A (en) |
TW (1) | TW202138507A (en) |
WO (1) | WO2021153405A1 (en) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11150135A (en) * | 1997-11-17 | 1999-06-02 | Nec Corp | Conductive paste of superior thermal conductivity and electronic device |
JPH11316456A (en) * | 1998-02-17 | 1999-11-16 | Toppan Printing Co Ltd | Solvent-free type photosensitive calcination paste composition, solvent type photosensitive calcination paste composition and structural body |
JP2004139754A (en) * | 2002-10-15 | 2004-05-13 | Mitsubishi Paper Mills Ltd | Silver oxide paste and manufacturing method of metal silver from silver oxide paste |
JP2009295895A (en) * | 2008-06-09 | 2009-12-17 | Sumitomo Bakelite Co Ltd | Conductive paste for circuit board |
JP2011122129A (en) * | 2009-11-12 | 2011-06-23 | Sekisui Chem Co Ltd | Inorganic fine particle dispersed paste composition |
JP2011150897A (en) * | 2010-01-21 | 2011-08-04 | Fujikura Ltd | Electron beam curing conductive paste and method of manufacturing circuit board using the conductive paste |
JP2013026089A (en) * | 2011-07-22 | 2013-02-04 | Fujikura Ltd | Conductive paste for electron beam hardening, and manufacturing method of circuit board using the same |
JP2014074132A (en) * | 2012-10-05 | 2014-04-24 | Kyocera Chemical Corp | Thermosetting resin composition for semiconductor bonding and semiconductor device |
JP2017069175A (en) * | 2015-09-30 | 2017-04-06 | Dowaエレクトロニクス株式会社 | Conductive paste and conductive film |
JP2017106023A (en) * | 2015-01-29 | 2017-06-15 | 住友ベークライト株式会社 | Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device and method for bonding heat dissipating plate |
JP2017130357A (en) * | 2016-01-20 | 2017-07-27 | 住友ベークライト株式会社 | Conductive paste and method for manufacturing cured body of conductive paste |
JP2017130393A (en) * | 2016-01-21 | 2017-07-27 | 国立大学法人群馬大学 | Conductive paste and method for forming silver film |
JP2019140145A (en) * | 2018-02-06 | 2019-08-22 | ローム株式会社 | Semiconductor device and manufacturing method thereof |
WO2019167819A1 (en) * | 2018-03-01 | 2019-09-06 | 住友ベークライト株式会社 | Paste adhesive composition and semiconductor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013067673A (en) * | 2011-09-20 | 2013-04-18 | Hitachi Chemical Co Ltd | Resin paste composition and semiconductor device |
KR102040529B1 (en) * | 2016-08-19 | 2019-11-06 | 스미또모 베이크라이트 가부시키가이샤 | Die attach pastes and semiconductor devices |
WO2018079533A1 (en) * | 2016-10-31 | 2018-05-03 | 住友ベークライト株式会社 | Thermally conductive paste and electronic device |
-
2021
- 2021-01-21 WO PCT/JP2021/001980 patent/WO2021153405A1/en active Application Filing
- 2021-01-21 CN CN202180011544.6A patent/CN115023453A/en active Pending
- 2021-01-21 JP JP2021545737A patent/JP7279802B2/en active Active
- 2021-01-27 TW TW110103057A patent/TW202138507A/en unknown
-
2022
- 2022-10-28 JP JP2022172992A patent/JP2023015160A/en active Pending
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11150135A (en) * | 1997-11-17 | 1999-06-02 | Nec Corp | Conductive paste of superior thermal conductivity and electronic device |
JPH11316456A (en) * | 1998-02-17 | 1999-11-16 | Toppan Printing Co Ltd | Solvent-free type photosensitive calcination paste composition, solvent type photosensitive calcination paste composition and structural body |
JP2004139754A (en) * | 2002-10-15 | 2004-05-13 | Mitsubishi Paper Mills Ltd | Silver oxide paste and manufacturing method of metal silver from silver oxide paste |
JP2009295895A (en) * | 2008-06-09 | 2009-12-17 | Sumitomo Bakelite Co Ltd | Conductive paste for circuit board |
JP2011122129A (en) * | 2009-11-12 | 2011-06-23 | Sekisui Chem Co Ltd | Inorganic fine particle dispersed paste composition |
JP2011150897A (en) * | 2010-01-21 | 2011-08-04 | Fujikura Ltd | Electron beam curing conductive paste and method of manufacturing circuit board using the conductive paste |
JP2013026089A (en) * | 2011-07-22 | 2013-02-04 | Fujikura Ltd | Conductive paste for electron beam hardening, and manufacturing method of circuit board using the same |
JP2014074132A (en) * | 2012-10-05 | 2014-04-24 | Kyocera Chemical Corp | Thermosetting resin composition for semiconductor bonding and semiconductor device |
JP2017106023A (en) * | 2015-01-29 | 2017-06-15 | 住友ベークライト株式会社 | Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device and method for bonding heat dissipating plate |
JP2017069175A (en) * | 2015-09-30 | 2017-04-06 | Dowaエレクトロニクス株式会社 | Conductive paste and conductive film |
JP2017130357A (en) * | 2016-01-20 | 2017-07-27 | 住友ベークライト株式会社 | Conductive paste and method for manufacturing cured body of conductive paste |
JP2017130393A (en) * | 2016-01-21 | 2017-07-27 | 国立大学法人群馬大学 | Conductive paste and method for forming silver film |
JP2019140145A (en) * | 2018-02-06 | 2019-08-22 | ローム株式会社 | Semiconductor device and manufacturing method thereof |
WO2019167819A1 (en) * | 2018-03-01 | 2019-09-06 | 住友ベークライト株式会社 | Paste adhesive composition and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN115023453A (en) | 2022-09-06 |
TW202138507A (en) | 2021-10-16 |
JP7279802B2 (en) | 2023-05-23 |
WO2021153405A1 (en) | 2021-08-05 |
JP2023015160A (en) | 2023-01-31 |
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