JPWO2021125152A1 - - Google Patents
Info
- Publication number
- JPWO2021125152A1 JPWO2021125152A1 JP2021565581A JP2021565581A JPWO2021125152A1 JP WO2021125152 A1 JPWO2021125152 A1 JP WO2021125152A1 JP 2021565581 A JP2021565581 A JP 2021565581A JP 2021565581 A JP2021565581 A JP 2021565581A JP WO2021125152 A1 JPWO2021125152 A1 JP WO2021125152A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Engineering & Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019227280 | 2019-12-17 | ||
PCT/JP2020/046636 WO2021125152A1 (ja) | 2019-12-17 | 2020-12-15 | 半導体加工用テープ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021125152A1 true JPWO2021125152A1 (zh) | 2021-06-24 |
Family
ID=76477556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021565581A Pending JPWO2021125152A1 (zh) | 2019-12-17 | 2020-12-15 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2021125152A1 (zh) |
KR (1) | KR102565398B1 (zh) |
CN (1) | CN114729232A (zh) |
TW (1) | TW202132502A (zh) |
WO (1) | WO2021125152A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115044340A (zh) * | 2022-06-24 | 2022-09-13 | 山东亿博润新材料科技有限公司 | 一种抗静电型聚氨酯胶水及其制备方法和应用 |
CN115058218B (zh) * | 2022-07-26 | 2023-01-31 | 珠海市泽涛粘合制品有限公司 | 一种丙烯酸酯改性聚氨酯胶黏剂及其制备方法和应用 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61207476A (ja) * | 1985-03-12 | 1986-09-13 | Hitachi Chem Co Ltd | 絞り加工の表面保護フイルム用放射線硬化型粘着剤 |
JP2621457B2 (ja) * | 1989-01-30 | 1997-06-18 | 日立化成工業株式会社 | 放射線硬化型感圧性接着剤組成物 |
JP4726405B2 (ja) | 2002-07-26 | 2011-07-20 | 日東電工株式会社 | 加工用粘着シートとその製造方法 |
US7641946B2 (en) * | 2005-08-08 | 2010-01-05 | Nitto Denko Corporation | Adhesive film and image display device |
JP2009120820A (ja) | 2007-10-24 | 2009-06-04 | Asahi Glass Co Ltd | 電子部品用粘着シート |
JPWO2009113216A1 (ja) * | 2008-03-10 | 2011-07-21 | 古河電気工業株式会社 | 電子部品加工用粘着テープ |
JP2009260332A (ja) * | 2008-03-26 | 2009-11-05 | Furukawa Electric Co Ltd:The | 半導体ウエハ固定用帯電防止性粘着テープ |
JP5534896B2 (ja) * | 2010-03-30 | 2014-07-02 | 古河電気工業株式会社 | 帯電防止性半導体加工用粘着テープ |
JP5607401B2 (ja) * | 2010-03-30 | 2014-10-15 | 古河電気工業株式会社 | 帯電防止型半導体加工用粘着テープ |
CN103640353B (zh) * | 2013-12-02 | 2015-12-30 | 江苏耐斯数码科技股份有限公司 | 一种医用胶片的防静电层及制备方法 |
SG11201708797YA (en) * | 2015-04-30 | 2017-11-29 | Lintec Corp | Adhesive tape for work processing |
JP6703596B2 (ja) * | 2016-03-31 | 2020-06-03 | 三井化学東セロ株式会社 | 半導体ウェハ加工用粘着性フィルム |
JP6829250B2 (ja) * | 2016-04-15 | 2021-02-10 | デンカ株式会社 | 半導体加工用粘着テープ、及びそれを用いた半導体チップ又は半導体部品の製造方法 |
JP6618038B2 (ja) * | 2016-06-29 | 2019-12-11 | 荒川化学工業株式会社 | 粘着剤組成物 |
JP6715109B2 (ja) | 2016-06-30 | 2020-07-01 | 三井化学東セロ株式会社 | 半導体ウェハ加工用粘着性フィルム |
CN111164176B (zh) * | 2017-10-05 | 2022-03-08 | 昭和电工株式会社 | 粘着剂组合物及粘着片 |
-
2020
- 2020-12-15 KR KR1020227015871A patent/KR102565398B1/ko active IP Right Grant
- 2020-12-15 JP JP2021565581A patent/JPWO2021125152A1/ja active Pending
- 2020-12-15 TW TW109144197A patent/TW202132502A/zh unknown
- 2020-12-15 WO PCT/JP2020/046636 patent/WO2021125152A1/ja active Application Filing
- 2020-12-15 CN CN202080078579.7A patent/CN114729232A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR102565398B1 (ko) | 2023-08-08 |
CN114729232A (zh) | 2022-07-08 |
WO2021125152A1 (ja) | 2021-06-24 |
TW202132502A (zh) | 2021-09-01 |
KR20220082872A (ko) | 2022-06-17 |
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