JPWO2020100849A1 - 実装型電子部品、および、電子回路モジュール - Google Patents
実装型電子部品、および、電子回路モジュール Download PDFInfo
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Abstract
Description
図3(A)は、第1の実施形態に係る電子回路モジュールの第1態様の構成を示す側面断面図である。図3(B)は、比較対象の電子回路モジュールの構成を示す側面断面図である。
図4(A)は、第1の実施形態に係る電子回路モジュールの第2態様の構成を示す平面図である。図4(B)は、比較対象の電子回路モジュールの構成を示す平面図である。なお、図4(A)に示す電子回路モジュール90は、図3(A)に示す電子回路モジュール90の派生であり、図4(B)に示す比較対象の電子回路モジュール90Pは、図3(B)に示す電子回路モジュール90Pの派生であるので、図3(A)および図3(B)に対する説明と同様の内容については説明を省略する。
図5は、第1の実施形態に係る実装型電子部品の製造方法を示すフローチャートである。図6(A)、図6(B)、図6(C)、図6(D)は、図5に示す実装型電子部品の製造方法における所定の工程での状態を示す側面断面図である。
20:基板
31、31A:第1電子部品
32、32A:第2電子部品
31P、32P:電子部品
41、42、941、942:モールド樹脂
50:端子導体
51:側面
60:シールド膜
90、90E、90P:電子回路モジュール
91:モジュール用回路基板
92:半導体回路基板
93:チップ型実装部品
95:端子導体
201:第1主面
202:第2主面
311:一方面
312:他方面
313、323:圧電体基板
314、324:支持基板
321:一方面
322:他方面
911:主面
912:主面
Claims (9)
- 第1主面と第2主面とを有し、配線導体を備える基板と、
前記第1主面に実装され、一方面側に第1電気的機能部が形成され、他方面側に前記第1電気的機能部が形成されていない第1電子部品と、
前記第2主面に実装され、一方面側に第2電気的機能部が形成され、他方面側に前記第2電気的機能部が形成されていない第2電子部品と、
前記第1電子部品の少なくとも一部を覆う、前記第1主面に形成された第1モールド樹脂と、
前記第2電子部品の少なくとも一部を覆う、前記第2主面に形成された第2モールド樹脂と、
前記基板の前記配線導体を外部の回路に接続するための端子導体と、
を備え、
前記第1電子部品は、前記第1電気的機能部が形成される一方面が前記第1主面に対向するように、前記基板へ実装され、
前記第2電子部品は、前記第2電気的機能部が形成される一方面が前記第2主面に対向するように、前記基板へ実装され、
前記第1電子部品と前記第2電子部品は、前記基板の厚み方向から視て、少なくとも一部が重なっており、
前記第1電子部品の他方面は、前記第1モールド樹脂から露出しており、
前記第2電子部品の他方面は、前記第2モールド樹脂から露出している、
実装型電子部品。 - 第1主面と第2主面とを有し、配線導体を備える基板と、
前記第1主面に実装され、一方面側に第1電気的機能部が形成され、他方面側に前記第1電気的機能部が形成されていない第1電子部品と、
前記第2主面に実装され、一方面側に第2電気的機能部が形成され、他方面側に前記第2電気的機能部が形成されていない第2電子部品と、
前記第1電子部品の少なくとも一部を覆う、前記第1主面に形成された第1モールド樹脂と、
前記第2電子部品の少なくとも一部を覆う、前記第2主面に形成された第2モールド樹脂と、
前記基板の前記配線導体を外部の回路に接続するための端子導体と、
を備え、
前記第1電子部品は、前記第1電気的機能部が形成される一方面が前記第1主面に対向するように、前記基板へ実装され、
前記第2電子部品は、前記第2電気的機能部が形成される一方面が前記第2主面に対向するように、前記基板へ実装され、
前記第1電子部品と前記第2電子部品は、前記基板の厚み方向から視て、少なくとも一部が重なっており、
前記基板には、前記第1電子部品と前記第2電子部品のみが実装されている、
実装型電子部品。 - 前記第1電子部品の平面面積は、前記第2電子部品の平面面積よりも大きく、
前記端子導体は、前記基板の前記第2主面側に形成され、前記厚み方向から視て、前記第1電子部品に、少なくとも一部が重なっている、
請求項1または請求項2に記載の実装型電子部品。 - 前記第1電子部品、前記第2電子部品は、半導体素子である、
請求項1乃至請求項3のいずれかに記載の実装型電子部品。 - 前記第1電子部品、前記第2電子部品は、圧電体素子である、
請求項1乃至請求項3のいずれかに記載の実装型電子部品。 - 前記端子導体は、前記第2モールド樹脂の側面から露出している、
請求項1乃至請求項5のいずれかに記載の実装型電子部品。
- 前記端子導体は、前記厚み方向から視て、前記第2電子部品の一方の側面側のみに配置されている、
請求項1乃至請求項6のいずれかに記載の実装型電子部品。 - 前記第1電子部品、前記第1モールド樹脂、前記基板の側面、および、前記第2モールド樹脂の側面を覆い、且つ、前記第2電子部品における前記基板側と反対側の面、および、前記第2モールド樹脂における前記基板側と反対側の面を露出する、導電性膜を備える、
請求項1乃至請求項7のいずれかに記載の実装型電子部品。 - 請求項1乃至請求項8のいずれかに記載の実装型電子部品と、
チップ型実装部品と、
前記実装型電子部品と、前記チップ型実装部品とが同一面に実装されたモジュール回路基板と、
を備え、
前記実装型電子部品の厚みは、前記チップ型実装部品の厚み以下である、
電子回路モジュール。
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US7098580B2 (en) * | 2004-01-29 | 2006-08-29 | Kyocera Corporation | Piezoelectric oscillator |
CN104303289B (zh) * | 2013-05-13 | 2017-10-24 | 新电元工业株式会社 | 电子模块及其制造方法 |
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US20210265555A1 (en) | 2021-08-26 |
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