JP6669248B2 - 回路モジュール - Google Patents
回路モジュール Download PDFInfo
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- JP6669248B2 JP6669248B2 JP2018508067A JP2018508067A JP6669248B2 JP 6669248 B2 JP6669248 B2 JP 6669248B2 JP 2018508067 A JP2018508067 A JP 2018508067A JP 2018508067 A JP2018508067 A JP 2018508067A JP 6669248 B2 JP6669248 B2 JP 6669248B2
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Description
また、このように引出電極として上側引出電極及び下側引出電極の少なくとも1つを配置することにより、反り及びうねりが発生しやすい多層基板の側方端部において、これらの発生を一層抑制することができる。このため、シールド電極と内層グランド電極との接続信頼性を一層高めることができる。また、内層グランド電極の上側及び下側の少なくとも1つに引出電極が配置されていることにより、多層基板の反り及びうねりの態様によらず、シールド電極と内層グランド電極との接続信頼性を高めることができる。
また、前記引出電極は、前記内層グランド電極よりも上側に配置された上側引出電極と、前記内層グランド電極よりも下側に配置された下側引出電極とを含むことにしてもよい。
このように引出電極として複数層に配置された電極(上側引出電極及び下側引出電極)を配置することにより、反り及びうねりが発生しやすい多層基板の側方端部において、これらの発生を一層抑制することができる。このため、シールド電極と内層グランド電極との接続信頼性を一層高めることができる。また、内層グランド電極の上側及び下側のそれぞれに引出電極(上側引出電極または下側引出電極)が配置されていることにより、多層基板の反り及びうねりの態様によらず、シールド電極と内層グランド電極との接続信頼性を高めることができる。
図1は、実施の形態1に係る回路モジュール1の斜視図である。
なお、引出電極は、内層グランド電極131上に直接配置されていなくてもよく、例えば、ビア122を介して内層グランド電極131に接続されていてもかまわない。
また、上記実施の形態1では、引出電極132は、積層方向に見て、多層基板10の辺に沿って等間隔に配置されるとしたが、これに限らない。
また、多層基板10の内層には、さらに、BASペースト層が配置されていてもかまわない。
上記実施の形態1及びその変形例では、引出電極は多層基板10内の1層にのみ配置されていた。しかし、引出電極は、多層基板10内の複数層に配置されていてもかまわない。また、上記実施の形態1及びその変形例では、多層基板10内にダミー電極151が配置されるとしたが、ダミー電極151は配置されていなくてもかまわない。そこで、以下、このような構成を有する回路モジュールを実施の形態2として説明する。
以上、本発明の実施の形態及びその変形例に係る回路モジュールについて説明したが、本発明は、個々の実施の形態及びその変形例には限定されない。本発明の趣旨を逸脱しない限り、当業者が思いつく各種変形を本実施の形態及びその変形例に施したものや、異なる実施の形態及びその変形例における構成要素を組み合わせて構築される形態も、本発明の一つまたは複数の態様の範囲内に含まれてもよい。
10 多層基板
11 積層素体
21〜23 実装部品
30 樹脂
40 シールド電極
111〜118 基材層
121 パターン配線
122 ビア
131 内層グランド電極
132、132A、132B 引出電極
141、142 表面電極
151 ダミー電極
161 BASペースト層
232 上側引出電極
233 下側引出電極
Claims (10)
- 内層グランド電極及び当該内層グランド電極から引き出された引出電極を有する多層基板と、
前記多層基板に実装された実装部品と、
前記実装部品を覆う樹脂と、
前記樹脂、及び前記多層基板の側面の少なくとも一部を覆うシールド電極とを備え、
前記引出電極は、
前記多層基板内で前記内層グランド電極と電気的に接続され、かつ、前記多層基板の積層方向に見て少なくとも一部が前記内層グランド電極に重なるように配置され、
端部が前記多層基板の側面から露出して前記シールド電極に接続されており、
前記内層グランド電極よりも上側に配置された上側引出電極、及び、前記内層グランド電極よりも下側に配置された下側引出電極の少なくとも1つを含み、
前記内層グランド電極は、端部が前記多層基板の側面から露出して前記シールド電極に接続されている、
回路モジュール。 - 前記引出電極は、
前記内層グランド電極よりも上側に配置された上側引出電極と、
前記内層グランド電極よりも下側に配置された下側引出電極とを含む、
請求項1に記載の回路モジュール。 - 前記多層基板は、前記実装部品とともに所定の回路を構成する1以上のパターン配線を内層に有し、
前記引出電極の端部は、前記積層方向に見て、前記パターン配線の密度が他よりも低い部分に近接する前記多層基板の辺において、前記シールド電極に接続されている、
請求項1または2に記載の回路モジュール。 - 前記引出電極は、前記内層グランド電極上に直接配置されている、
請求項1〜3のいずれか1項に記載の回路モジュール。 - 前記多層基板の同一の層に、複数の前記引出電極が配置されている、
請求項1〜4のいずれか1項に記載の回路モジュール。 - 前記上側引出電極と前記下側引出電極とは、前記積層方向に見て、前記多層基板の辺に沿って交互に配置される、
請求項2に記載の回路モジュール。 - 前記多層基板は、さらに、前記積層方向に見て前記引出電極と重ならない位置に配置されたダミー電極を有する、
請求項1〜6のいずれか1項に記載の回路モジュール。 - 前記多層基板は、さらに、前記積層方向に見て前記引出電極と重ならない位置に配置されたBASペースト層を有する、
請求項1〜7のいずれか1項に記載の回路モジュール。 - 前記内層グランド電極は、前記積層方向に見て、前記多層基板の略全体に配置されている、
請求項1〜8のいずれか1項に記載の回路モジュール。 - 前記引出電極は、前記積層方向に見て、前記多層基板の端部のみに配置されている、
請求項1〜9のいずれか1項に記載の回路モジュール。
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US12027652B2 (en) | 2018-12-27 | 2024-07-02 | Denka Company Limited | Phosphor substrate, light emitting substrate, and lighting device |
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