JPWO2016136899A1 - 気密パッケージの製造方法 - Google Patents
気密パッケージの製造方法 Download PDFInfo
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- JPWO2016136899A1 JPWO2016136899A1 JP2017502479A JP2017502479A JPWO2016136899A1 JP WO2016136899 A1 JPWO2016136899 A1 JP WO2016136899A1 JP 2017502479 A JP2017502479 A JP 2017502479A JP 2017502479 A JP2017502479 A JP 2017502479A JP WO2016136899 A1 JPWO2016136899 A1 JP WO2016136899A1
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- sealing material
- material layer
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- substrate
- ceramic substrate
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
- C04B37/045—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass characterised by the interlayer used
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- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/59—Aspects relating to the structure of the interlayer
- C04B2237/592—Aspects relating to the structure of the interlayer whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
10、20 セラミック基体
11、22 部材
12、24 封着材料層
13、25 ガラス基板
14、26レーザー照射装置
21 枠部
23 枠部の頂部
L レーザー光
Claims (10)
- セラミック基体を用意すると共に、セラミック基体上に封着材料層を形成する工程と、
ガラス基板を用意すると共に、ガラス基板がセラミック基体上の封着材料層に接触するように、セラミック基体とガラス基板を配置する工程と、
レーザー光をガラス基板側から封着材料層に向けて照射し、封着材料層を介してセラミック基体とガラス基板を封着して、気密パッケージを得る工程と、を備えることを特徴とする気密パッケージの製造方法。 - 基部と基部上に設けられた枠部とを有するセラミック基体を用い、枠部の頂部に封着材料層を形成することを特徴とする請求項1に記載の気密パッケージの製造方法。
- 枠部の頂部を研磨処理した後に、封着材料層を形成することを特徴とする請求項2に記載の気密パッケージの製造方法。
- 枠部の頂部の表面粗さRaが0.5μm未満になるように、枠部の頂部を研磨処理することを特徴とする請求項2又は3に記載の気密パッケージの製造方法。
- 封着材料ペーストを塗布、焼成して、セラミック基体上に封着材料の焼結体からなる封着材料層を形成することを特徴とする請求項1〜4の何れかに記載の気密パッケージの製造方法。
- 55〜95体積%のビスマス系ガラスと5〜45体積%の耐火性フィラーを含有する封着材料を用いることを特徴とする請求項5に記載の気密パッケージの製造方法。
- 封着材料層の平均厚みを10μm未満とすることを特徴とする請求項1〜6の何れかに記載の気密パッケージの製造方法。
- セラミック基体と封着材料層の熱膨張係数の差を45×10−7/℃未満とし、且つ封着材料層とガラス基板の熱膨張係数の差を45×10−7/℃未満とすることを特徴とする請求項1〜7の何れかに記載の気密パッケージの製造方法。
- グリーンシートの積層体を焼結して、セラミック基体を作製することを特徴とする請求項1〜8の何れかに記載の気密パッケージの製造方法。
- 請求項1〜9の何れかに記載の気密パッケージの製造方法により作製されてなることを特徴とする気密パッケージ。
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JP6819933B2 (ja) * | 2016-10-07 | 2021-01-27 | 日本電気硝子株式会社 | 気密パッケージ及びその製造方法 |
WO2018131471A1 (ja) * | 2017-01-11 | 2018-07-19 | 日本電気硝子株式会社 | 気密パッケージ及びガラス蓋 |
JP6922253B2 (ja) * | 2017-01-11 | 2021-08-18 | 日本電気硝子株式会社 | ガラス蓋 |
JP6913276B2 (ja) * | 2017-01-26 | 2021-08-04 | 日本電気硝子株式会社 | 気密パッケージ |
CN110249421B (zh) * | 2017-02-07 | 2023-10-24 | 日本电气硝子株式会社 | 气密封装体 |
JP7169739B2 (ja) * | 2017-02-23 | 2022-11-11 | 日本電気硝子株式会社 | ビスマス系ガラス粉末、封着材料及び気密パッケージ |
JP6913279B2 (ja) * | 2017-02-27 | 2021-08-04 | 日本電気硝子株式会社 | 気密パッケージ |
JP6838434B2 (ja) | 2017-03-13 | 2021-03-03 | オムロン株式会社 | 環境センサ |
JP7047270B2 (ja) * | 2017-07-14 | 2022-04-05 | 日本電気硝子株式会社 | 封着材料層付きパッケージ基体の製造方法及び気密パッケージの製造方法 |
JP7168903B2 (ja) * | 2018-09-06 | 2022-11-10 | 日本電気硝子株式会社 | 気密パッケージ |
DE102019121298A1 (de) * | 2019-08-07 | 2021-02-11 | Schott Ag | Hermetisch verschlossene Glasumhäusung |
KR102573838B1 (ko) * | 2020-04-09 | 2023-08-31 | 예놉틱 옵틱컬 시스템즈 게엠베하 | 유리 요소를 지지 요소에 열적으로 안정적으로 접합시키는 방법, 광학 디바이스를 제조하는 방법 및 광학 디바이스 |
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