JPWO2016104088A1 - パワー半導体モジュール及びこれを用いた電動パワーステアリング装置 - Google Patents
パワー半導体モジュール及びこれを用いた電動パワーステアリング装置 Download PDFInfo
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- JPWO2016104088A1 JPWO2016104088A1 JP2016564652A JP2016564652A JPWO2016104088A1 JP WO2016104088 A1 JPWO2016104088 A1 JP WO2016104088A1 JP 2016564652 A JP2016564652 A JP 2016564652A JP 2016564652 A JP2016564652 A JP 2016564652A JP WO2016104088 A1 JPWO2016104088 A1 JP WO2016104088A1
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- H01L2924/151—Die mounting substrate
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- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Power Steering Mechanism (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Inverter Devices (AREA)
- Steering Control In Accordance With Driving Conditions (AREA)
Abstract
Description
2 コラム軸(ステアリングシャフト、ハンドル軸)
3 減速機構
4a 4b ユニバーサルジョイント
5 ピニオンラック機構
6a 6b タイロッド
7a 7b ハブユニット
8L 8R 操向車輪
10 トルクセンサ
11 イグニションキー
12 車速センサ
13 バッテリ
14 舵角センサ
20 電動モータ
23 モータリレー
100 制御装置(コントロールユニット、ECU)
101 電流指令値演算部
104 PI制御部
105 PWM制御部
106 インバータ
110 補償信号生成部
400 パワー半導体要素
410 金属板
410A 金属平板部分
410B 外部接続端子部
410C 穴
415 外部接続端子
430 パワー半導体ベアチップ
431 ソース電極
433 ゲート電極
435 ドレイン電極
450 ワイヤ
500 700 900 1000 実施形態
510 金属製コネクタ(クリップ)
530 電気絶縁性の樹脂(パッケージ)
C 仮想的な円柱
S 仮想的な円柱の主軸
T 仮想的な三角柱
Claims (11)
- 少なくとも1つの外部接続端子が形成された金属板に1つの電極部分で接続されたパワー半導体ベアチップと前記半導体ベアチップの他の電極部分と電気的に接続された他の外部接続端子とからなるパワー半導体要素を複数配列して同一のパッケージ内に収容して形成したパワー半導体モジュールであって、
前記複数のパワー半導体要素は基本的に同一の外形を有しており、
前記複数のパワー半導体要素の前記ベアチップの電極は、金属製コネクタまたはワイヤにより、前記複数のパワー半導体要素間で相互接続されており、
前記パッケージは前記複数のパワー半導体要素を電気絶縁性の樹脂で封止した樹脂モールドパッケージである
ことを特徴とするパワー半導体モジュール。 - 前記パワー半導体ベアチップは電界効果トランジスタのベアチップであり、
前記ベアチップのドレイン電極を前記1つの外部接続端子が形成された金属板に接合し、前記ベアチップのゲート電極及びソース電極は前記ドレイン電極よりも前記1つの外部接続端子から離間した側に設けられ、
前記ゲート電極又はソース電極の一部は、前記パワー半導体要素間で前記金属製コネクタまたはワイヤにより相互接続されている請求項1に記載のパワー半導体モジュール。 - 前記1つの外部接続端子と前記他の外部接続端子とは、相互に平行に配置されている請求項1又は2に記載のパワー半導体モジュール。
- 前記複数配列は、少なくとも2以上の前記パワー半導体要素を平面上に並列して配列したものである請求項1乃至3のいずれか1項に記載のパワー半導体モジュール。
- 前記複数配列は、少なくとも2以上の前記パワー半導体要素を仮想的な曲面に沿って並列して配列したものである請求項1乃至3のいずれか1項に記載のパワー半導体モジュール。
- 前記仮想的な曲面が円筒の側面であり、前記相互に平行に配置された外部接続端子は更に前記円筒の主軸の方向と平行である請求項5に記載のパワー半導体モジュール。
- 前記複数配列は、少なくとも2以上の前記パワー半導体要素を仮想的な多角形からなる角柱の各側面に沿って並列して配列したものであり、前記相互に平行に配置された外部接続端子は更に前記角柱の主軸の方向と平行である請求項3に記載のパワー半導体モジュール。
- 前記金属板の材料が銅又はアルミニウムである請求項1乃至7のいずれか1項に記載のパワー半導体モジュール。
- 前記金属板は前記パッケージ内部から外部へ露出する露出部分を有しており、前記露出部分を外部に設けた放熱器に接続可能な請求項1乃至8のいずれか1項に記載のパワー半導体モジュール。
- 3相ブラシレスモータを駆動する際に、各1相の制御に前記パワー半導体要素3つを同一のパッケージ内に収容して形成した請求項1乃至9のいずれか1項に記載のパワー半導体モジュールを用いることを特徴とする制御装置。
- 請求項1乃至9のいずれか1項に記載のパワー半導体モジュールを用いることを特徴とする電動パワーステアリング装置。
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JP6559728B2 (ja) * | 2017-04-04 | 2019-08-14 | 株式会社豊田中央研究所 | 半導体装置及び電力変換装置 |
DE102018201206A1 (de) * | 2018-01-26 | 2019-08-01 | Siemens Aktiengesellschaft | Modulare Anordnung eines Umrichters und Luftfahrzeug mit einer derartigen Anordnung |
US11682606B2 (en) * | 2019-02-07 | 2023-06-20 | Ford Global Technologies, Llc | Semiconductor with integrated electrically conductive cooling channels |
JP7211268B2 (ja) * | 2019-05-30 | 2023-01-24 | 株式会社デンソー | 半導体モジュール |
JP2022010604A (ja) * | 2020-06-29 | 2022-01-17 | 日本電産サンキョー株式会社 | 電子機器 |
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CN107112317A (zh) | 2017-08-29 |
EP3240026A4 (en) | 2018-09-05 |
US10096572B2 (en) | 2018-10-09 |
JP6137421B2 (ja) | 2017-05-31 |
JP6337986B2 (ja) | 2018-06-06 |
EP3240026A1 (en) | 2017-11-01 |
JP2017152727A (ja) | 2017-08-31 |
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US20170338201A1 (en) | 2017-11-23 |
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