JPS649617A - Exposure method - Google Patents
Exposure methodInfo
- Publication number
- JPS649617A JPS649617A JP62164005A JP16400587A JPS649617A JP S649617 A JPS649617 A JP S649617A JP 62164005 A JP62164005 A JP 62164005A JP 16400587 A JP16400587 A JP 16400587A JP S649617 A JPS649617 A JP S649617A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- blinded
- region
- reticle
- direct drawing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To increase the number of device chips, which can be provided from one sheet of a wafer, by blinding either region of a device pattern, which is formed on A reticle, or a wafer alignment mark region for direct drawing, of a charged beam, exposing only the pattern of the other region, and performing said operations in the predetermined sequence. CONSTITUTION:In an exposure sequence A, a wafer alignment mark 103 for direct drawing of a charge is blinded as shown by a shaded area. The blinding position is blinded by specifying the positions of a-a'-d-d' with the distances from the center of a reticle. Thus the outer parts from the center are blinded. Only a device pattern region 102 is exposed on a wafer 201 in the predetermined sequence by using the reticle 101, which is blinded in this way. In an exposure sequence B, the device pattern region 102 is blinded, and only the four water alignment marks 103 for direct drawing of the charged beam are exposed on the wafer 201 in the predetermined sequence. Thus the exposure can be performed at the desired positions of the wafer 201.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62164005A JPS649617A (en) | 1987-07-02 | 1987-07-02 | Exposure method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62164005A JPS649617A (en) | 1987-07-02 | 1987-07-02 | Exposure method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS649617A true JPS649617A (en) | 1989-01-12 |
Family
ID=15784952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62164005A Pending JPS649617A (en) | 1987-07-02 | 1987-07-02 | Exposure method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS649617A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03155612A (en) * | 1989-11-14 | 1991-07-03 | Matsushita Electric Ind Co Ltd | Forming method for alignment mark |
JPH04297016A (en) * | 1991-03-26 | 1992-10-21 | Soltec:Kk | Preparing method of x-ray mask |
-
1987
- 1987-07-02 JP JP62164005A patent/JPS649617A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03155612A (en) * | 1989-11-14 | 1991-07-03 | Matsushita Electric Ind Co Ltd | Forming method for alignment mark |
JPH04297016A (en) * | 1991-03-26 | 1992-10-21 | Soltec:Kk | Preparing method of x-ray mask |
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