JPS647697A - Manufacture of hybrid multi-layer circuit board - Google Patents

Manufacture of hybrid multi-layer circuit board

Info

Publication number
JPS647697A
JPS647697A JP62162570A JP16257087A JPS647697A JP S647697 A JPS647697 A JP S647697A JP 62162570 A JP62162570 A JP 62162570A JP 16257087 A JP16257087 A JP 16257087A JP S647697 A JPS647697 A JP S647697A
Authority
JP
Japan
Prior art keywords
circuit board
copper
flexible
overlaid
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62162570A
Other languages
English (en)
Other versions
JP2631287B2 (ja
Inventor
Eiichi Kameda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP62162570A priority Critical patent/JP2631287B2/ja
Priority to US07/210,637 priority patent/US4872934A/en
Priority to GB8815124A priority patent/GB2207288B/en
Priority to DE3822071A priority patent/DE3822071C2/de
Publication of JPS647697A publication Critical patent/JPS647697A/ja
Application granted granted Critical
Publication of JP2631287B2 publication Critical patent/JP2631287B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP62162570A 1987-06-30 1987-06-30 混成多層回路基板の製造法 Expired - Lifetime JP2631287B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP62162570A JP2631287B2 (ja) 1987-06-30 1987-06-30 混成多層回路基板の製造法
US07/210,637 US4872934A (en) 1987-06-30 1988-06-23 Method of producing hybrid multi-layered circuit substrate
GB8815124A GB2207288B (en) 1987-06-30 1988-06-24 An improved method of producing a hybrid multi-layered circuit substrate
DE3822071A DE3822071C2 (de) 1987-06-30 1988-06-30 Verfahren zur Herstellung von mehrlagigen starr-flexiblen Leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62162570A JP2631287B2 (ja) 1987-06-30 1987-06-30 混成多層回路基板の製造法

Publications (2)

Publication Number Publication Date
JPS647697A true JPS647697A (en) 1989-01-11
JP2631287B2 JP2631287B2 (ja) 1997-07-16

Family

ID=15757098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62162570A Expired - Lifetime JP2631287B2 (ja) 1987-06-30 1987-06-30 混成多層回路基板の製造法

Country Status (4)

Country Link
US (1) US4872934A (ja)
JP (1) JP2631287B2 (ja)
DE (1) DE3822071C2 (ja)
GB (1) GB2207288B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0720419A1 (en) * 1994-12-28 1996-07-03 Asahi Glass Company Ltd. A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same
WO2011062146A1 (ja) * 2009-11-20 2011-05-26 株式会社村田製作所 リジッド－フレキシブル多層配線基板の製造方法および集合基板
JP2020017634A (ja) * 2018-07-25 2020-01-30 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE58904878D1 (de) * 1989-07-15 1993-08-12 Freudenberg Carl Fa Verfahren zur herstellung von starre und flexible bereiche aufweisenden leiterplatten oder leiterplatten-innenlagen.
DE69210329T2 (de) * 1991-07-25 1996-11-28 Ncr Int Inc Mehrschichtiger Träger für integrierte Schaltungen und Verfahren zu dessen Herstellung
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
US5499444A (en) * 1994-08-02 1996-03-19 Coesen, Inc. Method of manufacturing a rigid flex printed circuit board
US5800724A (en) * 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
US5766499A (en) * 1996-04-26 1998-06-16 International Business Machines Corporation Method of making a circuitized substrate
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6226862B1 (en) * 1998-04-30 2001-05-08 Sheldahl, Inc. Method for manufacturing printed circuit board assembly
EP1108677B1 (fr) * 1999-12-15 2006-09-27 Asulab S.A. Procédé d'encapsulation hermétique in situ de microsystèmes
US6334971B1 (en) * 2000-07-20 2002-01-01 Wen-Ping Huang Manufacturing method for diode group processed by injection molding on the surface
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
JP4000507B2 (ja) * 2001-10-04 2007-10-31 ソニー株式会社 固体撮像装置の製造方法
DE10258090B4 (de) * 2002-09-19 2009-01-29 Ruwel Ag Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
DE102005062604A1 (de) * 2005-12-27 2007-07-05 Robert Bosch Gmbh Verfahren zur Herstellung eines elektronischen Schaltungsträgers, Veredelungsvorrichtung eines elektronischen Schaltungsträgers sowie Schaltungsträger
US8323798B2 (en) 2007-09-28 2012-12-04 Tri-Star Laminates, Inc. Systems and methods for drilling holes in printed circuit boards
CN101494956B (zh) * 2008-01-23 2011-03-30 富葵精密组件(深圳)有限公司 软硬结合板的制作方法
FI20085468A0 (fi) * 2008-05-16 2008-05-16 Polar Electro Oy Sähköpiirijärjestely
CN102458055B (zh) * 2010-10-20 2014-06-25 富葵精密组件(深圳)有限公司 软硬结合电路板的制作方法
CN102487577B (zh) * 2010-12-01 2014-02-05 富葵精密组件(深圳)有限公司 软硬结合电路板的制作方法
JP5840411B2 (ja) 2011-08-05 2016-01-06 日本メクトロン株式会社 光電気混載可撓性プリント配線板及びその受発光素子実装方法
CN104105363B (zh) * 2013-04-11 2017-08-22 富葵精密组件(深圳)有限公司 刚挠结合板及其制作方法
TWI501713B (zh) * 2013-08-26 2015-09-21 Unimicron Technology Corp 軟硬板模組以及軟硬板模組的製造方法
JP6177639B2 (ja) 2013-09-20 2017-08-09 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板
CN104470250A (zh) * 2013-09-25 2015-03-25 富葵精密组件(深圳)有限公司 软硬结合电路板的制作方法
TWI573503B (zh) * 2014-06-09 2017-03-01 The Power Supply Path Structure of Soft Circuit Board
US10381322B1 (en) 2018-04-23 2019-08-13 Sandisk Technologies Llc Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same
US10879260B2 (en) 2019-02-28 2020-12-29 Sandisk Technologies Llc Bonded assembly of a support die and plural memory dies containing laterally shifted vertical interconnections and methods for making the same
US11419213B2 (en) * 2019-03-26 2022-08-16 Western Digital Technologies, Inc. Multilayer flex circuit with non-plated outer metal layer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5470055U (ja) * 1977-10-27 1979-05-18
JPS54157275A (en) * 1978-06-02 1979-12-12 Tokyo Shibaura Electric Co Method of producing flexible compound printed circuit board
JPS5696891A (en) * 1979-11-20 1981-08-05 Kollmorgen Tech Corp Method of manufacturing laminated circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2657212C3 (de) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
US4149219A (en) * 1978-02-22 1979-04-10 The United States Of America As Represented By The Secretary Of The Navy Flexible printed circuit board assembly
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
DE3119884C1 (de) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
GB2101411B (en) * 1981-06-04 1985-06-05 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
CH667359A5 (de) * 1985-03-27 1988-09-30 Ppc Electronic Ag Verfahren zur herstellung einer starre und flexible partien aufweisenden leiterplatte fuer gedruckte elektrische schaltungen.
US4715928A (en) * 1985-09-27 1987-12-29 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5470055U (ja) * 1977-10-27 1979-05-18
JPS54157275A (en) * 1978-06-02 1979-12-12 Tokyo Shibaura Electric Co Method of producing flexible compound printed circuit board
JPS5696891A (en) * 1979-11-20 1981-08-05 Kollmorgen Tech Corp Method of manufacturing laminated circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0720419A1 (en) * 1994-12-28 1996-07-03 Asahi Glass Company Ltd. A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same
WO2011062146A1 (ja) * 2009-11-20 2011-05-26 株式会社村田製作所 リジッド－フレキシブル多層配線基板の製造方法および集合基板
JP5212549B2 (ja) * 2009-11-20 2013-06-19 株式会社村田製作所 リジッド−フレキシブル多層配線基板の製造方法および集合基板
US9119335B2 (en) 2009-11-20 2015-08-25 Murata Manufacturing Co., Ltd. Method for manufacturing rigid-flexible multilayer wiring board and collective board
JP2020017634A (ja) * 2018-07-25 2020-01-30 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板

Also Published As

Publication number Publication date
GB2207288B (en) 1991-09-11
GB2207288A (en) 1989-01-25
DE3822071A1 (de) 1989-01-12
JP2631287B2 (ja) 1997-07-16
US4872934A (en) 1989-10-10
DE3822071C2 (de) 1997-09-11
GB8815124D0 (en) 1988-08-03

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