JPS647697A - Manufacture of hybrid multi-layer circuit board - Google Patents
Manufacture of hybrid multi-layer circuit boardInfo
- Publication number
- JPS647697A JPS647697A JP62162570A JP16257087A JPS647697A JP S647697 A JPS647697 A JP S647697A JP 62162570 A JP62162570 A JP 62162570A JP 16257087 A JP16257087 A JP 16257087A JP S647697 A JPS647697 A JP S647697A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- copper
- flexible
- overlaid
- hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
- Y10T156/1057—Subsequent to assembly of laminae
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62162570A JP2631287B2 (ja) | 1987-06-30 | 1987-06-30 | 混成多層回路基板の製造法 |
US07/210,637 US4872934A (en) | 1987-06-30 | 1988-06-23 | Method of producing hybrid multi-layered circuit substrate |
GB8815124A GB2207288B (en) | 1987-06-30 | 1988-06-24 | An improved method of producing a hybrid multi-layered circuit substrate |
DE3822071A DE3822071C2 (de) | 1987-06-30 | 1988-06-30 | Verfahren zur Herstellung von mehrlagigen starr-flexiblen Leiterplatten |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62162570A JP2631287B2 (ja) | 1987-06-30 | 1987-06-30 | 混成多層回路基板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS647697A true JPS647697A (en) | 1989-01-11 |
JP2631287B2 JP2631287B2 (ja) | 1997-07-16 |
Family
ID=15757098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62162570A Expired - Lifetime JP2631287B2 (ja) | 1987-06-30 | 1987-06-30 | 混成多層回路基板の製造法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4872934A (ja) |
JP (1) | JP2631287B2 (ja) |
DE (1) | DE3822071C2 (ja) |
GB (1) | GB2207288B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0720419A1 (en) * | 1994-12-28 | 1996-07-03 | Asahi Glass Company Ltd. | A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same |
WO2011062146A1 (ja) * | 2009-11-20 | 2011-05-26 | 株式会社村田製作所 | リジッド-フレキシブル多層配線基板の製造方法および集合基板 |
JP2020017634A (ja) * | 2018-07-25 | 2020-01-30 | 日本メクトロン株式会社 | 多層プリント配線板の製造方法、および多層プリント配線板 |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE58904878D1 (de) * | 1989-07-15 | 1993-08-12 | Freudenberg Carl Fa | Verfahren zur herstellung von starre und flexible bereiche aufweisenden leiterplatten oder leiterplatten-innenlagen. |
DE69210329T2 (de) * | 1991-07-25 | 1996-11-28 | Ncr Int Inc | Mehrschichtiger Träger für integrierte Schaltungen und Verfahren zu dessen Herstellung |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
US5362534A (en) * | 1993-08-23 | 1994-11-08 | Parlex Corporation | Multiple layer printed circuit boards and method of manufacture |
US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
US5800724A (en) * | 1996-02-14 | 1998-09-01 | Fort James Corporation | Patterned metal foil laminate and method for making same |
US5766499A (en) * | 1996-04-26 | 1998-06-16 | International Business Machines Corporation | Method of making a circuitized substrate |
US6129990A (en) * | 1998-04-10 | 2000-10-10 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6355360B1 (en) | 1998-04-10 | 2002-03-12 | R.E. Service Company, Inc. | Separator sheet laminate for use in the manufacture of printed circuit boards |
US6129998A (en) * | 1998-04-10 | 2000-10-10 | R.E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6127051A (en) * | 1998-04-10 | 2000-10-03 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6226862B1 (en) * | 1998-04-30 | 2001-05-08 | Sheldahl, Inc. | Method for manufacturing printed circuit board assembly |
EP1108677B1 (fr) * | 1999-12-15 | 2006-09-27 | Asulab S.A. | Procédé d'encapsulation hermétique in situ de microsystèmes |
US6334971B1 (en) * | 2000-07-20 | 2002-01-01 | Wen-Ping Huang | Manufacturing method for diode group processed by injection molding on the surface |
US6783860B1 (en) | 2001-05-11 | 2004-08-31 | R. E. Service Company, Inc. | Laminated entry and exit material for drilling printed circuit boards |
JP4000507B2 (ja) * | 2001-10-04 | 2007-10-31 | ソニー株式会社 | 固体撮像装置の製造方法 |
DE10258090B4 (de) * | 2002-09-19 | 2009-01-29 | Ruwel Ag | Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich |
US20050112344A1 (en) * | 2003-08-20 | 2005-05-26 | Redfern Sean M. | Apparatus and method for use in printed circuit board drilling applications |
DE102005062604A1 (de) * | 2005-12-27 | 2007-07-05 | Robert Bosch Gmbh | Verfahren zur Herstellung eines elektronischen Schaltungsträgers, Veredelungsvorrichtung eines elektronischen Schaltungsträgers sowie Schaltungsträger |
US8323798B2 (en) | 2007-09-28 | 2012-12-04 | Tri-Star Laminates, Inc. | Systems and methods for drilling holes in printed circuit boards |
CN101494956B (zh) * | 2008-01-23 | 2011-03-30 | 富葵精密组件(深圳)有限公司 | 软硬结合板的制作方法 |
FI20085468A0 (fi) * | 2008-05-16 | 2008-05-16 | Polar Electro Oy | Sähköpiirijärjestely |
CN102458055B (zh) * | 2010-10-20 | 2014-06-25 | 富葵精密组件(深圳)有限公司 | 软硬结合电路板的制作方法 |
CN102487577B (zh) * | 2010-12-01 | 2014-02-05 | 富葵精密组件(深圳)有限公司 | 软硬结合电路板的制作方法 |
JP5840411B2 (ja) | 2011-08-05 | 2016-01-06 | 日本メクトロン株式会社 | 光電気混載可撓性プリント配線板及びその受発光素子実装方法 |
CN104105363B (zh) * | 2013-04-11 | 2017-08-22 | 富葵精密组件(深圳)有限公司 | 刚挠结合板及其制作方法 |
TWI501713B (zh) * | 2013-08-26 | 2015-09-21 | Unimicron Technology Corp | 軟硬板模組以及軟硬板模組的製造方法 |
JP6177639B2 (ja) | 2013-09-20 | 2017-08-09 | 日本メクトロン株式会社 | 多層プリント配線板の製造方法、および多層プリント配線板 |
CN104470250A (zh) * | 2013-09-25 | 2015-03-25 | 富葵精密组件(深圳)有限公司 | 软硬结合电路板的制作方法 |
TWI573503B (zh) * | 2014-06-09 | 2017-03-01 | The Power Supply Path Structure of Soft Circuit Board | |
US10381322B1 (en) | 2018-04-23 | 2019-08-13 | Sandisk Technologies Llc | Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same |
US10879260B2 (en) | 2019-02-28 | 2020-12-29 | Sandisk Technologies Llc | Bonded assembly of a support die and plural memory dies containing laterally shifted vertical interconnections and methods for making the same |
US11419213B2 (en) * | 2019-03-26 | 2022-08-16 | Western Digital Technologies, Inc. | Multilayer flex circuit with non-plated outer metal layer |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5470055U (ja) * | 1977-10-27 | 1979-05-18 | ||
JPS54157275A (en) * | 1978-06-02 | 1979-12-12 | Tokyo Shibaura Electric Co | Method of producing flexible compound printed circuit board |
JPS5696891A (en) * | 1979-11-20 | 1981-08-05 | Kollmorgen Tech Corp | Method of manufacturing laminated circuit board |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2657212C3 (de) * | 1976-12-17 | 1982-09-02 | Schoeller & Co Elektronik Gmbh, 3552 Wetter | Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten |
US4149219A (en) * | 1978-02-22 | 1979-04-10 | The United States Of America As Represented By The Secretary Of The Navy | Flexible printed circuit board assembly |
JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
DE3119884C1 (de) * | 1981-05-19 | 1982-11-04 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten |
GB2101411B (en) * | 1981-06-04 | 1985-06-05 | Standard Telephones Cables Ltd | Flexi-rigid printed circuit boards |
CH667359A5 (de) * | 1985-03-27 | 1988-09-30 | Ppc Electronic Ag | Verfahren zur herstellung einer starre und flexible partien aufweisenden leiterplatte fuer gedruckte elektrische schaltungen. |
US4715928A (en) * | 1985-09-27 | 1987-12-29 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
-
1987
- 1987-06-30 JP JP62162570A patent/JP2631287B2/ja not_active Expired - Lifetime
-
1988
- 1988-06-23 US US07/210,637 patent/US4872934A/en not_active Expired - Lifetime
- 1988-06-24 GB GB8815124A patent/GB2207288B/en not_active Expired - Lifetime
- 1988-06-30 DE DE3822071A patent/DE3822071C2/de not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5470055U (ja) * | 1977-10-27 | 1979-05-18 | ||
JPS54157275A (en) * | 1978-06-02 | 1979-12-12 | Tokyo Shibaura Electric Co | Method of producing flexible compound printed circuit board |
JPS5696891A (en) * | 1979-11-20 | 1981-08-05 | Kollmorgen Tech Corp | Method of manufacturing laminated circuit board |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0720419A1 (en) * | 1994-12-28 | 1996-07-03 | Asahi Glass Company Ltd. | A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same |
WO2011062146A1 (ja) * | 2009-11-20 | 2011-05-26 | 株式会社村田製作所 | リジッド-フレキシブル多層配線基板の製造方法および集合基板 |
JP5212549B2 (ja) * | 2009-11-20 | 2013-06-19 | 株式会社村田製作所 | リジッド−フレキシブル多層配線基板の製造方法および集合基板 |
US9119335B2 (en) | 2009-11-20 | 2015-08-25 | Murata Manufacturing Co., Ltd. | Method for manufacturing rigid-flexible multilayer wiring board and collective board |
JP2020017634A (ja) * | 2018-07-25 | 2020-01-30 | 日本メクトロン株式会社 | 多層プリント配線板の製造方法、および多層プリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
GB2207288B (en) | 1991-09-11 |
GB2207288A (en) | 1989-01-25 |
DE3822071A1 (de) | 1989-01-12 |
JP2631287B2 (ja) | 1997-07-16 |
US4872934A (en) | 1989-10-10 |
DE3822071C2 (de) | 1997-09-11 |
GB8815124D0 (en) | 1988-08-03 |
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