JPS6474748A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS6474748A JPS6474748A JP23311787A JP23311787A JPS6474748A JP S6474748 A JPS6474748 A JP S6474748A JP 23311787 A JP23311787 A JP 23311787A JP 23311787 A JP23311787 A JP 23311787A JP S6474748 A JPS6474748 A JP S6474748A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- leads
- parts
- film
- moreover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To prevent the intrusion of water content and moreover, to prevent the corrosion of a pad by a method wherein a lead frame is constituted into a structure, wherein the width of a tab is partially made narrow or left and right leads are by-passed and arranged at a place, from where the tab itself is removed, and a roughly rectangular insulator is mounted on a plane including the by-pass lead parts. CONSTITUTION:Both sides of the longer sides of a rectangularly formed tab 1, which is connected to frames 5 through suspension leads 2, are partially recessed and the width of the tab becomes narrower. By-pass parts 3a of leads 3, which are coupled with tie bars 4, are arranged at the recessed parts and the points of the leads 3 come out on the outside of the tab 1. Moreover, such a rectangular insulating film 7 as a capton film is adhered on a plane including the tab 1 and the parts 3a for keeping a state insulated from the leads 3. There by, the film can be formed into the almost same form as a normal form formed of the metallic material of the tab 1. That is, a supporting region for mounting an IC chip is secured. Moreover, the parts 3a are subjected to depressing processing and the intrusion of water content to follow a path of the leads 3, the film 7 and the chip is delayed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23311787A JPS6474748A (en) | 1987-09-16 | 1987-09-16 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23311787A JPS6474748A (en) | 1987-09-16 | 1987-09-16 | Lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6474748A true JPS6474748A (en) | 1989-03-20 |
Family
ID=16950033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23311787A Pending JPS6474748A (en) | 1987-09-16 | 1987-09-16 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6474748A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998000867A1 (en) * | 1996-06-28 | 1998-01-08 | Siemens Aktiengesellschaft | Integrated semiconductor circuit |
-
1987
- 1987-09-16 JP JP23311787A patent/JPS6474748A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998000867A1 (en) * | 1996-06-28 | 1998-01-08 | Siemens Aktiengesellschaft | Integrated semiconductor circuit |
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