JPS6472309A - Manufacture of thin film magnetic head - Google Patents

Abstract

PURPOSE:To prevent the pattern transfer accuracy from being deteriorated due to a swell-up of resist coating by performing an exposure for eliminating a resist swell-up part before an exposure transfer process of a thin film pattern. CONSTITUTION:When a resist 2 is brought to coating on a substrate 1, a swell-up part 2a is formed on the resist 2, in the peripheral edge part of the substrate. Subsequently, by exposing the resist 2 by using a mask 3 having a mask pattern 4 for eliminating this swell-up part 2a and executing a development, the swell-up part is eliminated from the resist 2 on the wafer 1. Next, by executing an exposure by using a mask 5 having a pattern 6 to be formed on the resist 2, and executing a development, a desired pattern 2b is formed on the resist. In such a way, since an exposure process for eliminating the resist swell-up part is contained, the surface of the resist 2 becomes a uniform flat surface and the mask pattern 6 adheres closely to the surface of the resist 2. In such a way, deterioration of the pattern transfer accuracy based on the swell-up of the resist can be prevented.