JPS6469034A - Semiconductor integrated circuit with decoupled d.c. wiring - Google Patents

Semiconductor integrated circuit with decoupled d.c. wiring

Info

Publication number
JPS6469034A
JPS6469034A JP63207478A JP20747888A JPS6469034A JP S6469034 A JPS6469034 A JP S6469034A JP 63207478 A JP63207478 A JP 63207478A JP 20747888 A JP20747888 A JP 20747888A JP S6469034 A JPS6469034 A JP S6469034A
Authority
JP
Japan
Prior art keywords
wiring
region
substrate
hence
insulation layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63207478A
Other languages
English (en)
Inventor
Emiiru Yohan Fuan De Roberuto
Fuan Deru Fueen Maruteiin
Rinsen Andore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS6469034A publication Critical patent/JPS6469034A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222Capacitive arrangements or effects of, or between wiring layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/915Active solid-state devices, e.g. transistors, solid-state diodes with titanium nitride portion or region

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP63207478A 1987-08-26 1988-08-23 Semiconductor integrated circuit with decoupled d.c. wiring Pending JPS6469034A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8701997A NL8701997A (nl) 1987-08-26 1987-08-26 Geintegreerde halfgeleiderschakeling met ontkoppelde dc bedrading.

Publications (1)

Publication Number Publication Date
JPS6469034A true JPS6469034A (en) 1989-03-15

Family

ID=19850502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63207478A Pending JPS6469034A (en) 1987-08-26 1988-08-23 Semiconductor integrated circuit with decoupled d.c. wiring

Country Status (5)

Country Link
US (1) US5008731A (ja)
EP (1) EP0305001A1 (ja)
JP (1) JPS6469034A (ja)
KR (1) KR890004416A (ja)
NL (1) NL8701997A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5136357A (en) * 1989-06-26 1992-08-04 Micron Technology, Inc. Low-noise, area-efficient, high-frequency clock signal distribution line structure
EP0480580A3 (en) * 1990-09-10 1992-09-02 Canon Kabushiki Kaisha Electrode structure of semiconductor device and method for manufacturing the same
JP3390875B2 (ja) * 1992-11-12 2003-03-31 日本テキサス・インスツルメンツ株式会社 半導体装置
JP3906809B2 (ja) * 2002-04-08 2007-04-18 日本電気株式会社 線路素子及び半導体回路

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5457980A (en) * 1977-10-18 1979-05-10 Sony Corp Semiconductor device
JPS61248459A (ja) * 1985-04-25 1986-11-05 Nippon Telegr & Teleph Corp <Ntt> 相補形mis半導体集積回路

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190854A (en) * 1978-02-15 1980-02-26 National Semiconductor Corporation Trim structure for integrated capacitors
DE2926417A1 (de) * 1979-06-29 1981-01-22 Siemens Ag Dynamische halbleiterspeicherzelle und verfahren zu ihrer herstellung
US4656058A (en) * 1980-08-08 1987-04-07 Stark William C Paint shields and painting methods
JPS5780828A (en) * 1980-11-07 1982-05-20 Hitachi Ltd Semiconductor integrated circuit device
EP0072690A3 (en) * 1981-08-17 1983-11-09 Fujitsu Limited A mis device and a method of manufacturing it
JPS6080264A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体装置
JPS60192359A (ja) * 1984-03-14 1985-09-30 Nec Corp 半導体メモリ装置
JPH0669040B2 (ja) * 1985-05-13 1994-08-31 株式会社東芝 光半導体装置
US4737830A (en) * 1986-01-08 1988-04-12 Advanced Micro Devices, Inc. Integrated circuit structure having compensating means for self-inductance effects
JPS62243345A (ja) * 1986-04-15 1987-10-23 Toshiba Corp 半導体集積回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5457980A (en) * 1977-10-18 1979-05-10 Sony Corp Semiconductor device
JPS61248459A (ja) * 1985-04-25 1986-11-05 Nippon Telegr & Teleph Corp <Ntt> 相補形mis半導体集積回路

Also Published As

Publication number Publication date
EP0305001A1 (en) 1989-03-01
NL8701997A (nl) 1989-03-16
US5008731A (en) 1991-04-16
KR890004416A (ko) 1989-04-21

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