JPS6461936A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6461936A
JPS6461936A JP62219831A JP21983187A JPS6461936A JP S6461936 A JPS6461936 A JP S6461936A JP 62219831 A JP62219831 A JP 62219831A JP 21983187 A JP21983187 A JP 21983187A JP S6461936 A JPS6461936 A JP S6461936A
Authority
JP
Japan
Prior art keywords
semiconductor chip
metallic cap
carrier tape
chip
lands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62219831A
Other languages
Japanese (ja)
Inventor
Hideya Yagoura
Haruo Shimamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62219831A priority Critical patent/JPS6461936A/en
Publication of JPS6461936A publication Critical patent/JPS6461936A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To find the abnormality of a semiconductor chip in an early stage, by composing the semiconductor chip so that rear and surface electrodes of its chip are connected through a metallic cap as well as leads for connecting rear potential. CONSTITUTION:The rear of a semiconductor chip 1 which is stuck to a carrier tape 3 through lead wiring 4 by a TAB system is bonded to the inside base of a metallic cap 11 with a binding material 16. In such a case, the metallic cap 11 is located at the prescribed position with respect to the semiconductor chip 1 by inserting solder 12 as protrusions formed at the metallic cap 11 into through holes 13 at the carrier tape 3. And then solder 12 is heated from the sides of lands 14a and 14b and after it is molten and is joined to the lands 14a and 14b, it is sealed with a sealing resin 17. Thus functions can be affirmed when bonded the semiconductor chip to the carrier tape and then the abnormality of its chip is found in an early stage.
JP62219831A 1987-09-02 1987-09-02 Semiconductor device Pending JPS6461936A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62219831A JPS6461936A (en) 1987-09-02 1987-09-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62219831A JPS6461936A (en) 1987-09-02 1987-09-02 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6461936A true JPS6461936A (en) 1989-03-08

Family

ID=16741729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62219831A Pending JPS6461936A (en) 1987-09-02 1987-09-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6461936A (en)

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