JPS6450456A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS6450456A
JPS6450456A JP20745287A JP20745287A JPS6450456A JP S6450456 A JPS6450456 A JP S6450456A JP 20745287 A JP20745287 A JP 20745287A JP 20745287 A JP20745287 A JP 20745287A JP S6450456 A JPS6450456 A JP S6450456A
Authority
JP
Japan
Prior art keywords
piece
land
integrated circuit
semiconductor integrated
extending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20745287A
Other languages
Japanese (ja)
Inventor
Naoki Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20745287A priority Critical patent/JPS6450456A/en
Publication of JPS6450456A publication Critical patent/JPS6450456A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To suppress oxidation and contamination of a thin metal piece, by settling a land for placing a semiconductor integrated circuit element and a lead section extending to an external connection terminal formed on the periphery of the land in a reverse relationship of surface and rear. CONSTITUTION:A hanger 4 for supporting a land 6 for placing a semiconductor integrated circuit element 2 of a thin metal piece 1 formed integrally and leads 7 of the piece 1 extending to an external connection terminal of the periphery are so twisted as to have a surface and rear relationship, the element 2 is connected to the land 6 with a reversed relationship of front and rear, and metal wiring electrode pads of the element are electrically connected by fine metal wirings 3 to the leads 7 of the piece 1 extending to the terminal. Thus, it can suppress the oxidation, contamination, etc., of the surface of the piece due to working atmosphere and thermal hysteresis in assembling processes.
JP20745287A 1987-08-20 1987-08-20 Semiconductor integrated circuit device Pending JPS6450456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20745287A JPS6450456A (en) 1987-08-20 1987-08-20 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20745287A JPS6450456A (en) 1987-08-20 1987-08-20 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6450456A true JPS6450456A (en) 1989-02-27

Family

ID=16540005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20745287A Pending JPS6450456A (en) 1987-08-20 1987-08-20 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6450456A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513651A (en) * 1991-07-04 1993-01-22 Matsushita Electron Corp Lead frame for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513651A (en) * 1991-07-04 1993-01-22 Matsushita Electron Corp Lead frame for semiconductor device

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