JPS6434133A - Input protective circuit - Google Patents

Input protective circuit

Info

Publication number
JPS6434133A
JPS6434133A JP18936387A JP18936387A JPS6434133A JP S6434133 A JPS6434133 A JP S6434133A JP 18936387 A JP18936387 A JP 18936387A JP 18936387 A JP18936387 A JP 18936387A JP S6434133 A JPS6434133 A JP S6434133A
Authority
JP
Japan
Prior art keywords
resistor
semiconductor element
protective circuit
package
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18936387A
Other languages
Japanese (ja)
Inventor
Naoki Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18936387A priority Critical patent/JPS6434133A/en
Publication of JPS6434133A publication Critical patent/JPS6434133A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Emergency Protection Circuit Devices (AREA)

Abstract

PURPOSE:To enhance the surge breakdown resistance of a semiconductor element even if an external resistor is not used by connecting a lead frame to a chip by a semiconductor element sealed in a package through a resistor. CONSTITUTION:When a semiconductor element sealed in a package 12 is formed, a chip 10 is electrically connected to a lead frame 9 through a resistor. This resistor may be formed of a bonding wiring 11 itself, or another resistor may be interposed between the wire 11 and the frame 9. Thus, even if an external resistor is not provided at the input terminal of the element, the surge breakdown resistance of the element can be enhanced. Further, the mounting efficiency of a printed wiring board can be raised.
JP18936387A 1987-07-28 1987-07-28 Input protective circuit Pending JPS6434133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18936387A JPS6434133A (en) 1987-07-28 1987-07-28 Input protective circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18936387A JPS6434133A (en) 1987-07-28 1987-07-28 Input protective circuit

Publications (1)

Publication Number Publication Date
JPS6434133A true JPS6434133A (en) 1989-02-03

Family

ID=16240068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18936387A Pending JPS6434133A (en) 1987-07-28 1987-07-28 Input protective circuit

Country Status (1)

Country Link
JP (1) JPS6434133A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031710A (en) * 2001-07-12 2003-01-31 Mitsumi Electric Co Ltd Monolithic ic package
JPWO2006059381A1 (en) * 2004-12-01 2008-08-07 株式会社ルネサステクノロジ Semiconductor device and manufacturing method of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031710A (en) * 2001-07-12 2003-01-31 Mitsumi Electric Co Ltd Monolithic ic package
JPWO2006059381A1 (en) * 2004-12-01 2008-08-07 株式会社ルネサステクノロジ Semiconductor device and manufacturing method of semiconductor device
JP4574624B2 (en) * 2004-12-01 2010-11-04 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method of semiconductor device

Similar Documents

Publication Publication Date Title
US4249196A (en) Integrated circuit module with integral capacitor
MY113991A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto.
KR970013236A (en) Chip Scale Package with Metal Circuit Board
TW329034B (en) IC package
MY109101A (en) Thin type semiconductor device, module structure using the device and method of mounting the device on board
TW358230B (en) Semiconductor package
DE3785835D1 (en) CHIP FUSE.
JPS641269A (en) Semiconductor device
MY109587A (en) Semiconductor device
ES8503196A1 (en) Integrated circuit module and method of making same.
CA2139330A1 (en) Electrical devices
JPS5779652A (en) Resin-sealed semiconductor device
JPS61198769A (en) Hybrid integrated circuit
JPS55111151A (en) Integrated circuit device
EP0258444A4 (en) Semiconductor device.
EP0221496A3 (en) Integrated circuit package
JPS6434133A (en) Input protective circuit
JPS5721847A (en) Semiconductor device
JPS57164548A (en) Semiconductor device
CA2017080A1 (en) Semiconductor device package structure
JPS57104235A (en) Semiconductor device
JPS6453568A (en) Semiconductor package
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
MY106858A (en) Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin.
JPS6482662A (en) Input protective circuit of semiconductor