JPS644531B2 - - Google Patents

Info

Publication number: JPS644531B2
Authority: JP; Japan
Prior art keywords: solvent; resin composition; free; laminate; epoxy resin
Prior art date: 1981-04-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP6230181A

Other languages

English (en)

Japanese (ja)

Other versions

JPS57177026A (en

Inventor

Atsushi Fujioka

Yasuo Myadera

Tomio Fukuda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Corp

Original Assignee

Hitachi Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-04-23

Filing date

1981-04-23

Publication date

1989-01-26

1981-04-23 Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd

1981-04-23 Priority to JP6230181A priority Critical patent/JPS57177026A/ja

1982-10-30 Publication of JPS57177026A publication Critical patent/JPS57177026A/ja

1989-01-26 Publication of JPS644531B2 publication Critical patent/JPS644531B2/ja

Status Granted legal-status Critical Current

Links

239000011342 resin composition Substances 0.000 claims description 19
239000003822 epoxy resin Substances 0.000 claims description 16
229920000647 polyepoxide Polymers 0.000 claims description 16
239000000463 material Substances 0.000 claims description 13
238000004519 manufacturing process Methods 0.000 claims description 11
239000003795 chemical substances by application Substances 0.000 claims description 10
238000010438 heat treatment Methods 0.000 claims description 9
150000001412 amines Chemical class 0.000 claims description 7
238000002156 mixing Methods 0.000 claims description 7
239000007788 liquid Substances 0.000 claims description 6
DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical group C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 claims description 3
125000003700 epoxy group Chemical group 0.000 claims description 3
238000000465 moulding Methods 0.000 claims description 3
239000002904 solvent Substances 0.000 description 17
238000000034 method Methods 0.000 description 14
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
239000004744 fabric Substances 0.000 description 6
239000011521 glass Substances 0.000 description 6
238000003825 pressing Methods 0.000 description 6
239000002966 varnish Substances 0.000 description 6
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
229920003319 Araldite® Polymers 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
238000007796 conventional method Methods 0.000 description 4
QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
229920005989 resin Polymers 0.000 description 4
239000011347 resin Substances 0.000 description 4
239000000758 substrate Substances 0.000 description 4
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
239000004593 Epoxy Substances 0.000 description 3
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
239000011889 copper foil Substances 0.000 description 3
239000011888 foil Substances 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000002184 metal Substances 0.000 description 3
229920003986 novolac Polymers 0.000 description 3
238000003756 stirring Methods 0.000 description 3
PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
238000001035 drying Methods 0.000 description 2
SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 2
238000005470 impregnation Methods 0.000 description 2
GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
-1 1,2-epoxyethyl Chemical group 0.000 description 1
XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
NZHNJOJQMPJLFA-UHFFFAOYSA-N 2-[3,5-bis(oxiran-2-yl)phenyl]oxirane Chemical compound C1OC1C1=CC(C2OC2)=CC(C2OC2)=C1 NZHNJOJQMPJLFA-UHFFFAOYSA-N 0.000 description 1
OWEBGWBRTKTKHR-UHFFFAOYSA-N 2-[4-[4-(oxiran-2-yl)phenyl]phenyl]oxirane Chemical group C1OC1C1=CC=C(C=2C=CC(=CC=2)C2OC2)C=C1 OWEBGWBRTKTKHR-UHFFFAOYSA-N 0.000 description 1
RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 1
IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 1
ZFIVKAOQEXOYFY-UHFFFAOYSA-N Diepoxybutane Chemical compound C1OC1C1OC1 ZFIVKAOQEXOYFY-UHFFFAOYSA-N 0.000 description 1
ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
230000002411 adverse Effects 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
KVRAGBDTQYNMNO-UHFFFAOYSA-N bis[2,4-bis(oxiran-2-ylmethoxy)phenyl]methanone Chemical compound C=1C=C(OCC2OC2)C=C(OCC2OC2)C=1C(=O)C(C(=C1)OCC2OC2)=CC=C1OCC1CO1 KVRAGBDTQYNMNO-UHFFFAOYSA-N 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000004880 explosion Methods 0.000 description 1
239000000945 filler Substances 0.000 description 1
235000011187 glycerol Nutrition 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
238000009775 high-speed stirring Methods 0.000 description 1
WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
229940091173 hydantoin Drugs 0.000 description 1
239000012948 isocyanate Substances 0.000 description 1
150000002513 isocyanates Chemical class 0.000 description 1
239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
239000003607 modifier Substances 0.000 description 1
239000004745 nonwoven fabric Substances 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
239000000049 pigment Substances 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
125000006850 spacer group Chemical group 0.000 description 1
239000000126 substance Substances 0.000 description 1

Landscapes

Epoxy Resins (AREA)
Reinforced Plastic Materials (AREA)
Laminated Bodies (AREA)

JP6230181A 1981-04-23 1981-04-23 Manufacture of solvent-free laminated board Granted JPS57177026A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP6230181A JPS57177026A (en)	1981-04-23	1981-04-23	Manufacture of solvent-free laminated board

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP6230181A JPS57177026A (en)	1981-04-23	1981-04-23	Manufacture of solvent-free laminated board

Publications (2)

Publication Number	Publication Date
JPS57177026A JPS57177026A (en)	1982-10-30
JPS644531B2 true JPS644531B2 (de)	1989-01-26

Family

ID=13196162

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP6230181A Granted JPS57177026A (en)	1981-04-23	1981-04-23	Manufacture of solvent-free laminated board

Country Status (1)

Country	Link
JP (1)	JPS57177026A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4963300A (en) *	1987-12-15	1990-10-16	Ciba-Geigy Corporation	Process for the preparation of laminates

1981
- 1981-04-23 JP JP6230181A patent/JPS57177026A/ja active Granted

Also Published As

Publication number	Publication date
JPS57177026A (en)	1982-10-30

Publication	Publication Date	Title
US5492722A (en)	1996-02-20	Process and apparatus for resin impregnation of a fibrous substrate
US3523037A (en)	1970-08-04	Epoxy resin composition containing brominated polyglycidyl ether of bisphenol a and a polyglycidyl ether of tetrakis(hydroxyphenyl) ethane
US4749614A (en)	1988-06-07	Process for coating fibers, use thereof, and product
JP2001031838A (ja)	2001-02-06	自己接着性表面材用エポキシ樹脂組成物及びプリプレグ
US5976699A (en)	1999-11-02	Insulating adhesive for multilayer printed circuit board
JPH11100562A (ja)	1999-04-13	多層プリント配線板用層間絶縁接着剤及び銅箔
JPS644531B2 (de)	1989-01-26
JPH10507481A (ja)	1998-07-21	硼酸及びその同族体により促進された硬化性エポキシ樹脂
JPS63267524A (ja)	1988-11-04	金属張積層板の製造方法及びその装置
JPH1135916A (ja)	1999-02-09	多層プリント配線板用層間絶縁接着剤
JP3363388B2 (ja)	2003-01-08	エポキシ樹脂組成物及びプリプレグ及び金属箔張り積層板
US5393591A (en)	1995-02-28	Process for producing copper-clad base materials
JPH0369372B2 (de)	1991-10-31
JPS643224B2 (de)	1989-01-20
JPH1177892A (ja)	1999-03-23	銅張積層板の製造方法
JPH09316219A (ja)	1997-12-09	プリプレグおよびその製造方法と積層板
JPH0226579B2 (de)	1990-06-11
JPH0226580B2 (de)	1990-06-11
JPH0416337A (ja)	1992-01-21	エポキシ樹脂発泡性シート、発泡硬化体および複合材
JPS6124176B2 (de)	1986-06-10
CN115960442A (zh)	2023-04-14	固化片及其制备方法与应用、封装载带
JPH0381383A (ja)	1991-04-05	フィルム接着剤
JPS6178843A (ja)	1986-04-22	エポキシ樹脂積層板の製法
JPS58104734A (ja)	1983-06-22	熱硬化性樹脂板状体の製造法
JP2024009133A (ja)	2024-01-19	Ｆｒｐ前駆体の製造方法、ｆｒｐ前駆体、積層板、多層プリント配線板及び半導体パッケージ