JPS57177026A - Manufacture of solvent-free laminated board - Google Patents

Manufacture of solvent-free laminated board

Info

Publication number
JPS57177026A
JPS57177026A JP6230181A JP6230181A JPS57177026A JP S57177026 A JPS57177026 A JP S57177026A JP 6230181 A JP6230181 A JP 6230181A JP 6230181 A JP6230181 A JP 6230181A JP S57177026 A JPS57177026 A JP S57177026A
Authority
JP
Japan
Prior art keywords
epoxy resin
solvent
amine
epoxy
laminated board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6230181A
Other languages
Japanese (ja)
Other versions
JPS644531B2 (en
Inventor
Atsushi Fujioka
Yasuo Miyadera
Tomio Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP6230181A priority Critical patent/JPS57177026A/en
Publication of JPS57177026A publication Critical patent/JPS57177026A/en
Publication of JPS644531B2 publication Critical patent/JPS644531B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To provide the titled laminated board in a short molding time, by impregnating a substrate with a solvent-free resin composition obtained by uniformly mixing a specific epoxy resin in a liquid phase with a cycloaliphatic amine as a curing agent, and hot-pressing the impregnated product.
CONSTITUTION: An epoxy resin having ≥2 epoxy groups per one molecule on an average (e.g. bisphenol-A diglycidyl ether epoxy resin) is mixed with a cycloaliphatic amine (e.g. 4,4'-diaminodicyclohexylmethane), and stirred uniformly under heating until each component becomes liquid. The amount of the amine is preferably 1.0 amine equivalent per 1 epoxy equivalent of the epoxy resin. The solvent-free resin composition thus obtained is applied to a substrate. A necessary number of the substrates are stacked together, and hot-pressed preferably with an edged mold for 5W10min.
COPYRIGHT: (C)1982,JPO&Japio
JP6230181A 1981-04-23 1981-04-23 Manufacture of solvent-free laminated board Granted JPS57177026A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6230181A JPS57177026A (en) 1981-04-23 1981-04-23 Manufacture of solvent-free laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6230181A JPS57177026A (en) 1981-04-23 1981-04-23 Manufacture of solvent-free laminated board

Publications (2)

Publication Number Publication Date
JPS57177026A true JPS57177026A (en) 1982-10-30
JPS644531B2 JPS644531B2 (en) 1989-01-26

Family

ID=13196162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6230181A Granted JPS57177026A (en) 1981-04-23 1981-04-23 Manufacture of solvent-free laminated board

Country Status (1)

Country Link
JP (1) JPS57177026A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01201339A (en) * 1987-12-15 1989-08-14 Ciba Geigy Ag Production of laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01201339A (en) * 1987-12-15 1989-08-14 Ciba Geigy Ag Production of laminate

Also Published As

Publication number Publication date
JPS644531B2 (en) 1989-01-26

Similar Documents

Publication Publication Date Title
US3723223A (en) Heat curing adhesive
US4878978A (en) Bonding method employing high performance induction curable two-component structural adhesive with nonsagging behavior
ES553544A0 (en) PROCEDURE TO ADHERE TWO METALLIC SURFACES OF GLASS REINFORCED SYNTHETIC MATERIAL, FRICTIONAL MATERIAL OR CERAMIC.
MX9606181A (en) Curable compositions.
YU137485A (en) Process for obtaining chemically curing resin from compounds containing 1-oxa-3-aza tetraline group and cycloaliphatic epoxy resin
GB1419564A (en) Silicone-epoxy copolymers and moulding powders obtained therefrom
JPS57177026A (en) Manufacture of solvent-free laminated board
JPS57131219A (en) Thermosetting resin composition
JPS5723620A (en) Thermosetting resin composition
JPS56157425A (en) Curable resin composition
MY130053A (en) Curing agents for aqueous epoxy resins
GB1349709A (en) Hardening epoxy resins
JPS57187325A (en) Production of epoxy resin laminated sheet
DE3474556D1 (en) Process for producing a coating comprising a mixture of an epoxy resin and a curing agent
US3491059A (en) Heat curable epoxy compositions with curing agent 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane
JPS57174314A (en) Epoxy resin composition
JPS5545710A (en) Thermosetting resin composition
MY104012A (en) Thermosetting resin composition.
JPS5783535A (en) Preparation of laminate
JPS57167370A (en) Adhesive composition
JPS573821A (en) Epoxy resin composition
ES8609419A1 (en) Advanced epoxy resins having improved impact resistance when cured and coating compositions prepared therefrom
JPS5513754A (en) Curing agent for epoxy resin
JPS56127630A (en) Curable resin composition
JPS5725322A (en) Epoxy resin composition