JPS6444918A - Production of liquid crystal display device - Google Patents

Production of liquid crystal display device

Info

Publication number
JPS6444918A
JPS6444918A JP20272087A JP20272087A JPS6444918A JP S6444918 A JPS6444918 A JP S6444918A JP 20272087 A JP20272087 A JP 20272087A JP 20272087 A JP20272087 A JP 20272087A JP S6444918 A JPS6444918 A JP S6444918A
Authority
JP
Japan
Prior art keywords
semiconductor element
liquid crystal
production
substrate
wiring patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20272087A
Other languages
Japanese (ja)
Inventor
Shinichi Nishi
Kazuo Arai
Shigeo Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to JP20272087A priority Critical patent/JPS6444918A/en
Publication of JPS6444918A publication Critical patent/JPS6444918A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent the breaking of a semiconductor element during the process of production by die-bonding the semiconductor element onto a substrate having wiring patterns after injection of a liquid crystal and connecting the same by wire bonding. CONSTITUTION:The liquid crystal 21 is injected between at least two sheets of the substrates 3 and 11 and thereafter, the semiconductor element 8 is die- bonded onto at least a sheet of the substrate 3 of the substrates 3, 11 having the wiring patterns 5 under local heating. The semiconductor element 8 and the wiring patterns 5 of the substrate 3 are then connected by the wire bonding. Since the semiconductor element 8 is packaged on the substrate 3 in the final stage of the production process in such a manner, the possibility of the breaking of the semiconductor element 8 during the process of the production is eliminated and since the semiconductor element 8 is packaged by the local heating, no adverse influences are exerted to the liquid crystal 12.
JP20272087A 1987-08-13 1987-08-13 Production of liquid crystal display device Pending JPS6444918A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20272087A JPS6444918A (en) 1987-08-13 1987-08-13 Production of liquid crystal display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20272087A JPS6444918A (en) 1987-08-13 1987-08-13 Production of liquid crystal display device

Publications (1)

Publication Number Publication Date
JPS6444918A true JPS6444918A (en) 1989-02-17

Family

ID=16462044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20272087A Pending JPS6444918A (en) 1987-08-13 1987-08-13 Production of liquid crystal display device

Country Status (1)

Country Link
JP (1) JPS6444918A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05210105A (en) * 1992-01-20 1993-08-20 Nec Corp Active matrix substrate and production of liquid crystal display device by using the same
US6876422B2 (en) * 2000-12-22 2005-04-05 Fujitsu Display Technologies Corporation Liquid-crystal display unit having a third board having at least one of a signal-line drive circuit and a scanning-line drive circuit
CN100426479C (en) * 2003-11-07 2008-10-15 日本Cmo株式会社 Bonding method and apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05210105A (en) * 1992-01-20 1993-08-20 Nec Corp Active matrix substrate and production of liquid crystal display device by using the same
US6876422B2 (en) * 2000-12-22 2005-04-05 Fujitsu Display Technologies Corporation Liquid-crystal display unit having a third board having at least one of a signal-line drive circuit and a scanning-line drive circuit
CN100426479C (en) * 2003-11-07 2008-10-15 日本Cmo株式会社 Bonding method and apparatus

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