JPS6434650A - Surface grinding method - Google Patents
Surface grinding methodInfo
- Publication number
- JPS6434650A JPS6434650A JP18757887A JP18757887A JPS6434650A JP S6434650 A JPS6434650 A JP S6434650A JP 18757887 A JP18757887 A JP 18757887A JP 18757887 A JP18757887 A JP 18757887A JP S6434650 A JPS6434650 A JP S6434650A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- grindstone
- workpiece
- elastic deformation
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
PURPOSE:To make it possible to finish a workpiece to more accurate flatness by moving a grindstone from a position before the starting point of its grinding action to the position before a spot where a finishing dimension is attained, and then to the position of the finishing dimension after once raising the grindstone to release its elastic deformation due to grinding resistance. CONSTITUTION:When a grinding surface of a grindstone comes into contact with a workpiece to begin its cross feeding at a position A before a grinding position, grinding resistance grows abruptly larger to attain its saturated state soon, and when the grindstone is returned to a position C where it leaves the workpiece at the time of its attaining a position B, the grinding resistance becomes nothing to release the grindstone and the workpiece from their elastic deformation. When, in this state, the grindstone is again moved at grinding feed speed from the position C to a position D where the finishing dimension is attained, it begins grinding action at the peripheral edge of the workpiece formed by previous grinding into a recessed shape, end an increase in the grinding resistance thereby becomes slower than that at the first cross feeding, and a short space between the positions B and D makes the grindstone attain the position D before the grinding resistance is saturated. Thus since a grinding process can be finished while the grindstone and the workpiece keep their elastic deformation small, a ground surface can be improved in its flatness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18757887A JPS6434650A (en) | 1987-07-29 | 1987-07-29 | Surface grinding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18757887A JPS6434650A (en) | 1987-07-29 | 1987-07-29 | Surface grinding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6434650A true JPS6434650A (en) | 1989-02-06 |
Family
ID=16208555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18757887A Pending JPS6434650A (en) | 1987-07-29 | 1987-07-29 | Surface grinding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6434650A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002066915A (en) * | 2000-08-29 | 2002-03-05 | Nagase Integrex Co Ltd | Grinding method |
JP2004042174A (en) * | 2002-07-10 | 2004-02-12 | Daisho Seiki Kk | Surface grinding process |
JP2007203432A (en) * | 2006-02-06 | 2007-08-16 | Disco Abrasive Syst Ltd | Grinding device and method for substrate |
JP2010012565A (en) * | 2008-07-04 | 2010-01-21 | Disco Abrasive Syst Ltd | Method of grinding wafer |
-
1987
- 1987-07-29 JP JP18757887A patent/JPS6434650A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002066915A (en) * | 2000-08-29 | 2002-03-05 | Nagase Integrex Co Ltd | Grinding method |
JP2004042174A (en) * | 2002-07-10 | 2004-02-12 | Daisho Seiki Kk | Surface grinding process |
JP2007203432A (en) * | 2006-02-06 | 2007-08-16 | Disco Abrasive Syst Ltd | Grinding device and method for substrate |
JP2010012565A (en) * | 2008-07-04 | 2010-01-21 | Disco Abrasive Syst Ltd | Method of grinding wafer |
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