JPS6434650A - Surface grinding method - Google Patents

Surface grinding method

Info

Publication number
JPS6434650A
JPS6434650A JP18757887A JP18757887A JPS6434650A JP S6434650 A JPS6434650 A JP S6434650A JP 18757887 A JP18757887 A JP 18757887A JP 18757887 A JP18757887 A JP 18757887A JP S6434650 A JPS6434650 A JP S6434650A
Authority
JP
Japan
Prior art keywords
grinding
grindstone
workpiece
elastic deformation
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18757887A
Other languages
Japanese (ja)
Inventor
Satoshi Matsui
Takeshi Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seiko Ltd filed Critical Hitachi Seiko Ltd
Priority to JP18757887A priority Critical patent/JPS6434650A/en
Publication of JPS6434650A publication Critical patent/JPS6434650A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

PURPOSE:To make it possible to finish a workpiece to more accurate flatness by moving a grindstone from a position before the starting point of its grinding action to the position before a spot where a finishing dimension is attained, and then to the position of the finishing dimension after once raising the grindstone to release its elastic deformation due to grinding resistance. CONSTITUTION:When a grinding surface of a grindstone comes into contact with a workpiece to begin its cross feeding at a position A before a grinding position, grinding resistance grows abruptly larger to attain its saturated state soon, and when the grindstone is returned to a position C where it leaves the workpiece at the time of its attaining a position B, the grinding resistance becomes nothing to release the grindstone and the workpiece from their elastic deformation. When, in this state, the grindstone is again moved at grinding feed speed from the position C to a position D where the finishing dimension is attained, it begins grinding action at the peripheral edge of the workpiece formed by previous grinding into a recessed shape, end an increase in the grinding resistance thereby becomes slower than that at the first cross feeding, and a short space between the positions B and D makes the grindstone attain the position D before the grinding resistance is saturated. Thus since a grinding process can be finished while the grindstone and the workpiece keep their elastic deformation small, a ground surface can be improved in its flatness.
JP18757887A 1987-07-29 1987-07-29 Surface grinding method Pending JPS6434650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18757887A JPS6434650A (en) 1987-07-29 1987-07-29 Surface grinding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18757887A JPS6434650A (en) 1987-07-29 1987-07-29 Surface grinding method

Publications (1)

Publication Number Publication Date
JPS6434650A true JPS6434650A (en) 1989-02-06

Family

ID=16208555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18757887A Pending JPS6434650A (en) 1987-07-29 1987-07-29 Surface grinding method

Country Status (1)

Country Link
JP (1) JPS6434650A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002066915A (en) * 2000-08-29 2002-03-05 Nagase Integrex Co Ltd Grinding method
JP2004042174A (en) * 2002-07-10 2004-02-12 Daisho Seiki Kk Surface grinding process
JP2007203432A (en) * 2006-02-06 2007-08-16 Disco Abrasive Syst Ltd Grinding device and method for substrate
JP2010012565A (en) * 2008-07-04 2010-01-21 Disco Abrasive Syst Ltd Method of grinding wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002066915A (en) * 2000-08-29 2002-03-05 Nagase Integrex Co Ltd Grinding method
JP2004042174A (en) * 2002-07-10 2004-02-12 Daisho Seiki Kk Surface grinding process
JP2007203432A (en) * 2006-02-06 2007-08-16 Disco Abrasive Syst Ltd Grinding device and method for substrate
JP2010012565A (en) * 2008-07-04 2010-01-21 Disco Abrasive Syst Ltd Method of grinding wafer

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