JPS6430294A - Electronic circuit component - Google Patents
Electronic circuit componentInfo
- Publication number
- JPS6430294A JPS6430294A JP18704387A JP18704387A JPS6430294A JP S6430294 A JPS6430294 A JP S6430294A JP 18704387 A JP18704387 A JP 18704387A JP 18704387 A JP18704387 A JP 18704387A JP S6430294 A JPS6430294 A JP S6430294A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating film
- thickness
- electronic circuit
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To obtain an electronic circuit component in which the excellent adhesiveness between an interlayer insulating film made of polymer material and a conductor layer for an electric wiring and, further, the excellent insulation reliability of the insulating film are provided by a method wherein a metal layer made of at least one of molybdenum and titanium and with a specific thickness is formed on the interlayer insulating film as the foundation layer of the conductor layer. CONSTITUTION:A metal layer made of at least one of molybdenum and titanium and with a thickness of 0.03-0.5mum is formed on an interlayer insulating film made of polymer material as the foundation of a conductor layer for an electric wiring in an electronic circuit component. If the thickness of the metal layer is less than 0.03mum, mutual diffusion between the metal layer and the conductor layer made of copper is induced by heat and there is a possibility of creating adhesion defect. On the other hand, if the thickness of the metal film is above 0.50mum, a residual stress exceeds 2.5X10<5>dyne/cm and crackings are developed in the insulating layer. A lower layer conductor 2 is formed on the upper surface of an insulating substrate 1 by a conventional vapor growth method and polymer material such as polytetrafluoroethylene is applied to it by spin-coating and subjected to a heat treatment to form an insulating film 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187043A JP2565351B2 (en) | 1987-07-27 | 1987-07-27 | Electronic circuit parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187043A JP2565351B2 (en) | 1987-07-27 | 1987-07-27 | Electronic circuit parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6430294A true JPS6430294A (en) | 1989-02-01 |
JP2565351B2 JP2565351B2 (en) | 1996-12-18 |
Family
ID=16199174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62187043A Expired - Fee Related JP2565351B2 (en) | 1987-07-27 | 1987-07-27 | Electronic circuit parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2565351B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6060664A (en) * | 1997-06-30 | 2000-05-09 | Kyocera Corporation | Electronic circuit component |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS494992A (en) * | 1972-04-26 | 1974-01-17 | ||
JPS5466458A (en) * | 1977-11-04 | 1979-05-29 | Cho Lsi Gijutsu Kenkyu Kumiai | Multilayer circuit substrate |
JPS55158697A (en) * | 1979-05-30 | 1980-12-10 | Nippon Electric Co | Multilayer wiring substrate |
JPS59178749A (en) * | 1983-03-30 | 1984-10-11 | Fujitsu Ltd | Wiring structure |
JPS59202681A (en) * | 1983-05-04 | 1984-11-16 | 松下電工株式会社 | Method of producing printed circuit board |
-
1987
- 1987-07-27 JP JP62187043A patent/JP2565351B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS494992A (en) * | 1972-04-26 | 1974-01-17 | ||
JPS5466458A (en) * | 1977-11-04 | 1979-05-29 | Cho Lsi Gijutsu Kenkyu Kumiai | Multilayer circuit substrate |
JPS55158697A (en) * | 1979-05-30 | 1980-12-10 | Nippon Electric Co | Multilayer wiring substrate |
JPS59178749A (en) * | 1983-03-30 | 1984-10-11 | Fujitsu Ltd | Wiring structure |
JPS59202681A (en) * | 1983-05-04 | 1984-11-16 | 松下電工株式会社 | Method of producing printed circuit board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6060664A (en) * | 1997-06-30 | 2000-05-09 | Kyocera Corporation | Electronic circuit component |
Also Published As
Publication number | Publication date |
---|---|
JP2565351B2 (en) | 1996-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |