JPS6430294A - Electronic circuit component - Google Patents

Electronic circuit component

Info

Publication number
JPS6430294A
JPS6430294A JP18704387A JP18704387A JPS6430294A JP S6430294 A JPS6430294 A JP S6430294A JP 18704387 A JP18704387 A JP 18704387A JP 18704387 A JP18704387 A JP 18704387A JP S6430294 A JPS6430294 A JP S6430294A
Authority
JP
Japan
Prior art keywords
layer
insulating film
thickness
electronic circuit
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18704387A
Other languages
Japanese (ja)
Other versions
JP2565351B2 (en
Inventor
Shigeo Tanahashi
Yasutoshi Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP62187043A priority Critical patent/JP2565351B2/en
Publication of JPS6430294A publication Critical patent/JPS6430294A/en
Application granted granted Critical
Publication of JP2565351B2 publication Critical patent/JP2565351B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To obtain an electronic circuit component in which the excellent adhesiveness between an interlayer insulating film made of polymer material and a conductor layer for an electric wiring and, further, the excellent insulation reliability of the insulating film are provided by a method wherein a metal layer made of at least one of molybdenum and titanium and with a specific thickness is formed on the interlayer insulating film as the foundation layer of the conductor layer. CONSTITUTION:A metal layer made of at least one of molybdenum and titanium and with a thickness of 0.03-0.5mum is formed on an interlayer insulating film made of polymer material as the foundation of a conductor layer for an electric wiring in an electronic circuit component. If the thickness of the metal layer is less than 0.03mum, mutual diffusion between the metal layer and the conductor layer made of copper is induced by heat and there is a possibility of creating adhesion defect. On the other hand, if the thickness of the metal film is above 0.50mum, a residual stress exceeds 2.5X10<5>dyne/cm and crackings are developed in the insulating layer. A lower layer conductor 2 is formed on the upper surface of an insulating substrate 1 by a conventional vapor growth method and polymer material such as polytetrafluoroethylene is applied to it by spin-coating and subjected to a heat treatment to form an insulating film 3.
JP62187043A 1987-07-27 1987-07-27 Electronic circuit parts Expired - Fee Related JP2565351B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62187043A JP2565351B2 (en) 1987-07-27 1987-07-27 Electronic circuit parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62187043A JP2565351B2 (en) 1987-07-27 1987-07-27 Electronic circuit parts

Publications (2)

Publication Number Publication Date
JPS6430294A true JPS6430294A (en) 1989-02-01
JP2565351B2 JP2565351B2 (en) 1996-12-18

Family

ID=16199174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62187043A Expired - Fee Related JP2565351B2 (en) 1987-07-27 1987-07-27 Electronic circuit parts

Country Status (1)

Country Link
JP (1) JP2565351B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060664A (en) * 1997-06-30 2000-05-09 Kyocera Corporation Electronic circuit component

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494992A (en) * 1972-04-26 1974-01-17
JPS5466458A (en) * 1977-11-04 1979-05-29 Cho Lsi Gijutsu Kenkyu Kumiai Multilayer circuit substrate
JPS55158697A (en) * 1979-05-30 1980-12-10 Nippon Electric Co Multilayer wiring substrate
JPS59178749A (en) * 1983-03-30 1984-10-11 Fujitsu Ltd Wiring structure
JPS59202681A (en) * 1983-05-04 1984-11-16 松下電工株式会社 Method of producing printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494992A (en) * 1972-04-26 1974-01-17
JPS5466458A (en) * 1977-11-04 1979-05-29 Cho Lsi Gijutsu Kenkyu Kumiai Multilayer circuit substrate
JPS55158697A (en) * 1979-05-30 1980-12-10 Nippon Electric Co Multilayer wiring substrate
JPS59178749A (en) * 1983-03-30 1984-10-11 Fujitsu Ltd Wiring structure
JPS59202681A (en) * 1983-05-04 1984-11-16 松下電工株式会社 Method of producing printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060664A (en) * 1997-06-30 2000-05-09 Kyocera Corporation Electronic circuit component

Also Published As

Publication number Publication date
JP2565351B2 (en) 1996-12-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees