JPS6429007A - Lead wire connecting method for ultrasonic delay line - Google Patents
Lead wire connecting method for ultrasonic delay lineInfo
- Publication number
- JPS6429007A JPS6429007A JP18422887A JP18422887A JPS6429007A JP S6429007 A JPS6429007 A JP S6429007A JP 18422887 A JP18422887 A JP 18422887A JP 18422887 A JP18422887 A JP 18422887A JP S6429007 A JPS6429007 A JP S6429007A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electrode
- coating material
- conductive adhesive
- delay line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 7
- 239000011248 coating agent Substances 0.000 abstract 6
- 238000000576 coating method Methods 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 6
- 239000000853 adhesive Substances 0.000 abstract 5
- 230000001070 adhesive effect Effects 0.000 abstract 5
- 239000003960 organic solvent Substances 0.000 abstract 3
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
PURPOSE:To surely connect a lead wire through simple constitution by connecting the lead wire by using conductive adhesive, after applying soluble coating material upon an electrode part, and dissolving the soluble coating material in a organic solvent after the hardening of the adhesive. CONSTITUTION:When the lead wire 31 is connected to the plus side electrode 15 of an ultrasonic delay line, at first, the soluble coating material B is applied to the part of the electrode 15, except the upper surface of it. Next, after the coating material B hardens, the lead wire 31 is replaced on the electrode 15 so that its tip part comes into contact with the electrode 15, and the lead wire 31 is connected and fixed to the electrode 15 by using the conductive adhesive 1A. Then, after the conductive adhesive 1A hardens, a signal input end surface 2 is immersed in a basin 50, in which the organic solvent C with a function to dissolve the coating material B is contained. Consecutively, after the coating material is dissolved, the signal input end surface 2 is drawn up from the organic solvent C, and the whole of the signal input end surface 2 is dried. Thus, the lead wire 31 can be connected and fixed through the simple constitution by applying the conductive adhesive 1A upon only the electrode 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18422887A JPS6429007A (en) | 1987-07-23 | 1987-07-23 | Lead wire connecting method for ultrasonic delay line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18422887A JPS6429007A (en) | 1987-07-23 | 1987-07-23 | Lead wire connecting method for ultrasonic delay line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6429007A true JPS6429007A (en) | 1989-01-31 |
Family
ID=16149616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18422887A Pending JPS6429007A (en) | 1987-07-23 | 1987-07-23 | Lead wire connecting method for ultrasonic delay line |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6429007A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7786530B2 (en) | 2002-07-15 | 2010-08-31 | Infineon Technologies Ag | Vertical field-effect transistor |
-
1987
- 1987-07-23 JP JP18422887A patent/JPS6429007A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7786530B2 (en) | 2002-07-15 | 2010-08-31 | Infineon Technologies Ag | Vertical field-effect transistor |
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