JPS5240973A - Method of connecting semiconductor devices - Google Patents

Method of connecting semiconductor devices

Info

Publication number
JPS5240973A
JPS5240973A JP11661375A JP11661375A JPS5240973A JP S5240973 A JPS5240973 A JP S5240973A JP 11661375 A JP11661375 A JP 11661375A JP 11661375 A JP11661375 A JP 11661375A JP S5240973 A JPS5240973 A JP S5240973A
Authority
JP
Japan
Prior art keywords
semiconductor devices
connecting semiconductor
wirings
extruded
proximity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11661375A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11661375A priority Critical patent/JPS5240973A/en
Publication of JPS5240973A publication Critical patent/JPS5240973A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To control the quantity of bump metal being extruded from the direction where a bonding pressure is applied, on the side of a semiconductor substrate, thereby preventing electrical shorting with other wirings in proximity.
COPYRIGHT: (C)1977,JPO&Japio
JP11661375A 1975-09-26 1975-09-26 Method of connecting semiconductor devices Pending JPS5240973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11661375A JPS5240973A (en) 1975-09-26 1975-09-26 Method of connecting semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11661375A JPS5240973A (en) 1975-09-26 1975-09-26 Method of connecting semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5240973A true JPS5240973A (en) 1977-03-30

Family

ID=14691499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11661375A Pending JPS5240973A (en) 1975-09-26 1975-09-26 Method of connecting semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5240973A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5439117A (en) * 1978-07-10 1979-03-26 Matsushita Electric Ind Co Ltd Musical signal converting device
JPS5439118A (en) * 1978-07-10 1979-03-26 Matsushita Electric Ind Co Ltd Musical sound signal converting device
JPH0196699A (en) * 1987-10-08 1989-04-14 Casio Comput Co Ltd Electronic musical instrument
US5018002A (en) * 1989-07-03 1991-05-21 General Electric Company High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip
US5053851A (en) * 1991-01-14 1991-10-01 International Business Machines Corp. Metal bump for a thermal compression bond and method for making same
US5059553A (en) * 1991-01-14 1991-10-22 Ibm Corporation Metal bump for a thermal compression bond and method for making same
US5518957A (en) * 1991-10-10 1996-05-21 Samsung Electronics Co., Ltd. Method for making a thin profile semiconductor package

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5439117A (en) * 1978-07-10 1979-03-26 Matsushita Electric Ind Co Ltd Musical signal converting device
JPS5439118A (en) * 1978-07-10 1979-03-26 Matsushita Electric Ind Co Ltd Musical sound signal converting device
JPS5735472B2 (en) * 1978-07-10 1982-07-29
JPS5735473B2 (en) * 1978-07-10 1982-07-29
JPH0196699A (en) * 1987-10-08 1989-04-14 Casio Comput Co Ltd Electronic musical instrument
US5018002A (en) * 1989-07-03 1991-05-21 General Electric Company High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip
US5053851A (en) * 1991-01-14 1991-10-01 International Business Machines Corp. Metal bump for a thermal compression bond and method for making same
US5059553A (en) * 1991-01-14 1991-10-22 Ibm Corporation Metal bump for a thermal compression bond and method for making same
US5518957A (en) * 1991-10-10 1996-05-21 Samsung Electronics Co., Ltd. Method for making a thin profile semiconductor package

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