JPS6426139A - Production of moisture sensitive element - Google Patents
Production of moisture sensitive elementInfo
- Publication number
- JPS6426139A JPS6426139A JP18289387A JP18289387A JPS6426139A JP S6426139 A JPS6426139 A JP S6426139A JP 18289387 A JP18289387 A JP 18289387A JP 18289387 A JP18289387 A JP 18289387A JP S6426139 A JPS6426139 A JP S6426139A
- Authority
- JP
- Japan
- Prior art keywords
- porous silicon
- oxidation treatment
- film
- subjected
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
PURPOSE:To obtain a moisture sensitive element which is greatly improved in the characteristic of a change in the resistance value of the element and has a good sensitivity by oxidizing a porous silicon layer. CONSTITUTION:Single crystal silicon is subjected to an anodic oxidation treatment in a hydrogen fluoride soln. to form the porous silicon layer 11 to about 5-40mu on one surface of a single crystal silicon substrate 10. The porous silicon film is subjected to an oxidation treatment by a thermal or chemical method. The thermal oxidation treatment includes a method of heating and oxidizing the film at 200-350 deg.C in a thermal oxidation furnace and the chemical oxidation treatment includes a method of immersing the film in a 30% dilute soln. of nitric acid. Finally, electrodes 12, 13 are respectively formed on the upper side of the porous silicon layer and the rear face of the substrate and terminals are connected thereto. The porous silicon is subjected to the oxidation treatment in order to intensity and stabilize the film quality, since the porous silicon is an active material which is different in film properties from the substrate and is liable to crack and exfoliate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62182893A JP2559682B2 (en) | 1987-07-22 | 1987-07-22 | Method for manufacturing moisture sensitive element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62182893A JP2559682B2 (en) | 1987-07-22 | 1987-07-22 | Method for manufacturing moisture sensitive element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6426139A true JPS6426139A (en) | 1989-01-27 |
JP2559682B2 JP2559682B2 (en) | 1996-12-04 |
Family
ID=16126236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62182893A Expired - Fee Related JP2559682B2 (en) | 1987-07-22 | 1987-07-22 | Method for manufacturing moisture sensitive element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2559682B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6573815B1 (en) | 1999-12-02 | 2003-06-03 | Mitsubishi Denki Kabushiki Kaisha | Circuit breaker |
-
1987
- 1987-07-22 JP JP62182893A patent/JP2559682B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6573815B1 (en) | 1999-12-02 | 2003-06-03 | Mitsubishi Denki Kabushiki Kaisha | Circuit breaker |
Also Published As
Publication number | Publication date |
---|---|
JP2559682B2 (en) | 1996-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |