JPS6424493A - Method for mounting chip component - Google Patents

Method for mounting chip component

Info

Publication number
JPS6424493A
JPS6424493A JP18087187A JP18087187A JPS6424493A JP S6424493 A JPS6424493 A JP S6424493A JP 18087187 A JP18087187 A JP 18087187A JP 18087187 A JP18087187 A JP 18087187A JP S6424493 A JPS6424493 A JP S6424493A
Authority
JP
Japan
Prior art keywords
substrate
hole
chip component
mounting
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18087187A
Other languages
Japanese (ja)
Inventor
Fumihiro Misawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shiojiri Kogyo KK
Original Assignee
Shiojiri Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shiojiri Kogyo KK filed Critical Shiojiri Kogyo KK
Priority to JP18087187A priority Critical patent/JPS6424493A/en
Publication of JPS6424493A publication Critical patent/JPS6424493A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To enable mounting of a large number of chips on a small substrate by a method wherein a hole or a groove is provided on the substrate so as to drop a chip component in it for mounting. CONSTITUTION:A substrate 5 is composed of a two-layered substrate, where an angular hole and a pad 7 are provided on a surface of a first substrate. A through-hole 8 is provided on a second substrate. And, a chip component 3 is dropped in the angular hole 6 and the pad 7 is soldered to one electrode of the chip component 3. In addition, solder is sucked into the through-hole 8 through soldering of the through-hole 8, so that the other electrode of the chip component 3 is soldered for mounting of the component 3. By these processes, a chip is mounted in such a manner as it is dropped in vertically in a hole of a substrate, so that a mounting space can be decreased and a large number of chip components can be mounted on a small substrate. And, as a chip component is put into a hole, a substrate is made to be thinner as a whole.
JP18087187A 1987-07-20 1987-07-20 Method for mounting chip component Pending JPS6424493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18087187A JPS6424493A (en) 1987-07-20 1987-07-20 Method for mounting chip component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18087187A JPS6424493A (en) 1987-07-20 1987-07-20 Method for mounting chip component

Publications (1)

Publication Number Publication Date
JPS6424493A true JPS6424493A (en) 1989-01-26

Family

ID=16090802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18087187A Pending JPS6424493A (en) 1987-07-20 1987-07-20 Method for mounting chip component

Country Status (1)

Country Link
JP (1) JPS6424493A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009081167A (en) * 2007-09-25 2009-04-16 Fujitsu Ltd Wiring board, manufacturing method of wiring board, and apparatus with wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009081167A (en) * 2007-09-25 2009-04-16 Fujitsu Ltd Wiring board, manufacturing method of wiring board, and apparatus with wiring board

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