JPS6424493A - Method for mounting chip component - Google Patents
Method for mounting chip componentInfo
- Publication number
- JPS6424493A JPS6424493A JP18087187A JP18087187A JPS6424493A JP S6424493 A JPS6424493 A JP S6424493A JP 18087187 A JP18087187 A JP 18087187A JP 18087187 A JP18087187 A JP 18087187A JP S6424493 A JPS6424493 A JP S6424493A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hole
- chip component
- mounting
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
PURPOSE:To enable mounting of a large number of chips on a small substrate by a method wherein a hole or a groove is provided on the substrate so as to drop a chip component in it for mounting. CONSTITUTION:A substrate 5 is composed of a two-layered substrate, where an angular hole and a pad 7 are provided on a surface of a first substrate. A through-hole 8 is provided on a second substrate. And, a chip component 3 is dropped in the angular hole 6 and the pad 7 is soldered to one electrode of the chip component 3. In addition, solder is sucked into the through-hole 8 through soldering of the through-hole 8, so that the other electrode of the chip component 3 is soldered for mounting of the component 3. By these processes, a chip is mounted in such a manner as it is dropped in vertically in a hole of a substrate, so that a mounting space can be decreased and a large number of chip components can be mounted on a small substrate. And, as a chip component is put into a hole, a substrate is made to be thinner as a whole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18087187A JPS6424493A (en) | 1987-07-20 | 1987-07-20 | Method for mounting chip component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18087187A JPS6424493A (en) | 1987-07-20 | 1987-07-20 | Method for mounting chip component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6424493A true JPS6424493A (en) | 1989-01-26 |
Family
ID=16090802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18087187A Pending JPS6424493A (en) | 1987-07-20 | 1987-07-20 | Method for mounting chip component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6424493A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009081167A (en) * | 2007-09-25 | 2009-04-16 | Fujitsu Ltd | Wiring board, manufacturing method of wiring board, and apparatus with wiring board |
-
1987
- 1987-07-20 JP JP18087187A patent/JPS6424493A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009081167A (en) * | 2007-09-25 | 2009-04-16 | Fujitsu Ltd | Wiring board, manufacturing method of wiring board, and apparatus with wiring board |
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