JPS6422042A - Vacuum transfer chamber of semiconductor manufacturing equipment - Google Patents

Vacuum transfer chamber of semiconductor manufacturing equipment

Info

Publication number
JPS6422042A
JPS6422042A JP17849087A JP17849087A JPS6422042A JP S6422042 A JPS6422042 A JP S6422042A JP 17849087 A JP17849087 A JP 17849087A JP 17849087 A JP17849087 A JP 17849087A JP S6422042 A JPS6422042 A JP S6422042A
Authority
JP
Japan
Prior art keywords
section
wafer transfer
electrode plates
semiconductor manufacturing
dusts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17849087A
Other languages
Japanese (ja)
Inventor
Takamoto Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP17849087A priority Critical patent/JPS6422042A/en
Publication of JPS6422042A publication Critical patent/JPS6422042A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To improve the yield in the semiconductor manufacturing process by placing in a vacuum chamber electrode plates applied with a high voltage, thereby attracting micro dusts generated in the vacuum chamber with an electrostatic force. CONSTITUTION:Between a processing section 1 and a supply section 3 and a storage section 4 are communicated by a wafer transfer section 2, and a transfer mechanism section 9 for waters is placed in the wafer transfer section 2. Also, the processing section 1, wafer transfer section 2, supply section 3 and storage section 4 are held vacuum. Sandwiching the wafer transfer mechanism section 9, a pair of electrode plates for dust collection 7, 8 are disposed on both sides thereof, and the electrodes 7, 8 are connected to a high-voltage source 5 via cables 6. Accordingly, dusts generating in the vacuum atmosphere of the wafer transfer section 2 are attracted and trapped by the electrode plates 7, 8 utilizing an electrostatic force, thereby preventing the dusts from sticking to a wafer 10.
JP17849087A 1987-07-17 1987-07-17 Vacuum transfer chamber of semiconductor manufacturing equipment Pending JPS6422042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17849087A JPS6422042A (en) 1987-07-17 1987-07-17 Vacuum transfer chamber of semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17849087A JPS6422042A (en) 1987-07-17 1987-07-17 Vacuum transfer chamber of semiconductor manufacturing equipment

Publications (1)

Publication Number Publication Date
JPS6422042A true JPS6422042A (en) 1989-01-25

Family

ID=16049365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17849087A Pending JPS6422042A (en) 1987-07-17 1987-07-17 Vacuum transfer chamber of semiconductor manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS6422042A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05158872A (en) * 1991-12-09 1993-06-25 Mitsubishi Electric Corp Data processor
JPH06232235A (en) * 1993-02-05 1994-08-19 Japan Steel Works Ltd:The Load lock chamber
JP2009023020A (en) * 2007-07-18 2009-02-05 Yaskawa Electric Corp Substrate carrying robot having dust-tight mechanism, and semiconductor manufacturing apparatus having the robot
JP2013008835A (en) * 2011-06-24 2013-01-10 Tokyo Electron Ltd Electric actuator
JP2018037475A (en) * 2016-08-30 2018-03-08 株式会社日立ハイテクマニファクチャ＆サービス Wafer transfer apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62112790A (en) * 1985-11-09 1987-05-23 Anelva Corp Thin film processing device with dust collector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62112790A (en) * 1985-11-09 1987-05-23 Anelva Corp Thin film processing device with dust collector

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05158872A (en) * 1991-12-09 1993-06-25 Mitsubishi Electric Corp Data processor
JPH06232235A (en) * 1993-02-05 1994-08-19 Japan Steel Works Ltd:The Load lock chamber
JP2009023020A (en) * 2007-07-18 2009-02-05 Yaskawa Electric Corp Substrate carrying robot having dust-tight mechanism, and semiconductor manufacturing apparatus having the robot
JP2013008835A (en) * 2011-06-24 2013-01-10 Tokyo Electron Ltd Electric actuator
JP2018037475A (en) * 2016-08-30 2018-03-08 株式会社日立ハイテクマニファクチャ＆サービス Wafer transfer apparatus

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