JPS6422037U - - Google Patents

Info

Publication number
JPS6422037U
JPS6422037U JP11744987U JP11744987U JPS6422037U JP S6422037 U JPS6422037 U JP S6422037U JP 11744987 U JP11744987 U JP 11744987U JP 11744987 U JP11744987 U JP 11744987U JP S6422037 U JPS6422037 U JP S6422037U
Authority
JP
Japan
Prior art keywords
resin
marking
resin layer
view
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11744987U
Other languages
Japanese (ja)
Other versions
JPH041736Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11744987U priority Critical patent/JPH041736Y2/ja
Publication of JPS6422037U publication Critical patent/JPS6422037U/ja
Application granted granted Critical
Publication of JPH041736Y2 publication Critical patent/JPH041736Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この考案の一実施例を示す半導体装
置の斜視図、第２図は、同実施例半導体装置の断
面図、第３図は、標印用フエノール樹脂層を形成
する状態を示す要部拡大斜視図、第４図は、従来
の半導体装置を示す断面図である。 １：集積回路本体、２：エポキシ樹脂モールド
、３：標印用フエノール樹脂層、４：標印部。 Fig. 1 is a perspective view of a semiconductor device showing an embodiment of this invention, Fig. 2 is a sectional view of the semiconductor device of the same embodiment, and Fig. 3 shows a state in which a phenolic resin layer for marking is formed. FIG. 4, an enlarged perspective view of a main part, is a sectional view showing a conventional semiconductor device. 1: Integrated circuit main body, 2: Epoxy resin mold, 3: Phenol resin layer for marking, 4: Marking portion.

Claims (1)

【実用新案登録請求の範囲】 電子回路部を樹脂でカバーした電子部品におい
て、 前記樹脂カバーの表面に、標印用のフエノール
樹脂層を配備したことを特徴とする電子部品。[Claims for Utility Model Registration] An electronic component in which an electronic circuit portion is covered with a resin, characterized in that a phenolic resin layer for marking is provided on the surface of the resin cover.
JP11744987U 1987-07-30 1987-07-30 Expired JPH041736Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11744987U JPH041736Y2 (en) 1987-07-30 1987-07-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11744987U JPH041736Y2 (en) 1987-07-30 1987-07-30

Publications (2)

Publication Number Publication Date
JPS6422037U true JPS6422037U (en) 1989-02-03
JPH041736Y2 JPH041736Y2 (en) 1992-01-21

Family

ID=31360918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11744987U Expired JPH041736Y2 (en) 1987-07-30 1987-07-30

Country Status (1)

Country Link
JP (1) JPH041736Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05306568A (en) * 1992-04-30 1993-11-19 Tostem Sera Kk Fit-in connecting metal siding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05306568A (en) * 1992-04-30 1993-11-19 Tostem Sera Kk Fit-in connecting metal siding

Also Published As

Publication number Publication date
JPH041736Y2 (en) 1992-01-21

Similar Documents

Publication Publication Date Title
JPS6422037U (en)
JPH02106868U (en)
JPH03109393U (en)
JPS6448040U (en)
JPS6052656U (en) circuit board
JPS58164902U (en) hub ornament
JPH0397968U (en)
JPH02125373U (en)
JPS6331570U (en)
JPH0425289U (en)
JPS6147751U (en) Waterproof structure with steering wheel and pads
JPH0463147U (en)
JPS62147352U (en)
JPS6416640U (en)
JPS61182037U (en)
JPS6219745U (en)
JPS63165852U (en)
JPS6252942U (en)
JPS63180992U (en)
JPS61192480U (en)
JPH01173967U (en)
JPS61203578U (en)
JPH01113364U (en)
JPH031475U (en)
JPS63152272U (en)