JPS6219745U - - Google Patents
Info
- Publication number
- JPS6219745U JPS6219745U JP10983185U JP10983185U JPS6219745U JP S6219745 U JPS6219745 U JP S6219745U JP 10983185 U JP10983185 U JP 10983185U JP 10983185 U JP10983185 U JP 10983185U JP S6219745 U JPS6219745 U JP S6219745U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resin layer
- insulating resin
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000001721 transfer moulding Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は他の実施例を示す断面図、第３図は従来例を示
す斜視図、第４図は従来例を示す断面図である。
１……基板、２……絶縁性樹脂層、３……回路
素子、４……周端部。
Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a sectional view showing another embodiment, Fig. 3 is a perspective view showing a conventional example, and Fig. 4 is a sectional view showing a conventional example. . DESCRIPTION OF SYMBOLS 1...Substrate, 2...Insulating resin layer, 3...Circuit element, 4...Peripheral edge part.
Claims (1)
上にトランスフアー・モールドにより絶縁樹脂層
を形成する混成集積回路に於いて、前記基板の周
端を前記絶縁樹脂層の略中間より上側で折曲げ位
置したことを特徴とする混成集積回路。 In a hybrid integrated circuit in which circuit elements, etc. are provided on one principal surface of a substrate, and an insulating resin layer is formed on the substrate by transfer molding, the peripheral edge of the substrate is located above approximately the middle of the insulating resin layer. A hybrid integrated circuit characterized by being bent at a position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10983185U JPS6219745U (en) | 1985-07-18 | 1985-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10983185U JPS6219745U (en) | 1985-07-18 | 1985-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6219745U true JPS6219745U (en) | 1987-02-05 |
Family
ID=30988291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10983185U Pending JPS6219745U (en) | 1985-07-18 | 1985-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6219745U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63265134A (en) * | 1987-01-21 | 1988-11-01 | Naigai Glass Kogyo Kk | Strength measuring apparatus |
-
1985
- 1985-07-18 JP JP10983185U patent/JPS6219745U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63265134A (en) * | 1987-01-21 | 1988-11-01 | Naigai Glass Kogyo Kk | Strength measuring apparatus |