JPS6370486A - Nonelectrolytic plating of copper-clad laminated board - Google Patents
Nonelectrolytic plating of copper-clad laminated boardInfo
- Publication number
- JPS6370486A JPS6370486A JP21453686A JP21453686A JPS6370486A JP S6370486 A JPS6370486 A JP S6370486A JP 21453686 A JP21453686 A JP 21453686A JP 21453686 A JP21453686 A JP 21453686A JP S6370486 A JPS6370486 A JP S6370486A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plating
- jig
- reaction
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 24
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 description 15
- 239000011889 copper foil Substances 0.000 description 5
- 238000005553 drilling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 241000972773 Aulopiformes Species 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 210000000436 anus Anatomy 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 235000019515 salmon Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、穴あけをしだ銅張積層載ヲ多数枚平面状に治
具付けをして、能率良く無を解銅めっきを行う方法に関
する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a method for efficiently performing decopper plating by drilling holes and attaching a jig to a large number of copper-clad laminated sheets in a plane. .
（従来の技術）
印刷配ｌＡ板全製造する場合、銅張積層板を穴あけ金行
った後に無電解銅めっき法によって０゜２〜１．０μｍ
程度の銅を析出させた後肛気周めっきを行い、テンティ
ング法等で回路謔工を行う方法が一般に行わｎろ。(Prior art) When manufacturing the entire printed laminated A board, the copper clad laminate is drilled and then plated with a thickness of 0°2 to 1.0 μm by electroless copper plating.
Generally, after a certain amount of copper has been deposited, plating is carried out on the anus, and circuit construction is performed using a tenting method or the like.
この方法を行う場合、数枚以上の穴あけした銅張積層板
を平面状に治具付げをし、めっき触媒としてパラジウム
付与を行い、次いで無電解銅めっきを行う方法が一般に
行われる。When carrying out this method, a method is generally carried out in which several or more perforated copper-clad laminates are attached to a planar jig, palladium is applied as a plating catalyst, and then electroless copper plating is performed.
（発明が解決【５ようとする問題点）
前記無電解銅めっきにおいて、めっき液の反応性が弱い
場合には銅が十分に析出せず茶褐色や紫色の酸化銅色を
呈することがある。(Problems to be Solved by the Invention [5]) In the electroless copper plating, if the reactivity of the plating solution is weak, copper may not be sufficiently precipitated and a brown or purple copper oxide color may appear.
一方、無電解銅めっきの反応が開始されると、基板表面
に電位差が生ずることを利用して、従来は反応が始まっ
ている治具と治まって、いない治具と全結線し【めっき
反応を励起する方法が試みられている。しかし、この方
法は、治具と治具を結線する煩わしさと、最初にめっき
しようとする治具がめつき反応全開始しない場合は手の
打ちようがないという問題がある。On the other hand, when the electroless copper plating reaction starts, a potential difference is created on the substrate surface. Excitation methods are being tried. However, this method has problems in that it is troublesome to connect the jigs and that there is nothing that can be done if the plating reaction does not fully start on the jig to be plated first.
（問題点を解決するための手段）
本発明者は、以上述べた問題点にかんがみて種々検討の
結果本発明を得た。(Means for Solving the Problems) In view of the problems described above, the present inventors have obtained the present invention as a result of various studies.
本発明は、治具の中にＳ電解銅めっきの反応がおき易い
基板を入ｎでおき、このＭ板がめつき反応を開始すると
、そのめっき反応の起電力によって電位差を生じ、他の
通常の穴あけ銅張積層板も同様にめっき反応を開始する
特性を利用する方法である。In the present invention, a substrate on which S electrolytic copper plating reaction easily occurs is placed in a jig, and when this M plate starts a plating reaction, a potential difference is generated by the electromotive force of the plating reaction, and other ordinary A hole-drilled copper-clad laminate is also a method that utilizes the property of initiating a plating reaction.
この場合、治具と銅張積／＃鈑は始具のつめと銅箔とに
よって電気的′／Ｃ接続しているから、１枚の基板に無
電解銅めっき反応が始まると電位差によって全基板が同
時に反応することとなる。In this case, the jig and the copper plating plate are electrically connected by the pawl of the starting tool and the copper foil, so when the electroless copper plating reaction starts on one board, the electrical potential difference causes the entire board to be plated. will react at the same time.
本発明における無’、Ｊｗ１銅めっき反応がおき易い基
板は、前処理工程で付着される触媒であるパラジウムの
吸着量が多い奉８てあって銅箔全エツチングによって除
去した基鈑などである。In the present invention, the substrate on which the Jw1 copper plating reaction easily occurs is a substrate that has a large amount of adsorbed palladium, which is a catalyst, deposited in the pretreatment step, and is removed by etching the entire copper foil.
（作用）
無電解銅めっきの反応は欠配のように進み、パラジウム
触媒により″！：反応が始まる。(Function) The reaction of electroless copper plating proceeds like a defect, and the palladium catalyst starts the reaction.
Ｃｕ” ＋ ２ ＨＣＨＯ＋ ４０ ）ｒ’ →（：
ｕ ＋ ２ＨＣＯＯＨ＋Ｈ２０＋Ｈｚ基鈑のパラジウム
吸着量が多いほど、無電解銅めっきの反応性が高（なる
。Cu” + 2 HCHO+ 40 )r' →(:
The greater the amount of palladium adsorbed on the u+2HCOOH+H20+Hz base plate, the higher the reactivity of electroless copper plating.
無１１！解銅めりぎ反応がおぎると電位差を生ずるから
、基板全治共付けし電気的に受状しておくと、１枚の基
板にめっき反応が始筐ろと全糸ｆ［波及してめっき反応
が行わ２′Ｌることになる。No 11! When the copper decomposition reaction finishes, a potential difference is generated, so if the entire board is attached and electrically received, the plating reaction will spread to the beginning and all the threads on one board. will be performed and the result will be 2'L.
一方、銅張積層板の銅箔を除いた基板は、パラジウム吸
着量が銅箔表面の通２倍であって、無電解銅めっき反応
が進行しやすい。不発明の方法ｔＸ電気銅めつきに先豆
っパネルめっきのみでなく、無電解銅めっきのみによる
厚付けめっきにも適用し得る。On the other hand, in the substrate of the copper-clad laminate excluding the copper foil, the amount of palladium adsorbed is twice that of the surface of the copper foil, and the electroless copper plating reaction easily progresses. The uninvented method tX electrolytic copper plating can be applied not only to prefabricated panel plating but also to thick plating using only electroless copper plating.
実施例
第１図は、基板全治具に取付けた乎面囚を示す。めっき
用治具１の正方形枠（１ｍＸ１ｒｒ＋）に正方形（３３
０市Ｘ３３０１１１１１１）基板３を９枚取付け、つめ
２によって接続固定する。この子図状に治具付ピした基
板を無電解銅めっき酸槽（容＠２ｏｏａＢに浸漬する。Embodiment FIG. 1 shows the surface cap attached to the entire board jig. A square (33
0 city The board with the jig attached is immersed in an electroless copper plating acid bath (capacity @2ooaB).
めっき液処理の前処理として、パラジウム触媒付与を行
り１こ。触媒として増感剤Ｈ５２０１Ｂ（日竺化底工業
■商品名）を使用した６めっき液は無ＮＭ銅めっき液（
日立化成工業ＨｉＣＵＳＴ−２０１）′ｆ：便用シタ。As a pretreatment for plating solution treatment, a palladium catalyst was applied. The 6 plating solution using the sensitizer H5201B (Nippon Kasoko Kogyo brand name) as a catalyst is a NM-free copper plating solution (
Hitachi Chemical HiCUST-201)'f: Toilet seat.
めっき液の温度は２５±１℃に調節した。この温度調節
は重要であって、例えば１７℃で１５分めっき処理をし
ても正常な銅析出がない。The temperature of the plating solution was adjusted to 25±1°C. This temperature control is important; for example, even if plating is performed at 17° C. for 15 minutes, normal copper precipitation will not occur.
めっき反応全促進する基板は、銅張積層板の銅箔をエツ
チングによって除去し、エポキシ樹脂面が表面１ｃ露出
した状態とする。The substrate on which the plating reaction is fully promoted is obtained by removing the copper foil of the copper-clad laminate by etching, so that the epoxy resin surface is exposed on the surface 1c.
第１図に示すように、めっき反応全促進する基板４全１
枚、他の８枚は通常の穴あけ銅張積層板として９枚を治
具にっめ２に裏って固定した。触媒処理後に１５分めっ
きした。その結果、前記８：板４のみでなく他の８枚の
銅張槓４層板も全部正常にめっき反応が進み、全体がサ
ーモンピンクケ呈した。As shown in FIG. 1, a substrate 4 for promoting the entire plating reaction
The other 8 sheets were used as ordinary perforated copper-clad laminates, and 9 sheets were fixed on the back of the jig 2. Plating was carried out for 15 minutes after the catalyst treatment. As a result, the plating reaction progressed normally not only on the above-mentioned 8: Plate 4 but also on all the other eight copper-clad 4-layer plates, and the entire plate exhibited salmon pink flaking.
（発明の効果）
本発明によって、穴あけ金行った銅張積層板の無電解銅
めっきを円滑に能率良く行いうろこととなった。(Effects of the Invention) According to the present invention, electroless copper plating of a copper-clad laminate that has undergone drilling can be performed smoothly and efficiently.
第１図は、銅張積層板全治具に取付けた状態を示す正面
図である。
１・・・・・・めっき用治具、２・・・・・・治具のつ
め、６・・・・・・銅張積層板、４・・・・・・めっき
反３？促進する基板。FIG. 1 is a front view showing the copper-clad laminate fully attached to the jig. 1... Plating jig, 2... Jig claw, 6... Copper clad laminate, 4... Plating anti-3? Promoting board.
Claims (1)
銅張積層板を平面状に治具付けして無電解銅めつきをす
る工程において、前記複数枚の銅張積層板のうち１枚を
パラジウム触媒を良く吸着せしめた基板に代えて治具付
けし、かつ該各治具付け板を相互に導通状態とすること
を特徴とする無電解銅めつき方法。1. In the process of manufacturing printed wiring boards, one of the copper-clad laminates is coated with palladium in the process of attaching a jig to a planar copper-clad laminate that has been drilled with multiple holes and electroless copper plating. An electroless copper plating method characterized in that a jig is attached in place of a substrate to which a catalyst is well adsorbed, and the respective jig attachment plates are brought into electrical continuity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21453686A JPS6370486A (en) | 1986-09-11 | 1986-09-11 | Nonelectrolytic plating of copper-clad laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21453686A JPS6370486A (en) | 1986-09-11 | 1986-09-11 | Nonelectrolytic plating of copper-clad laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6370486A true JPS6370486A (en) | 1988-03-30 |
Family
ID=16657356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21453686A Pending JPS6370486A (en) | 1986-09-11 | 1986-09-11 | Nonelectrolytic plating of copper-clad laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6370486A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003091477A1 (en) * | 2002-04-23 | 2003-11-06 | Agency For Science, Technology And Research | Method for electroless deposition of a metal layer on selected portions of a substrate |
-
1986
- 1986-09-11 JP JP21453686A patent/JPS6370486A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003091477A1 (en) * | 2002-04-23 | 2003-11-06 | Agency For Science, Technology And Research | Method for electroless deposition of a metal layer on selected portions of a substrate |
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