JPS6367121A - Compression molding equipment - Google Patents
Compression molding equipmentInfo
- Publication number
- JPS6367121A JPS6367121A JP21231786A JP21231786A JPS6367121A JP S6367121 A JPS6367121 A JP S6367121A JP 21231786 A JP21231786 A JP 21231786A JP 21231786 A JP21231786 A JP 21231786A JP S6367121 A JPS6367121 A JP S6367121A
- Authority
- JP
- Japan
- Prior art keywords
- heating
- molding
- temperature
- mold
- molding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000748 compression moulding Methods 0.000 title claims description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 45
- 239000012778 molding material Substances 0.000 claims abstract description 16
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 239000012212 insulator Substances 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims description 2
- 239000010409 thin film Substances 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000011810 insulating material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009684 ion beam mixing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は圧縮成形装置に係り、特にプラスチック等の樹
脂成形品を製造するのに好適な圧縮成形品を製造するの
に好適な圧縮成形装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a compression molding device, and particularly to a compression molding device suitable for manufacturing compression molded products suitable for manufacturing resin molded products such as plastics. Regarding.
圧縮成形を行う場合には、成形材料を加熱する必要があ
る。従来用いられている圧縮成形装置においては、ヒー
タにより成形型の全体を加熱するようになっている（オ
ーム社発行、プラスチック工学、第３０７頁、第３１図
参照）。When performing compression molding, it is necessary to heat the molding material. In conventional compression molding apparatuses, the entire mold is heated by a heater (see Figure 31, Plastic Engineering, published by Ohm Co., Ltd., p. 307).
ヒータにより成形型全体を加熱する従来装置にあっては
、全体を加熱するだけの熱量を必要とすることから大き
な消費電力を必要とし、また微妙な温度制御が困難であ
る。微妙な温度制御が困難であることは成形材料に対し
て最適温度を与えにくいことを意味し、したがって例え
ば熱硬化樹脂を成形材料とする場合にあっては硬化不十
分な状態となったり、逆に材料の分解を招来して一定の
高品質が得られないこととなる。Conventional devices that heat the entire mold using a heater require a large amount of heat to heat the entire mold, which requires large power consumption and makes delicate temperature control difficult. Difficulty in delicate temperature control means that it is difficult to give the optimum temperature to the molding material. Therefore, for example, when thermosetting resin is used as the molding material, it may not be sufficiently cured or vice versa. This may lead to decomposition of the material, making it impossible to obtain a certain level of high quality.
そこで、本発明は温度制御が容易であり、かつ、消費電
力を達成しうる圧縮成形装置を提供することを目的とす
る。Therefore, an object of the present invention is to provide a compression molding apparatus that can easily control temperature and achieve low power consumption.
上記問題点を解決し、かつ、上記目的を達成するために
、本発明は、成形材料を成形型内に充填し、当該充填さ
れた成形材料を圧縮することにより成形を行う圧縮成形
装置において、前記成形型の成形材料と接する壁面に設
けられた膜状発熱体と、この膜状発熱体を加熱する加熱
手段とを備えたことを特徴とするものである。In order to solve the above problems and achieve the above objects, the present invention provides a compression molding apparatus that performs molding by filling a mold with a molding material and compressing the filled molding material. The present invention is characterized by comprising a film-like heating element provided on the wall surface of the mold that is in contact with the molding material, and a heating means for heating the film-like heating element.
〔作用〕
上記本発明の構成によれば、成形型の成形材料と接する
壁面に膜状発熱体を設け、この膜状発熱体を加熱手段に
より加熱するようにしたものであるため、不必要に成形
型を加熱することなく、また加熱手段による供給熱量の
調整により任意に温度制御が可能である。よって、省消
費電力を達成し、かつ温度制御による成形材料に対する
最適温度を付与することができるため、一定の高品質成
形品を製造することができる。[Function] According to the configuration of the present invention described above, a film-like heating element is provided on the wall surface of the mold that comes into contact with the molding material, and this film-like heating element is heated by the heating means, so that unnecessary The temperature can be arbitrarily controlled by adjusting the amount of heat supplied by the heating means without heating the mold. Therefore, it is possible to achieve power saving and provide the optimum temperature to the molding material through temperature control, thereby making it possible to manufacture molded products of a constant high quality.
次に、本発明の実施例を図面に基づいて説明する。 Next, embodiments of the present invention will be described based on the drawings.
第１の実施例
第１図に、第１の実施例を示す。この第１の実施例は誘
導加熱を利用したものである。すなわち、第１図におい
て、成形型は型本体１およびふた２から成り、成形品３
は成形型の内面形状通りに成形される。型本体１および
ふた２は絶縁物で、それぞれの内面には導電性材料から
成る薄膜層４が形成されている。成形型の周囲には加熱
コイル５が設けられており、加熱コイル５に高周波電流
を流すことにより、薄膜Ｎ４には渦電流が生じて発熱す
る。First Embodiment FIG. 1 shows a first embodiment. This first embodiment utilizes induction heating. That is, in FIG. 1, the mold consists of a mold body 1 and a lid 2, and a molded product 3.
is molded according to the inner surface shape of the mold. The mold body 1 and the lid 2 are made of insulators, and a thin film layer 4 made of a conductive material is formed on the inner surface of each. A heating coil 5 is provided around the mold, and by passing a high frequency current through the heating coil 5, an eddy current is generated in the thin film N4 and heat is generated.
以上の構成により、熱容量の大きい成形型全体を加熱す
ることな（成形品３を温度上昇させることができる。ま
た、発熱量は加熱コイル５への高周波電流量を制御する
ことにより、任意の温度に調節が可能である。With the above configuration, it is possible to raise the temperature of the molded product 3 without heating the entire mold having a large heat capacity.Also, by controlling the amount of high-frequency current to the heating coil 5, the amount of heat generated can be adjusted to any desired temperature. It can be adjusted to
薄膜層４の形成には、イオンビームミキシングによる方
法が有効であり、その原理を第３図に示す、型１１はホ
ルダ１２に取付けられ、被処理面に対抗する位置にイオ
ン源１６．下部に蒸発器１４が設けられている。蒸発粒
子１３を型１１に蒸着させるとともに、イオンビーム１
５を照射すると、蒸発粒子１３とイオンビーム１５で決
まる物質の薄膜を型１１の表面に強固な付着力をもって
形成することができる。この現象は非熱平衡プロセスで
あり、任意の組成をもつ新物質の合成が容易であり、膜
厚の制御もサブミクロンオーダまで自由にできるので、
必要な物性をもったＮＩＩＩ層４の形成が可能である。A method using ion beam mixing is effective for forming the thin film layer 4, and the principle thereof is shown in FIG. 3. A mold 11 is attached to a holder 12, and an ion source 16. An evaporator 14 is provided at the bottom. While depositing the evaporated particles 13 on the mold 11, the ion beam 1
5, a thin film of a substance determined by the evaporated particles 13 and the ion beam 15 can be formed on the surface of the mold 11 with strong adhesion. This phenomenon is a non-thermal equilibrium process, and it is easy to synthesize new substances with arbitrary compositions, and the film thickness can be freely controlled down to the submicron order.
It is possible to form the NIII layer 4 with the necessary physical properties.
第２の実施例
次に、第２図に第２の実施例を示す。この実施例は抵抗
加熱を利用したものである。すなわち、第２図において
、型本体１およびふた２は絶縁物であり、薄膜層４は抵
抗体からなる。薄膜層４には端子６ａ、６ｂが接続され
ており、これらの端子６ａ、６ｂ間に電圧を印加して通
電することにより薄膜層４にジュール熱が発生する。Second Embodiment Next, a second embodiment is shown in FIG. This embodiment utilizes resistance heating. That is, in FIG. 2, the mold body 1 and the lid 2 are insulators, and the thin film layer 4 is made of a resistor. Terminals 6a and 6b are connected to the thin film layer 4, and Joule heat is generated in the thin film layer 4 by applying a voltage between these terminals 6a and 6b to conduct electricity.
この構成により、熱容量の大きい成形型全体を加熱する
ことなく成形品３の温度を上昇させることができる。ま
た、加熱温度は薄膜層４への通電電流を制御することに
より任意の温度に調整することができ、成形材料の最適
加熱温度に調節しうる。なお、薄膜層４の形成方法は第
３図と同様でよい。With this configuration, the temperature of the molded product 3 can be increased without heating the entire mold having a large heat capacity. Further, the heating temperature can be adjusted to an arbitrary temperature by controlling the current applied to the thin film layer 4, and can be adjusted to the optimum heating temperature for the molding material. Note that the method for forming the thin film layer 4 may be the same as that shown in FIG.
第２匠
以上の実施例の他に、誘電加熱を利用したものも実施可
能である。すなわち、図示しないが、型本体１およびふ
た２を導電材料で形成し、薄膜層４を高誘電物質（例え
ば、セラミック等）により形成する。そして、成形型全
体を密閉空間内に配置して外部より高周波電解をかける
ようにする。In addition to the embodiments of the second design and above, it is also possible to use dielectric heating. That is, although not shown, the mold body 1 and the lid 2 are made of a conductive material, and the thin film layer 4 is made of a high dielectric material (eg, ceramic, etc.). Then, the entire mold is placed in a closed space, and high-frequency electrolysis is applied from the outside.
この高周波電解により高誘電物質の薄膜層４の誘電損失
により発熱が生じる。This high frequency electrolysis generates heat due to dielectric loss in the thin film layer 4 of high dielectric material.
この構成によって成形品３を加熱することができる。ま
た、成形品３の加熱温度は高周波電界を制御することに
より、任意の温度に調節することができる。なお、薄膜
層４の形成方法は第３図と同様である。This configuration allows the molded product 3 to be heated. Furthermore, the heating temperature of the molded product 3 can be adjusted to any desired temperature by controlling the high frequency electric field. Note that the method for forming the thin film layer 4 is the same as that shown in FIG.
以上述べたように、本発明によれば、成形型の成形材料
と接する壁面に膜状発熱体を設け、この膜状発熱体と加
熱手段により加熱するようにしたものであるため、不必
要に成形型を加熱することなく、また加熱手段による供
給熱量の調節により任意に温度制御が可能である。よっ
て、省消費電力を達成し、かつ温度制御による成形材料
に対する最適温度を付与することができるため、一定の
高品質成形品を製造することができる。As described above, according to the present invention, a film-like heating element is provided on the wall surface of the mold that is in contact with the molding material, and heating is performed by the film-like heating element and the heating means. The temperature can be arbitrarily controlled by adjusting the amount of heat supplied by the heating means without heating the mold. Therefore, it is possible to achieve power saving and provide the optimum temperature to the molding material through temperature control, thereby making it possible to manufacture molded products of a constant high quality.
第１図は本発明の第１の実施例を示す断面図、第２図は
第２の実施例を示す断面図、第３図は薄膜層の形成方法
を示す断面図である。
１・・・型本体、２・・・ふた、３・・・成形品、４・
・・薄膜層、５・・・加熱コイル、６ａ、６ｂ・・・端
子。FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a sectional view showing a second embodiment, and FIG. 3 is a sectional view showing a method of forming a thin film layer. 1... Mold body, 2... Lid, 3... Molded product, 4...
... Thin film layer, 5... Heating coil, 6a, 6b... Terminal.
Claims (1)
材料を圧縮することにより成形を行う圧縮成形装置にお
いて、 前記成形型の成形材料と接する壁面に設けられた膜状発
熱体と、この膜状発熱体を加熱する加熱手段とを備えた
ことを特徴とする圧縮成形装置。 ２、特許請求の範囲第１項記載の装置において、成形型
は絶縁物、膜状発熱体は抵抗体、加熱手段は前記膜状発
熱体に電流を通電する通電装置であることを特徴とする
圧縮成形装置。 ３、特許請求の範囲第１項記載の装置において、成形型
は絶縁物、膜状発熱体は導電体、加熱手段は前記導電体
に高周波磁界を与える誘導加熱装置であることを特徴と
する圧縮成形装置。 ４、特許請求の範囲第１項記載の装置において、成形型
は導電体、膜状発熱体は高誘電物質、加熱手段は前記膜
状発熱体に高周波電界を与える誘電加熱装置であること
を特徴とする圧縮成形装置。[Claims] 1. In a compression molding device that performs molding by filling a mold with a molding material and compressing the filled molding material, a molding device provided on a wall surface of the molding mold that is in contact with the molding material. A compression molding apparatus comprising a film-like heating element and a heating means for heating the film-like heating element. 2. The apparatus according to claim 1, characterized in that the mold is an insulator, the film-like heating element is a resistor, and the heating means is an energizing device that supplies current to the film-like heating element. Compression molding equipment. 3. The apparatus according to claim 1, wherein the mold is an insulator, the film-like heating element is a conductor, and the heating means is an induction heating device that applies a high-frequency magnetic field to the conductor. Molding equipment. 4. The apparatus according to claim 1, wherein the mold is a conductor, the film-like heating element is a high dielectric material, and the heating means is a dielectric heating device that applies a high-frequency electric field to the film-like heating element. Compression molding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21231786A JPS6367121A (en) | 1986-09-09 | 1986-09-09 | Compression molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21231786A JPS6367121A (en) | 1986-09-09 | 1986-09-09 | Compression molding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367121A true JPS6367121A (en) | 1988-03-25 |
Family
ID=16620545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21231786A Pending JPS6367121A (en) | 1986-09-09 | 1986-09-09 | Compression molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367121A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02194925A (en) * | 1989-01-24 | 1990-08-01 | Sekisui Chem Co Ltd | Method for processing tip of resin tube |
| JPH04173313A (en) * | 1990-11-07 | 1992-06-22 | Sanshu Mold:Kk | Mold for injection molding and injection molding method using said mold |
| US5837183A (en) * | 1996-03-11 | 1998-11-17 | Bridgestone Sports Co., Ltd. | Golf ball molding method and apparatus |
-
1986
- 1986-09-09 JP JP21231786A patent/JPS6367121A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02194925A (en) * | 1989-01-24 | 1990-08-01 | Sekisui Chem Co Ltd | Method for processing tip of resin tube |
| JPH04173313A (en) * | 1990-11-07 | 1992-06-22 | Sanshu Mold:Kk | Mold for injection molding and injection molding method using said mold |
| US5837183A (en) * | 1996-03-11 | 1998-11-17 | Bridgestone Sports Co., Ltd. | Golf ball molding method and apparatus |
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